Patents by Inventor Jinghui Xu
Jinghui Xu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240077716Abstract: A micromirror assembly comprises a first position-limiting part, a micromirror chip, and a second position-limiting part that are stacked. The micromirror chip includes a fastening frame, a movable part, and a first cantilever, where the movable part is connected to the fastening frame by the first cantilever. The first position-limiting part and the second position-limiting part are separately connected to the fastening frame, the first position-limiting part and the second position-limiting part have a hollow area, and the hollow areas are opposite to the movable part. The first position-limiting part and the second position-limiting part are configured to absorb shock from a collision with the micromirror chip, and a projection of a collision part of the first position-limiting part on the micromirror chip intersects with a central axis of the first cantilever.Type: ApplicationFiled: November 13, 2023Publication date: March 7, 2024Inventors: Fei Zhao, Huai Yuan Chu, Jinghui Xu, Jiahao Wu
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Publication number: 20240068308Abstract: A full-face shaft tunnel boring machine system includes a tunnel boring machine cutterhead device for tunneling downwards in a shaft; a full-hydraulic formwork device for supporting and walling in a wellbore; and an upper muck-discharge system for vertically conveying rock mucks generated by tunneling. The tunnel boring machine cutterhead device comprises a vertical guide frame, a cutter-expanded boring head and an advanced cutterhead that are fixedly connected in a vertical order from top to bottom so as to form an integrated structure. The vertical guide frame is a hollow cylindrical structure and driven to rotate around an axis of the vertical guide frame by a power mechanism, and an outer wall of the vertical guide frame is provided with multiple sets of first guide rollers.Type: ApplicationFiled: August 25, 2023Publication date: February 29, 2024Applicants: HEFEI DESIGN & RESEARCH INSTITUTE OF COAL INDUSTRY CO., LTD, UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING, CHINA COAL NO.3 CONSTRUCTION CORPORATION (GROUP) LTD, ANSTEEL GROUP MINING CORPORTION LIMITEDInventors: Huidong XU, Renshu YANG, Bin XU, Ning LIU, Guang LI, Yong ZHANG, Jinghui YE, Lin LV, Fei MA, Donghui MAN, Tingting BAO, Zheng LI, Yingcan LIU, Guozheng ZHOU, Bo DING
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Publication number: 20240019687Abstract: An electrostatic MEMS micromirror is provided, and may be used in a device such as a mobile phone, a microphone, a camera, a radar, or an optical switch. The electrostatic MEMS micromirror includes a support beam, a micromirror, and a drive component. The drive component includes a comb frame and a drive comb located in the comb frame. The support beam and the micromirror are mechanically coupled using the comb frame. Two sides of the comb frame that are mechanically coupled to the micromirror are separately located on two sides of a rotating axis determined by the support beam. The drive comb includes at least one comb pair. The comb pair includes a movable comb structure and a stationary comb structure. The movable comb structure includes a plurality of movable combs. One end of the movable comb is fastened to the comb frame.Type: ApplicationFiled: September 29, 2023Publication date: January 18, 2024Inventors: Xiaoshi Dong, Jinghui Xu, Fengpei Sun
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Publication number: 20230365400Abstract: The technology of this application relates to an encapsulation structure that includes a micro-electromechanical system (MEMS) device, a substrate, and an attachment material. Materials included in the substrate include at least a first-type material and a second-type material, a coefficient of thermal expansion of the first-type material is less than a coefficient of thermal expansion of a base material of the MEMS device, and a coefficient of thermal expansion of the second-type material is greater than the coefficient of thermal expansion of the base material of the MEMS device. The attachment material is located between the MEMS device and the substrate, and is configured to attach the MEMS device to the substrate. The substrate includes a plurality of different materials.Type: ApplicationFiled: July 28, 2023Publication date: November 16, 2023Inventors: Guoqiang WU, Shangshu YANG, Jinghui XU, Zhongye WU, Qifang HU
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Publication number: 20230266360Abstract: This application provides an accelerometer, an inertial measurement unit IMU, and an electronic device. The accelerometer includes an upper cover layer, the first axis accelerometer, and a substrate layer. The first axis accelerometer includes the first anchor region, a cantilever beam, a first proof mass, a first movable electrode, a second movable electrode, a first fixed electrode, a second fixed electrode, a second anchor region, and a third anchor region. The first proof mass is supported by the cantilever beam and suspended above the substrate layer. The first anchor region, the second anchor region, and the third anchor region are separately connected to the substrate layer and/or the upper cover layer. The first anchor region is located at the central position of the first axis accelerometer. This application may be applied to fields such as consumer electronics, wearable devices, industrial automation, the automobile industry, and the aircraft industry.Type: ApplicationFiled: April 27, 2023Publication date: August 24, 2023Inventors: Shihao TANG, Qifang HU, Jinghui XU
