Patents by Inventor Jinge Zhao

Jinge Zhao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11522110
    Abstract: This disclosure discloses a light-emitting diode chip, a method for fabricating the same, a backlight module, and a display device. The light-emitting diode chip includes: a transparent base substrate; at least one light-emitting diode located on one side of the base substrate; and a dimming structure located on a side of the base substrate away from the light-emitting diode, wherein the light-emitting diode is configured to emit light from double sides thereof; and the dimming structure is configured to adjust the intensity of light emitted from the side of the base substrate away from the light-emitting diode.
    Type: Grant
    Filed: October 17, 2018
    Date of Patent: December 6, 2022
    Assignees: Beijing BOE Optoelectronics Technology Co., Ltd., Beijing BOE Technology Development Co., Ltd.
    Inventors: Ting Tian, Yawen Zhang, Ming Zhai, Dayong Zhou, Jinge Zhao, Pan Guo, Shuqian Dou, Xiaoliang Fu, Zhiqiang Fan, Meijuan An, Liguang Deng, Yongjie Han
  • Patent number: 11123252
    Abstract: The present disclosure provides a flexible suit and a flexible system for rehabilitation training of a human leg. The flexible suit includes a first hip joint motion assembly, a first knee joint motion assembly and a first ankle joint motion assembly, a first end of the first knee joint motion assembly is connected with the first hip joint motion assembly, a second end of the first knee joint motion assembly is connected with the first ankle joint motion assembly, the first hip joint motion assembly, the first knee joint motion assembly, and the first ankle joint motion assembly each includes a flexible mechanism, and at least one of a group consisting of the first hip joint motion assembly, the first knee joint motion assembly, and the first ankle joint motion assembly is configured to operate under gas drive.
    Type: Grant
    Filed: April 18, 2019
    Date of Patent: September 21, 2021
    Assignees: BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Bangcan Xue, Yanjun Liu, Taesung Kang, Liguang Deng, Wenfeng Jin, Jian Bai, Dong Zhang, Tao Jia, Jia Meng, Hongqiang Ji, Zhehua Long, Yu Liu, Yanbin Liang, Meijuan An, Jinge Zhao, Feiwu Yuan
  • Patent number: 10789446
    Abstract: A device for fingerprint recognition, a manufacturing method therefor, and an electronic apparatus are provided. The method includes: forming fingerprint recognition units in multiple independent preset regions of a substrate, where the fingerprint recognition units each include a fingerprint recognition component and a light emitting component; partitioning the substrate along boundaries of the preset regions to separate the fingerprint recognition units from each other; and coupling the fingerprint recognition units after partition with corresponding control circuits, to make the fingerprint recognition component and the light emitting component of each fingerprint recognition unit be electrically connected to a corresponding control circuit coupled with the each fingerprint recognition unit. The fingerprint recognition unit and the control circuit coupled with each other serve together as the device for fingerprint recognition. The method is for manufacturing the device for fingerprint recognition.
    Type: Grant
    Filed: February 21, 2019
    Date of Patent: September 29, 2020
    Assignees: BEIJING BOE TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Ting Tian, Ming Zhai, Shuqian Dou, Xiaoliang Fu, Dayong Zhou, Zhiqiang Fan, Liguang Deng, Youcai Yang, Zhongjun Wang, Dong Zhang, Yongjie Han, Jinge Zhao, Jia Meng, Yanjun Liu, Yu Liu
  • Publication number: 20200013935
    Abstract: This disclosure discloses a light-emitting diode chip, a method for fabricating the same, a backlight module, and a display device. The light-emitting diode chip includes: a transparent base substrate; at least one light-emitting diode located on one side of the base substrate; and a dimming structure located on a side of the base substrate away from the light-emitting diode, wherein the light-emitting diode is configured to emit light from double sides thereof; and the dimming structure is configured to adjust the intensity of light emitted from the side of the base substrate away from the light-emitting diode.
    Type: Application
    Filed: October 17, 2018
    Publication date: January 9, 2020
    Inventors: Ting Tian, Yawen Zhang, Ming Zhai, Dayong Zhou, Jinge Zhao, Pan Guo, Shuqian Dou, Xiaoliang FU, Zhiqiang Fan, Meijuan An, Liguang Deng, Yongjie Han
  • Publication number: 20200009001
    Abstract: The present disclosure provides a flexible suit and a flexible system for rehabilitation training of a human leg. The flexible suit includes a first hip joint motion assembly, a first knee joint motion assembly and a first ankle joint motion assembly, a first end of the first knee joint motion assembly is connected with the first hip joint motion assembly, a second end of the first knee joint motion assembly is connected with the first ankle joint motion assembly, the first hip joint motion assembly, the first knee joint motion assembly, and the first ankle joint motion assembly each includes a flexible mechanism, and at least one of a group consisting of the first hip joint motion assembly, the first knee joint motion assembly, and the first ankle joint motion assembly is configured to operate under gas drive.
    Type: Application
    Filed: April 18, 2019
    Publication date: January 9, 2020
    Inventors: Bangcan Xue, Yanjun Liu, Taesung Kang, Liguang Deng, Wenfeng Jin, Jian Bai, Dong Zhang, Tao Jia, Jia Meng, Hongqiang Ji, Zhehua Long, Yu Liu, Yanbin Liang, Meijuan An, Jinge Zhao, Feiwu Yuan
  • Publication number: 20190370520
    Abstract: A device for fingerprint recognition, a manufacturing method therefor, and an electronic apparatus are provided. The method includes: forming fingerprint recognition units in multiple independent preset regions of a substrate, where the fingerprint recognition units each include a fingerprint recognition component and a light emitting component; partitioning the substrate along boundaries of the preset regions to separate the fingerprint recognition units from each other; and coupling the fingerprint recognition units after partition with corresponding control circuits, to make the fingerprint recognition component and the light emitting component of each fingerprint recognition unit be electrically connected to a corresponding control circuit coupled with the each fingerprint recognition unit. The fingerprint recognition unit and the control circuit coupled with each other serve together as the device for fingerprint recognition. The method is for manufacturing the device for fingerprint recognition.
    Type: Application
    Filed: February 21, 2019
    Publication date: December 5, 2019
    Applicants: Beijing BOE Optoelectronics Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Ting Tian, Ming Zhai, Shuqian Dou, Xiaoliang Fu, Dayong Zhou, Zhiqiang Fan, Liguang Deng, Youcai Yang, Zhongjun Wang, Dong Zhang, Yongjie Han, Jinge Zhao, Jia Meng, Yanjun Liu, Yu Liu
  • Publication number: 20180242529
    Abstract: An intelligent container is provided. The container includes a body; and a light-emitting device disposed on the body. The light-emitting device includes at least one light-emitting unit, the light-emitting unit being configured to emit light towards the inside of the body and the outside of the body. The light-emitting unit of the intelligent container can emit light bidirectionally to provide a light source for a plant therein in the growth process of the plant, and simultaneously provide an illumination to the outside.
    Type: Application
    Filed: May 17, 2017
    Publication date: August 30, 2018
    Applicants: BOE Technology Group Co., Ltd., BOE Technology Group Co., Ltd., Beijing BOE Optoelectronics Technology Co., Ltd., Beijing BOE Optoelectronics Technology Co., Ltd.
    Inventors: Ting Tian, Jinge Zhao, Dayong Zhou, Shuqian Dou, Jinshan Liu, Ming Zhai, Liguang Deng, Tae Sung Kang, Hyungkyu Kim