Patents by Inventor JING-CHENG WU

JING-CHENG WU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Generating probing map including touchdowns free of disabled probing site
    Patent number: 9632134
    Abstract: A wafer is probed using a probe card including a plurality of probing sites following a first probing map in which touchdowns of the probe card involve the plurality of probing sites to identify faulty locations. Whether at least one faulty site exists is determined based on the faulty locations. When the at least one faulty site exists, a second probing map in which each touchdown is free of at least one disabled probing site including the at least one faulty site is obtained. The second probing map is selected when a first criterion formed using a first touchdown count (TDC) in the first probing map, a second TDC in the second probing map, a third TDC based on re-probing the faulty locations and a fourth TDC based on re-probing a portion of the faulty locations not induced by the at least one faulty site is met.
    Type: Grant
    Filed: May 15, 2015
    Date of Patent: April 25, 2017
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Jing-Cheng Wu, Kai-Sheng Chang, Ming-Shan Shih, Yu-Chih Lee, Feng-Cheng Chiang
  • GENERATING PROBING MAP INCLUDING TOUCHDOWNS FREE OF DISABLED PROBING SITE
    Publication number: 20160334461
    Abstract: A wafer is probed using a probe card including a plurality of probing sites following a first probing map in which touchdowns of the probe card involve the plurality of probing sites to identify faulty locations. Whether at least one faulty site exists is determined based on the faulty locations. When the at least one faulty site exists, a second probing map in which each touchdown is free of at least one disabled probing site including the at least one faulty site is obtained. The second probing map is selected when a first criterion formed using a first touchdown count (TDC) in the first probing map, a second TDC in the second probing map, a third TDC based on re-probing the faulty locations and a fourth TDC based on re-probing a portion of the faulty locations not induced by the at least one faulty site is met.
    Type: Application
    Filed: May 15, 2015
    Publication date: November 17, 2016
    Inventors: JING-CHENG WU, KAI-SHENG CHANG, MING-SHAN SHIH, YU-CHIH LEE, FENG-CHENG CHIANG