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Publication number: 20230174371Abstract: An MEMS device includes a package (1), a bottom plate (2), and a first inertial component (3). The first inertial component (3) is located in packaging space (4) formed by the bottom plate (2) and the package (1). There is a first alignment part (21) on a surface that is of the bottom plate (2) and that faces the packaging space (4), and the first inertial component (3) has a first mounting part (31). A shape of the first mounting part (31) matches a shape of the first alignment part (21). The MEMS device is equipped with a mounting alignment reference, the first mounting part (31) is connected to the first alignment part (21), and the first inertial component is mounted on the bottom plate at a preset angle. In addition, a bottom part of the first inertial component is not directly connected to the bottom plate.Type: ApplicationFiled: January 30, 2023Publication date: June 8, 2023Inventors: Qin SHI, Qifang HU, Anping QIU, Jinghui XU
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Publication number: 20230174370Abstract: An MEMS chip includes a substrate, a movable assembly, a fastening assembly, and a drive assembly. The fastening assembly is located between the substrate and the movable assembly. The movable assembly includes a fastening portion, a movable portion, and a first support beam. The first support beam is connected to the movable portion and the fastening portion. A first avoidance slot is disposed on a face that is of the movable portion and that faces the fastening assembly. The fastening assembly is grounded. A boss and a first position limiting pole are disposed on a face that is of the fastening assembly and that faces the movable assembly. The boss is connected to the fastening portion and configured to support the fastening portion. The first position limiting pole corresponds to the first avoidance slot. The drive assembly is connected to the movable portion to drive the movable portion to move.Type: ApplicationFiled: January 30, 2023Publication date: June 8, 2023Inventors: Fengpei SUN, Zhihong FENG, Jinghui XU, Xiaoshi DONG
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Publication number: 20230176265Abstract: A reflector (10), a method for manufacturing the same, a lens module (001), and an electronic device are provided, and pertain to the field of optical technologies. The reflector (10) uses a silicon-based substrate (101) with a planar structure as a base material, which can effectively reduce a volume and mass of the reflector (10) when compared with a right triangular prism. In addition, an included angle (?) between a second side surface (1d) and a second surface (1b) of the silicon-based substrate (101) is designed as an obtuse angle, to ensure that after the reflector (10) is arranged in an inclined manner, a right angle protruding outward is not formed between the second side face (1d) and the second surface (1b).Type: ApplicationFiled: January 13, 2023Publication date: June 8, 2023Inventors: Jinghui XU, Fengpei SUN, Jun FENG, Ming LI
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Publication number: 20230043470Abstract: This application discloses example piezoelectric acoustic sensors and methods for manufacturing the piezoelectric acoustic sensor, and belongs to the field of electronic technologies. In one example, the piezoelectric acoustic sensor includes an anchoring unit, a piezoelectric unit, a support unit, and a hollow-out mechanical part. A back cavity is formed in the anchoring unit. The piezoelectric unit is configured to convert a sound signal that enters the back cavity into an electrical signal. The support unit covers the anchoring unit and the piezoelectric unit. The hollow-out mechanical part is connected between the anchoring unit and the piezoelectric unit, and is embedded in the support unit.Type: ApplicationFiled: October 26, 2022Publication date: February 9, 2023Inventors: Zhihong FENG, Danyang YAO, Jinghui XU
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Publication number: 20220324699Abstract: Micro-electro-mechanical systems and a preparation method thereof are provided. The micro-electro-mechanical systems include first fixed comb fingers, second fixed comb fingers, a support beam, a movable platform, and movable comb fingers. The first fixed comb fingers and the second fixed comb fingers are fastened to a substrate, and the first fixed comb fingers are electrically isolated from the second fixed comb fingers. Two ends of the support beam are fastened to the substrate, and the movable platform is coupled to the support beam. The movable comb fingers are coupled to the movable platform, and form a three-layer comb finger structure with the first fixed comb fingers and the second fixed comb fingers. This structure improves drive efficiency of the micro-electro-mechanical systems.Type: ApplicationFiled: June 30, 2022Publication date: October 13, 2022Applicant: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Fengpei Sun, Zhihong Feng, Jinghui Xu
