Abstract: A device includes an interposer, which includes a substrate having a top surface. An interconnect structure is formed over the top surface of the substrate, wherein the interconnect structure includes at least one dielectric layer, and metal features in the at least one dielectric layer. A plurality of through-substrate vias (TSVs) is in the substrate and electrically coupled to the interconnect structure. A first die is over and bonded onto the interposer. A second die is bonded onto the interposer, wherein the second die is under the interconnect structure.

Abstract: A fastener includes a main body, a light guide, and a threaded securing member. The light guide is fit over the main body. The main body with the light guide thereon is fit into a mounting hole of a mounting plate and the threaded securing member engages a threaded section of the main body, whereby a top retention portion of the main body and the threaded securing member together establish abutting engagement that securely fixes the main body to the mounting hole. A light source unit is arranged in the threaded securing member and connected to a power source. Illuminators are mounted on the light source unit may give off light that is guided by the light guide to emit through a light emission portion of the light guide. Thus, the light emission portion of the main body may serve as a lighting ring for warning or indication purposes.