Patents by Inventor Jing Tsai

Jing Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240371954
    Abstract: The present disclosure provides a semiconductor device and a method of manufacturing the same. The semiconductor device includes a substrate, an active region on the substrate, and a first transistor having a gate structure, a source conductor, and a drain conductor disposed on the active region, wherein the drain conductor and the source conductor are disposed on opposite sides of the gate structure, and the source conductor is shorter than the drain conductor.
    Type: Application
    Filed: May 7, 2023
    Publication date: November 7, 2024
    Inventors: WAN-LIN TSAI, CLEMENT HSINGJEN WANN, YI-JING LI, I-SHENG CHEN, SHIH-CHUN FU, KAI-QIANG WEN
  • Publication number: 20240339356
    Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a gate electrode layer formed over a substrate, and a first insulating capping feature formed over the gate electrode layer. The semiconductor device structure includes a source/drain contact structure formed adjacent to the gate electrode layer and a second insulating capping feature formed over the source/drain contact structure. The second insulating capping feature and the first insulating capping feature are made of different materials, and an air gap directly below and in direct contact with the second insulating capping feature.
    Type: Application
    Filed: June 17, 2024
    Publication date: October 10, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kuo-Chiang TSAI, Fu-Hsiang SU, Ke-Jing YU, Jyh-Huei CHEN
  • Publication number: 20240290728
    Abstract: An electronic package and a manufacturing method thereof are provided, in which a cover is disposed on a carrier structure having an electronic element, and the electronic element is covered by the cover. A magnetic conductive member is arranged between the cover and the electronic element, and an air gap is formed between the magnetic conductive member and the cover to enhance the shielding effect of the electronic package.
    Type: Application
    Filed: June 14, 2023
    Publication date: August 29, 2024
    Inventors: Wen-Jung TSAI, Chih-Hsien CHIU, Chien-Cheng LIN, Ming-Fan TSAI, Cheng-You JENG, Hui-Jing CHANG
  • Patent number: 12040225
    Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a gate electrode layer formed over a substrate, and a conductive capping feature formed on and in direct contact with the gate electrode layer. The semiconductor device structure includes a source/drain (S/D) contact structure formed over the substrate and adjacent to the gate electrode layer, and an air gap is adjacent to the S/D contact structure, and the air gap is lower than the conductive capping feature.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: July 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kuo-Chiang Tsai, Fu-Hsiang Su, Ke-Jing Yu, Jyh-Huei Chen
  • Patent number: 8763320
    Abstract: A dual-core self-centering buckling-restrained brace includes a core unit, a restraining unit clamping the core unit therein, a middle sleeve disposed around the an energy dissipating section of the core unit and the restraining unit and having an end welded to one end of the core unit, an outer sleeve disposed around the middle sleeve and having an end welded to the other end of the core unit, two inner plates disposed respectively at two ends of the restraining unit, two outer plates disposed respectively at two ends of each of the middle sleeve and said outer sleeve, at least one first tensing member connecting the first inner plate to the second outer plate, and at least one second tensioning element connecting the first outer plate to the second inner plate.
    Type: Grant
    Filed: September 6, 2013
    Date of Patent: July 1, 2014
    Assignee: National Applied Research Laboratories
    Inventors: Chung-Che Chou, Ping-Ting Chung, Wen-Jing Tsai
  • Patent number: 8206104
    Abstract: A fan frame structure includes a plastic frame and a metal fixing frame, in which at least two support arms are disposed on the rim of the fixing frame and extended outwardly therefrom, the outwardly extended distance of each support arm shall be beyond the range of an accommodation space of the frame, the portion of the support arm beyond the accommodation space in integrally enclosed by the plastic material of the frame.
    Type: Grant
    Filed: December 28, 2007
    Date of Patent: June 26, 2012
    Assignee: Sunonwealth Electric Machine Industry Co., Ltd.