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Publication number: 20220264229Abstract: A piezoelectric MEMS sensor and a related device is disclosed, applied to scenarios such as a terminal, a smart acoustic system, a wireless Bluetooth headset, an active noise reduction headset, a notebook computer, and an automobile industry, including a substrate including a sound entry channel and at least one cantilever. The cantilever includes a first region and a second region that are connected to each other. The first region includes a first side face and a second side face, the first side face is a side face that is of the first region and that faces a target face, and the target face is a face that is of the cantilever and that is connected to the substrate. An included angle between the first side face and the second side face is greater than or equal to 90 degrees and less than 180 degrees.Type: ApplicationFiled: April 29, 2022Publication date: August 18, 2022Inventors: Danyang Yao, Jinghui Xu
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Publication number: 20220256128Abstract: A camera module is provided. The camera module may be separately used as a camera, or may be applied to a terminal device such as a mobile phone or a tablet computer, or a vehicle-mounted device. The camera module includes an optical lens component, a light filtering layer, an image sensor and a drive module. The optical lens component is configured to receive a light beam from a photographed object, and transmit the light beam to the light filtering layer. The light filtering layer is configured to move a position under the drive of the drive module, and respectively transmit light signals filtered at different positions to the image sensor. The image sensor is configured to receive the light signals at the different positions from the light filtering layer, and determine image information based on the light signals at the different positions.Type: ApplicationFiled: April 28, 2022Publication date: August 11, 2022Applicant: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Jun Feng, Ming Li, Wenzhe Liao, Hui Yang, Jinghui Xu, Jifang He
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Patent number: 10211805Abstract: According to various embodiments, there is provided a micro-electromechanical resonator, including a substrate with a cavity therein; and a resonating structure suspended over the cavity, the resonating structure having a first end anchored to the substrate, wherein the resonating structure is configured to flex in a flexural mode along a width direction of the resonating structure, wherein the width direction is defined at least substantially perpendicular to a length direction of the resonating structure, wherein the length direction is defined from the first end to a second end of the resonating structure, wherein the second end opposes the first end.Type: GrantFiled: February 11, 2015Date of Patent: February 19, 2019Assignee: Agency for Science, Technology and ResearchInventors: Jinghui Xu, Nan Wang, Yuandong Alex Gu
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Patent number: 10134607Abstract: A method for bonding wafers is provided. The method comprises the steps of providing a first wafer having an exposed first layer, the first layer comprising a first metal; and providing a second wafer having an exposed second layer, the second layer comprising a second metal, the first metal and the second metal capable of forming a eutectic mixture having a eutectic melting temperature. The method further comprises the steps of contacting the first layer with the second layer; and applying a predetermined pressure at a predetermined temperature to form a solid-state diffusion bond between the first layer and the second layer, wherein the predetermined temperature is below the eutectic melting temperature.Type: GrantFiled: July 9, 2015Date of Patent: November 20, 2018Assignee: Agency for Science, Technology and ResearchInventors: Vivek Chidambaram, Sunil Wickramanayaka, Jinghui Xu, Zhipeng Ding, Li Yan Siow
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Patent number: 10076772Abstract: A transducer is provided, which includes a substrate, wherein a cavity is defined at least partially through the substrate, at least one stopper structure arranged within the cavity, a support layer arranged over the at least one stopper structure and the cavity to seal the cavity, and a piezoelectric functional arrangement arranged on the support layer. According to further embodiments of the present invention, a method for forming a transducer is also provided.Type: GrantFiled: November 25, 2014Date of Patent: September 18, 2018Assignee: Agency for Science, Technology and ResearchInventors: Jinghui Xu, Hongbin Yu, Liang Lou, Alex Yuandong Gu
