Patents by Inventor Jing Tsai
Jing Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240371954Abstract: The present disclosure provides a semiconductor device and a method of manufacturing the same. The semiconductor device includes a substrate, an active region on the substrate, and a first transistor having a gate structure, a source conductor, and a drain conductor disposed on the active region, wherein the drain conductor and the source conductor are disposed on opposite sides of the gate structure, and the source conductor is shorter than the drain conductor.Type: ApplicationFiled: May 7, 2023Publication date: November 7, 2024Inventors: WAN-LIN TSAI, CLEMENT HSINGJEN WANN, YI-JING LI, I-SHENG CHEN, SHIH-CHUN FU, KAI-QIANG WEN
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Publication number: 20240339356Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a gate electrode layer formed over a substrate, and a first insulating capping feature formed over the gate electrode layer. The semiconductor device structure includes a source/drain contact structure formed adjacent to the gate electrode layer and a second insulating capping feature formed over the source/drain contact structure. The second insulating capping feature and the first insulating capping feature are made of different materials, and an air gap directly below and in direct contact with the second insulating capping feature.Type: ApplicationFiled: June 17, 2024Publication date: October 10, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Kuo-Chiang TSAI, Fu-Hsiang SU, Ke-Jing YU, Jyh-Huei CHEN
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Publication number: 20240290728Abstract: An electronic package and a manufacturing method thereof are provided, in which a cover is disposed on a carrier structure having an electronic element, and the electronic element is covered by the cover. A magnetic conductive member is arranged between the cover and the electronic element, and an air gap is formed between the magnetic conductive member and the cover to enhance the shielding effect of the electronic package.Type: ApplicationFiled: June 14, 2023Publication date: August 29, 2024Inventors: Wen-Jung TSAI, Chih-Hsien CHIU, Chien-Cheng LIN, Ming-Fan TSAI, Cheng-You JENG, Hui-Jing CHANG
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Patent number: 12040225Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a gate electrode layer formed over a substrate, and a conductive capping feature formed on and in direct contact with the gate electrode layer. The semiconductor device structure includes a source/drain (S/D) contact structure formed over the substrate and adjacent to the gate electrode layer, and an air gap is adjacent to the S/D contact structure, and the air gap is lower than the conductive capping feature.Type: GrantFiled: June 21, 2022Date of Patent: July 16, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Kuo-Chiang Tsai, Fu-Hsiang Su, Ke-Jing Yu, Jyh-Huei Chen
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Patent number: 8763320Abstract: A dual-core self-centering buckling-restrained brace includes a core unit, a restraining unit clamping the core unit therein, a middle sleeve disposed around the an energy dissipating section of the core unit and the restraining unit and having an end welded to one end of the core unit, an outer sleeve disposed around the middle sleeve and having an end welded to the other end of the core unit, two inner plates disposed respectively at two ends of the restraining unit, two outer plates disposed respectively at two ends of each of the middle sleeve and said outer sleeve, at least one first tensing member connecting the first inner plate to the second outer plate, and at least one second tensioning element connecting the first outer plate to the second inner plate.Type: GrantFiled: September 6, 2013Date of Patent: July 1, 2014Assignee: National Applied Research LaboratoriesInventors: Chung-Che Chou, Ping-Ting Chung, Wen-Jing Tsai
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Patent number: 8206104Abstract: A fan frame structure includes a plastic frame and a metal fixing frame, in which at least two support arms are disposed on the rim of the fixing frame and extended outwardly therefrom, the outwardly extended distance of each support arm shall be beyond the range of an accommodation space of the frame, the portion of the support arm beyond the accommodation space in integrally enclosed by the plastic material of the frame.Type: GrantFiled: December 28, 2007Date of Patent: June 26, 2012Assignee: Sunonwealth Electric Machine Industry Co., Ltd.Inventors: Alex Horng, Jai-Jing Tsai