    Inventors: Alex Horng, Jai-Jing Tsai
  • Publication number: 20090142190
    Abstract: The present invention relates to a fan frame structure including a plastic frame and a metal fixing frame, in which at least two support arms are disposed on the rim of the fixing frame and extended outwardly therefrom, the outwardly extended distance of each support arm shall be beyond the range of an accommodation space of the frame, the portion of the support arm beyond the accommodation space in integrally enclosed by the plastic material of the frame. Therefore, the present invention not only significantly lowers the material cost, but also produces a variety of products in coordination with various specifications of fixing frame by using a single injection mold for the frame to save the mold cost.
    Type: Application
    Filed: December 28, 2007
    Publication date: June 4, 2009
    Applicant: Sunonwealth Electric Machine Industry Co., Ltd.
    Inventors: Alex Horng, Jai-Jing Tsai
  • Publication number: 20070080476
    Abstract: The present invention provides a method for manufacturing ethylene-vinyl alcohol copolymer pellets, which comprises passing a solution of ethylene-vinyl alcohol copolymer through a die plate of an extruder and cutting into pellets while cooling the ethylene-vinyl alcohol copolymer pellets by a coagulating fluid under flowing, and then charging into a solid-liquid separating device to separate the ethylene-vinyl alcohol copolymer pellet. According to the method of the present invention, it can produce pellets continuously in a stable manner and ethylene-vinyl alcohol copolymer pellets having uniform size and shape can be obtained.
    Type: Application
    Filed: March 31, 2004
    Publication date: April 12, 2007
    Inventors: Jing Tsai, Li Lin, Huan Chang, Kuang Fan, Weng Lin, Sheng Lin
  • Publication number: 20050228129
    Abstract: The present invention relates to a method for increasing the heat-resistant of ethylene-vinyl alcohol copolymer (EVOH), the method is characterized by using a mixture of acetic acid, magnesium dihydrogen phosphate, and potassium dihydrogen phosphate at a certain ratio as an acid-treating solution in the acid-treating procedure of a process for preparing EVOH. The EVOH produced by the method of the present invention exhibits an excellent heat-resistance and does not become yellowing attributed to the elevated processing temperature. Also, the EVOH generated by the method of the present invention exhibits a uniform heat-resistance since the additives are dispersed evenly in the EVOH.
    Type: Application
    Filed: June 20, 2003
    Publication date: October 13, 2005
    Applicant: Chang Chun Petrochemical Co., Ltd.
    Inventors: Jing Tsai, Li Lin, Huan Chang, Kuang Fan, Weng Lin
  • Publication number: 20050215733
    Abstract: A process for continuously preparing ethylene-vinyl acetate (EVAc) copolymer, by subjecting ethylene and vinyl acetate to a solution polymerization by introducing the gaseous phase of the polymerization reaction into an impurity scrubbing column and washing the gas phase with a solvent used in the reaction, then recycling it into the reaction system, thereby impurity generated in the reaction will be removed. A reactive system having a reaction tank for co-polymerizing ethylene with vinyl acetate, an ethylene recovering tower connected with the bottom of the reaction tank, a line connecting with the bottom of the recovering tower for recovering ethylene-vinyl acetate copolymer; and an impurity scrubbing column connecting with the top of the reaction tank for removing impurity generated in the polymerization reaction.
    Type: Application
    Filed: July 1, 2003
    Publication date: September 29, 2005
    Applicant: Chang Chun Petrochemical Co., Ltd.
    Inventors: Jing Tsai, Li Lin, Huan Chang, Kuang Fan, Weng Lin
  • Publication number: 20050079077
    Abstract: A reversible inflation system allowing a single pump to be used both for inflation and deflation of the air bladder. This embodiment of the inflation system includes a pump with an inlet and an outlet ports and a pump housing having two filling and venting valves. The pump is movably mounted in the pump housing so that the pump can move axially between two locations in the pump housing. In one of the locations, the pump ports align with the housing valves to create an air path that inflates the bladder. In the other location, the pump ports align with the housing valves to create an air path that deflates the bladder.
    Type: Application
    Filed: June 7, 2004
    Publication date: April 14, 2005
    Inventors: Jing Tsai, Michael Kehrmann