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Publication number: 20180054183Abstract: According to various embodiments, there is provided a micro-electromechanical resonator, including a substrate with a cavity therein; and a resonating structure suspended over the cavity, the resonating structure having a first end anchored to the substrate, wherein the resonating structure is configured to flex in a flexural mode along a width direction of the resonating structure, wherein the width direction is defined at least substantially perpendicular to a length direction of the resonating structure, wherein the length direction is defined from the first end to a second end of the resonating structure, wherein the second end opposes the first end.Type: ApplicationFiled: February 11, 2015Publication date: February 22, 2018Inventors: Jinghui Xu, Nan Wang, Yuandong Alex Gu
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Publication number: 20170178929Abstract: A method for bonding wafers is provided. The method comprises the steps of providing a first wafer having an exposed first layer, the first layer comprising a first metal; and providing a second wafer having an exposed second layer, the second layer comprising a second metal, the first metal and the second metal capable of forming a eutectic mixture having a eutectic melting temperature. The method further comprises the steps of contacting the first layer with the second layer; and applying a predetermined pressure at a predetermined temperature to form a solid-state diffusion bond between the first layer and the second layer, wherein the predetermined temperature is below the eutectic melting temperature.Type: ApplicationFiled: July 9, 2015Publication date: June 22, 2017Inventors: Vivek CHIDAMBARAM, Sunil WICKRAMANAYAKA, Jinghui XU, Zhipeng DING, Li Yan SIOW
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Publication number: 20160352309Abstract: According to various embodiments, there is provided a micro-electromechanical resonator, including a substrate with a cavity therein; and a resonating structure suspended over the cavity, the resonating structure having a first end anchored to the substrate, wherein the resonating structure is configured to flex in a flexural mode along a width direction of the resonating structure, wherein the width direction is defined at least substantially perpendicular to a length direction of the resonating structure, wherein the length direction is defined from the first end to a second end of the resonating structure, wherein the second end opposes the first end.Type: ApplicationFiled: February 11, 2015Publication date: December 1, 2016Applicant: Agency for Science, Technology and ResearchInventors: Jinghui Xu, Nan Wang, Yuandong Alex Gu
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Patent number: 9510121Abstract: According to embodiments of the present invention, a transducer is provided. The transducer includes a substrate, and a diaphragm suspended from the substrate, wherein the diaphragm is displaceable in response to an acoustic signal impinging on the diaphragm, wherein the transducer is configured, in a first mode of operation, to determine a direction of the acoustic signal based on a first displacement of the diaphragm in the first mode of operation, and to decide to accept or reject the acoustic signal based on at least one predetermined parameter and the determined direction of the acoustic signal, and in a second mode of operation, to sense the acoustic signal based on a second displacement of the diaphragm in the second mode of operation if the acoustic signal is accepted in the first mode of operation.Type: GrantFiled: December 6, 2013Date of Patent: November 29, 2016Assignee: Agency for Science, Technology and ResearchInventors: Jinghui Xu, Julius Ming Lin Tsai
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Patent number: 9321630Abstract: A method and apparatus for detecting underwater sounds is disclosed. An embodiment of the apparatus includes a substrate with a vacuum-sealed cavity. A support structure and an acoustic pressure sensor are situated on the substrate. The support structure of the apparatus may include a first oxide layer situated on the substrate, a silicon layer situated on the first oxide layer, and a second oxide layer situated on the silicon layer. The acoustic pressure sensor of the apparatus includes a first electrode layer situated on the substrate, a piezoelectric layer situated on the first electrode layer, and a second electrode layer situated on the piezoelectric layer. In one embodiment, the surface area of the second electrode layer is between about 70 to 90 percent of the surface area of the piezoelectric layer. In various embodiments, the support structure is thicker than the piezoelectric layer.Type: GrantFiled: February 20, 2013Date of Patent: April 26, 2016Assignees: PGS Geophysical AS, Agency For Science Technology and Research (A*STAR)Inventors: Jinghui Xu, Julius Ming-Lin Tsai, Winston Sun, Chengliang Sun