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Publication number: 20090142190Abstract: The present invention relates to a fan frame structure including a plastic frame and a metal fixing frame, in which at least two support arms are disposed on the rim of the fixing frame and extended outwardly therefrom, the outwardly extended distance of each support arm shall be beyond the range of an accommodation space of the frame, the portion of the support arm beyond the accommodation space in integrally enclosed by the plastic material of the frame. Therefore, the present invention not only significantly lowers the material cost, but also produces a variety of products in coordination with various specifications of fixing frame by using a single injection mold for the frame to save the mold cost.Type: ApplicationFiled: December 28, 2007Publication date: June 4, 2009Applicant: Sunonwealth Electric Machine Industry Co., Ltd.Inventors: Alex Horng, Jai-Jing Tsai
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Publication number: 20070080476Abstract: The present invention provides a method for manufacturing ethylene-vinyl alcohol copolymer pellets, which comprises passing a solution of ethylene-vinyl alcohol copolymer through a die plate of an extruder and cutting into pellets while cooling the ethylene-vinyl alcohol copolymer pellets by a coagulating fluid under flowing, and then charging into a solid-liquid separating device to separate the ethylene-vinyl alcohol copolymer pellet. According to the method of the present invention, it can produce pellets continuously in a stable manner and ethylene-vinyl alcohol copolymer pellets having uniform size and shape can be obtained.Type: ApplicationFiled: March 31, 2004Publication date: April 12, 2007Inventors: Jing Tsai, Li Lin, Huan Chang, Kuang Fan, Weng Lin, Sheng Lin
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Publication number: 20050228129Abstract: The present invention relates to a method for increasing the heat-resistant of ethylene-vinyl alcohol copolymer (EVOH), the method is characterized by using a mixture of acetic acid, magnesium dihydrogen phosphate, and potassium dihydrogen phosphate at a certain ratio as an acid-treating solution in the acid-treating procedure of a process for preparing EVOH. The EVOH produced by the method of the present invention exhibits an excellent heat-resistance and does not become yellowing attributed to the elevated processing temperature. Also, the EVOH generated by the method of the present invention exhibits a uniform heat-resistance since the additives are dispersed evenly in the EVOH.Type: ApplicationFiled: June 20, 2003Publication date: October 13, 2005Applicant: Chang Chun Petrochemical Co., Ltd.Inventors: Jing Tsai, Li Lin, Huan Chang, Kuang Fan, Weng Lin
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Publication number: 20050215733Abstract: A process for continuously preparing ethylene-vinyl acetate (EVAc) copolymer, by subjecting ethylene and vinyl acetate to a solution polymerization by introducing the gaseous phase of the polymerization reaction into an impurity scrubbing column and washing the gas phase with a solvent used in the reaction, then recycling it into the reaction system, thereby impurity generated in the reaction will be removed. A reactive system having a reaction tank for co-polymerizing ethylene with vinyl acetate, an ethylene recovering tower connected with the bottom of the reaction tank, a line connecting with the bottom of the recovering tower for recovering ethylene-vinyl acetate copolymer; and an impurity scrubbing column connecting with the top of the reaction tank for removing impurity generated in the polymerization reaction.Type: ApplicationFiled: July 1, 2003Publication date: September 29, 2005Applicant: Chang Chun Petrochemical Co., Ltd.Inventors: Jing Tsai, Li Lin, Huan Chang, Kuang Fan, Weng Lin
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Publication number: 20050079077Abstract: A reversible inflation system allowing a single pump to be used both for inflation and deflation of the air bladder. This embodiment of the inflation system includes a pump with an inlet and an outlet ports and a pump housing having two filling and venting valves. The pump is movably mounted in the pump housing so that the pump can move axially between two locations in the pump housing. In one of the locations, the pump ports align with the housing valves to create an air path that inflates the bladder. In the other location, the pump ports align with the housing valves to create an air path that deflates the bladder.Type: ApplicationFiled: June 7, 2004Publication date: April 14, 2005Inventors: Jing Tsai, Michael Kehrmann