Patents by Inventor Jing-Xiu Lin

Jing-Xiu Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11349110
    Abstract: The present disclosure discloses a method for forming a lead-carbon compound interface layer on a lead-based substrate, wherein the lead-based substrate has a surface, and the method includes steps of: causing an acidic solution to contact with a carbon material and a lead-containing material to form a carbon-containing plumbate precursor having an ionic lead; and reducing the ionic lead in the carbon-containing plumbate precursor to form the lead-carbon compound interface layer on the surface.
    Type: Grant
    Filed: January 13, 2020
    Date of Patent: May 31, 2022
    Assignee: NATIONAL FORMOSA UNIVERSITY
    Inventors: Shu-Huei Hsieh, Kai-Yi Song, Yi-Ren Tzeng, Ya-Wun Jan, Jing-Xiu Lin, Bo-Shun Wang, Jyun-Neng Chen
  • Publication number: 20200227720
    Abstract: The present disclosure discloses a method for forming a lead-carbon compound interface layer on a lead-based substrate, wherein the lead-based substrate has a surface, and the method includes steps of: causing an acidic solution to contact with a carbon material and a lead-containing material to form a carbon-containing plumbate precursor having an ionic lead; and reducing the ionic lead in the carbon-containing plumbate precursor to form the lead-carbon compound interface layer on the surface.
    Type: Application
    Filed: January 13, 2020
    Publication date: July 16, 2020
    Applicant: National Formosa University
    Inventors: Shu-Huei Hsieh, Kai-Yi Song, Yi-Ren Tzeng, Ya-Wun Jan, Jing-Xiu Lin, Bo-Shun Wang, Jyun-Neng Chen