Abstract: Techniques disclosed herein relate to applying a trained constrained Markov decision process (CMDP) to control an autonomous vehicle to perform a stunt maneuver, such as a J-turn, in a safe and agile manner. The CMDP may implement a set of fuzzy logic instructions that correspond to actions needed to execute the stunt maneuver. While training the CMDP, the techniques disclosed herein may utilize a dynamic model of the autonomous vehicle that includes a model of the uncertainty introduced when implementing the stunt maneuver, such as the uncertainty in the tire-road mechanics. By utilizing a worst case scenario measure of the uncertainty during training, safe performance of the stunt maneuver is guaranteed when the trained model is applied in the real world.

Abstract: A high-definition multimedia interface circuit uses a high-definition multimedia interface encoder to produce a plurality of channels of data. An output circuit, connected to the high-definition multimedia interface encoder, produces a plurality of channels of high frequency data from the data produced by the high-definition multimedia interface encoder. A multiplexer selects a channel for sampling, and a capacitive coupler capacitively couples the multiplexer to a sampling circuit. The sampling circuit produces sampled data corresponding to the high frequency data having a clock rate less than a clock rate of the high frequency data. A test circuit compares the sampled data with the data produced by the high-definition multimedia interface encoder.

Abstract: A high-definition multimedia interface circuit uses a high-definition multimedia interface encoder to produce a plurality of channels of data. An output circuit, connected to the high-definition multimedia interface encoder, produces a plurality of channels of high frequency data from the data produced by the high-definition multimedia interface encoder. A multiplexer selects a channel for sampling, and a capacitive coupler capacitively couples the multiplexer to a sampling circuit. The sampling circuit produces sampled data corresponding to the high frequency data having a clock rate less than a clock rate of the high frequency data. A test circuit compares the sampled data with the data produced by the high-definition multimedia interface encoder.

Abstract: A high-definition multimedia interface circuit uses a high-definition multimedia interface encoder to produce a plurality of channels of data. An output circuit, connected to the high-definition multimedia interface encoder, produces a plurality of channels of high frequency data from the data produced by the high-definition multimedia interface encoder. A multiplexer selects a channel for sampling, and a capacitive coupler capacitively couples the multiplexer to a sampling circuit. The sampling circuit produces sampled data corresponding to the high frequency data having a clock rate less than a clock rate of the high frequency data. A test circuit compares the sampled data with the data produced by the high-definition multimedia interface encoder.

Abstract: A system and method for in situ measurement and maintenance of preferred pad smoothness in a CMP process is disclosed. The system includes a linear polisher having one or more sensors for detecting fluid pressure, fluid flow or motor current at the linear polisher during a polishing process. A controller receiving the information provided by the sensors includes an algorithm for adjusting the pad conditioning process to achieve a desired pad smoothness based on the sensor data. The method includes obtaining baseline data on preferred linear polisher characteristics associated with desired pad smoothness and using the baseline data to adjust a pad conditioning regimen on a linear polisher to achieve the desired pad smoothness in situ.

Abstract: A high-definition multimedia interface circuit uses a high-definition multimedia interface encoder to produce a plurality of channels of data. An output circuit, connected to the high-definition multimedia interface encoder, produces a plurality of channels of high frequency data from the data produced by the high-definition multimedia interface encoder. A multiplexer selects a channel for sampling, and a capacitive coupler capacitively couples the multiplexer to a sampling circuit. The sampling circuit produces sampled data corresponding to the high frequency data having a clock rate less than a clock rate of the high frequency data. A test circuit compares the sampled data with the data produced by the high-definition multimedia interface encoder.

Abstract: Broadly speaking, a method for controlling a chemical mechanical planarization (CMP) process to obtain a desired result is provided. More specifically, the method incorporates a first neural network to estimate a CMP result and a second neural network to tune CMP control parameters used to obtain the CMP result. The second neural network tunes the CMP control parameters to minimize a difference between the CMP result and a desired CMP result.

Abstract: Methods are provided for monitoring and controlling a chemical mechanical planarization (CMP) process. Relationships between motor torques and CMP process parameters are determined and utilized to provide a basis for monitoring and controlling the CMP process. Motor current measurements obtained during the CMP process are converted to motor torques to provide for use of the relationships in monitoring and controlling the CMP process. The motor current measurements and relationships are also used to determine and monitor a coefficient of friction present during the CMP process.

Abstract: An end point detection system may compare a production image developed during processing of production semiconductor wafer with a reference image. The reference image is representative of a desired state of processing of the production semiconductor wafer. The reference image is determined by processing a reference semiconductor wafer. The reference semiconductor wafer may be part of a wafer group of similar wafers that includes the production semiconductor wafer. The end point detection system may dynamically develop the production image during processing of the production semiconductor wafer. Indication may be provided by the end point detection system when the reference image and the production image are substantially similar.

Abstract: A method for processing a wafer using a chemical mechanical planarization (CMP) apparatus is provided. The method includes providing a wafer to be processed and heating a slurry to be applied to a polishing pad of the CMP apparatus. The method further includes applying the heated slurry to the polishing pad, and polishing the wafer using the heated slurry. The method also includes stopping the heating of the slurry for a subsequent wafer to be processed.