Patents by Inventor Jinghe Feng

Jinghe Feng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240072482
    Abstract: A modular connector with components that can be economically assembled to provide high signal integrity in a harsh environment. The connector includes an insulative housing bounding a mating interface, a conductive housing engaging a rear of the insulative housing and having tubes extending through the rear of the insulative housing to the mating interface, and lead assemblies disposed in respective tubes. The conductive housing has a channel extending from its top to its front. The insulative housing has a top extension extending beyond its rear, and a locking feature extending from its rear into the channel through the front of the conductive housing. A member is disposed in the channel and has opposite ends disposed in the top extension and locking feature of the insulative housing, respectively. Such a configuration prevents relative movement of components within the connector in a harsh environment and therefore provide more consistent signal paths.
    Type: Application
    Filed: February 16, 2023
    Publication date: February 29, 2024
    Applicant: Amphenol East Asia Electronic Technology (Shenzhen) Co., Ltd.
    Inventors: Danren He, Xiang Wang, Yan-Bin Tan, Jinghe Feng, Cheng Dong