Patents by Inventor Jing-Hao Li

Jing-Hao Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7530735
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling a heat pipe requiring test. A movable portion is capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion for avoiding the movable portion from deviating from the immovable portion to ensure the receiving structure being capable of precisely receiving the heat pipe. At least a temperature sensor is attached to at least one of the immovable portion and the movable portion for thermally contacting the heat pipe in the receiving structure to detect a temperature of the heat pipe.
    Type: Grant
    Filed: July 7, 2006
    Date of Patent: May 12, 2009
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chih-Hsien Sun, Chao-Nien Tung, Chuen-Shu Hou, Jing-Hao Li
  • Patent number: 7494160
    Abstract: A sealing structure formed at an end of a heat pipe, includes a two-layer structure, which can be divided into two walls and a rib interconnecting the walls together, wherein the rib points to a center of the heat pipe. A method for manufacturing the sealing structure includes following steps: (1) providing a metallic pipe with an end sealed and an opposite open portion; (2) pressing the open portion of the pipe to form the two-layer sealing structure by using a pair of pressing molds, wherein the pair of pressing molds comprises a first pressing mold and a second pressing mold, the first mold having an M-shaped convex portion, the second mold having an M-shaped concave portion corresponding to the convex portion.
    Type: Grant
    Filed: June 15, 2006
    Date of Patent: February 24, 2009
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Cheng-Hui Lin, Jing-Hao Li, Wei Yu
  • Publication number: 20070127548
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling a heat pipe requiring test. A movable portion is capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion for avoiding the movable portion from deviating from the immovable portion to ensure the receiving structure being capable of precisely receiving the heat pipe. At least a temperature sensor is attached to at least one of the immovable portion and the movable portion for thermally contacting the heat pipe in the receiving structure to detect a temperature of the heat pipe.
    Type: Application
    Filed: July 7, 2006
    Publication date: June 7, 2007
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: TAY-JIAN LIU, CHIH-HSIEN SUN, CHAO-NIEN TUNG, CHUEN-SHU HOU, JING-HAO LI
  • Publication number: 20070127550
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling the heat pipe. A movable portion is capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion for ensuring the receiving structure being capable of precisely receiving the heat pipe. Temperature sensors are attached to the immovable portion and the movable portion to detect a temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions therein to provide a thermally stable environment for the heat pipe during test.
    Type: Application
    Filed: July 26, 2006
    Publication date: June 7, 2007
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: TAY-JIAN LIU, CHIH-HSIEN SUN, CHAO-NIEN TUNG, CHUEN-SHU HOU, Jing-Hao Li