Patents by Inventor Jingjing JING

Jingjing JING has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11618182
    Abstract: A method for fabrication of a 3D printed part with high through-plane thermal conductivity is provided, where pure polymer particles and a carbon-based filler for heat conduction are subjected to milling and mixing in the mechanochemical reactor disclosed in Chinese patent ZL 95111258.9 under the controlled milling conditions including milling pan surface temperature, milling pan pressure, and number of milling cycles; then a resulting mixture is extruded to obtain 3D printing filaments; and finally, the 3D printing filaments are used to fabricate the 3D printed part with high through-plane thermal conductivity through fused deposition modeling (FDM) 3D printing. The fabrication method can realize the fabrication of a 3D printed part with high through-plane thermal conductivity through the FDM 3D printing technology, features simple process, continuous production, etc., and is suitable for the industrial production of thermally-conductive parts with complex structures.
    Type: Grant
    Filed: July 9, 2021
    Date of Patent: April 4, 2023
    Assignee: Sichuan University
    Inventors: Yinghong Chen, Jingjing Jing, Shaohong Shi, Ning Chen
  • Publication number: 20230009609
    Abstract: A method for fabrication of a 3D printed part with high through-plane thermal conductivity is provided, where pure polymer particles and a carbon-based filler for heat conduction are subjected to milling and mixing in the mechanochemical reactor disclosed in Chinese patent ZL 95111258.9 under the controlled milling conditions including milling pan surface temperature, milling pan pressure, and number of milling cycles; then a resulting mixture is extruded to obtain 3D printing filaments; and finally, the 3D printing filaments are used to fabricate the 3D printed part with high through-plane thermal conductivity through fused deposition modeling (FDM) 3D printing. The fabrication method can realize the fabrication of a 3D printed part with high through-plane thermal conductivity through the FDM 3D printing technology, features simple process, continuous production, etc., and is suitable for the industrial production of thermally-conductive parts with complex structures.
    Type: Application
    Filed: July 9, 2021
    Publication date: January 12, 2023
    Applicant: Sichuan University
    Inventors: Yinghong CHEN, Jingjing JING, Shaohong SHI, Ning CHEN
  • Patent number: 11242612
    Abstract: Disclosed is a composite electroplating method for sintered NdFeB magnet, including: a process of pre-treating sintered NdFeB magnet, a process of electroplating the pre-treated sintered NdFeB magnet, and a process of cleaning and drying the electroplated sintered NdFeB magnet. The electroplating process forms a composite coating composed of a Zn coating, a Zn—Ni alloy coating, a Cu coating and a Ni coating on the surface of the sintered NdFeB magnet.
    Type: Grant
    Filed: October 15, 2018
    Date of Patent: February 8, 2022
    Assignees: NINGBO YUNSHENG CO., LTD., NINGBO YUNSHENG MAGNET DEVICES TECHNOLOGY CO., LTD.
    Inventors: Jingjing Jing, Caicai Peng
  • Publication number: 20200340133
    Abstract: Disclosed is a composite electroplating method for sintered NdFeB magnet, including: a process of pre-treating sintered NdFeB magnet, a process of electroplating the pre-treated sintered NdFeB magnet, and a process of cleaning and drying the electroplated sintered NdFeB magnet. The electroplating process forms a composite coating composed of a Zn coating, a Zn—Ni alloy coating, a Cu coating and a Ni coating on the surface of the sintered NdFeB magnet.
    Type: Application
    Filed: October 15, 2018
    Publication date: October 29, 2020
    Applicants: NINGBO YUNSHENG CO., LTD., NINGBO YUNSHENG MAGNET DEVICES TECHNOLOGY CO., LTD.
    Inventors: Jingjing JING, Caicai PENG