Abstract: Disclosed are multilayer structures comprising polyamide-ionomer compositions suitable for use in a backsheet in a photovoltaic module comprising a polymer component comprising a polyamide and an ionomer; 0 to 20 weight % of pigment; and 0 to 40 weight % of filler; preferably wherein the combination of pigment and filler comprises 8 to 50 weight % of the composition; and 0 to 5 weight % of weatherability additives.

Abstract: Disclosed is a polyamide-ionomer composition suitable for use in a backsheet in a photovoltaic module comprising a polymer component a polyamide and an anhydride ionomer comprising a copolymer of ethylene, an alpha, beta-unsaturated C3-C8 carboxylic acid and an ethylenically unsaturated dicarboxylic acid or derivative thereof selected from the group consisting of maleic acid, fumaric acid, itaconic acid, maleic anhydride, and a C1-C1 alkyl half ester of maleic acid, wherein the carboxylic acid functionalities present are at least partially neutralized to carboxylate salts of one or more alkali metal, transition metal, or alkaline earth metal cations; 0 to 20 weight % of pigment; and 0 to 40 weight % of filler; preferably wherein the combination of pigment and filler comprises 10 to 50 weight % of the composition; and 0 to 5 weight % of weatherability additives.

Abstract: Methods and apparatus for cleaning substrate surfaces are provided herein. In some embodiments, a method of cleaning a surface of a substrate may include providing a hydrogen containing gas to a first chamber having a plurality of filaments disposed therein; flowing a current through the plurality of filaments to raise a temperature of the plurality of filaments to a process temperature sufficient to decompose at least some of the hydrogen containing gas; and cleaning the surface of the substrate by exposing the substrate to hydrogen atoms formed from the decomposed hydrogen containing gas for a period of time.

Abstract: Disclosed is a polyamide-ionomer composition suitable for use in a backsheet in a photovoltaic module comprising a polymer component comprising a polyamide and an ionomer comprising a copolymer of ethylene, an alpha, beta-unsaturated C3-C8 carboxylic acid, wherein the carboxylic acid functionalities present are at least partially neutralized to carboxylate salts of one or more alkali metal, transition metal, or alkaline earth metal cations; 0 to 20 weight % of pigment; and 0 to 40 weight % of filler; wherein the combination of pigment and filler comprises 8 to 50 weight % of the composition; and 0 to 5 weight % of weatherability additives.

Abstract: Provided are apparatus and methods for the sequential deposition and annealing of a film within a single processing chamber. An energy source positioned within the processing chamber in an area isolated from process gases can be used to rapidly form and decompose a film on the substrate without damaging underlying layers due to exceeding the thermal budget of the device being formed.

Abstract: Provided herein are interlayer sheets formed of an acid copolymer composition, which comprises an acid copolymer resin or an ionomer that is the neutralized product of the acid copolymer resin. The acid copolymer resin comprises copolymerized units of an ?-olefin having 2 to 10 carbon atoms; about 10 to about 25 wt % of copolymerized units of a first ?,?-ethylenically unsaturated carboxylic acid having 3 to 10 carbon atoms; and about 15 to about 30 wt % of copolymerized units of a derivative of a second ?,?-ethylenically unsaturated carboxylic acid having 3 to 10 carbon atoms. In addition, the acid copolymer resin has a melt flow rate of about 1 to about 400 g/10 min. Light weight safety laminates comprising these interlayer sheets are characterized by good strength and superior acoustic damping, due to the properties of the acid copolymer composition.

Abstract: Provided are methods for selective deposition. Certain methods describe providing a first substrate surface; providing a second substrate surface; depositing a first layer of film over the first and second substrate surfaces, wherein the deposition has an incubation delay over the second substrate surface such that the first layer of film over the first substrate surface is thicker than the first layer of film deposited over the second substrate surface; and etching the first layer of film over the first and second substrate surfaces, wherein the first layer of film over the second substrate surface is at least substantially removed, but the first layer of film over the first substrate is only partially removed.

Abstract: Methods of selectively etching silicon germanium relative to silicon are described. The methods include a remote plasma etch using plasma effluents formed from a fluorine-containing precursor. Plasma effluents from the remote plasma are flowed into a substrate processing region where the plasma effluents react with the silicon germanium. The plasmas effluents react with exposed surfaces and selectively remove silicon germanium while very slowly removing other exposed materials. Generally speaking, the methods are useful for removing Si(1-X)GeX (including germanium i.e. X=1) faster than Si(1-Y)GeY, for all X>Y. In some embodiments, the silicon germanium etch selectivity results partly from the presence of an ion suppression element positioned between the remote plasma and the substrate processing region.

Abstract: A method of forming and controlling air gaps between adjacent raised features on a substrate includes forming a silicon-containing film in a bottom region between the adjacent raised features using a flowable deposition process. The method also includes forming carbon-containing material on top of the silicon-containing film and forming a second film over the carbon-containing material using a flowable deposition process. The second film fills an upper region between the adjacent raised features. The method also includes curing the materials at an elevated temperature for a period of time to form the air gaps between the adjacent raised features. The thickness and number layers of films can be used to control the thickness, vertical position and number of air gaps.

Abstract: A composition comprises or is produced from polyester, a first modifier, and a second modifier wherein the first modifier includes a polymer that is incompatible with poly(hydroxyalkanoic acid) and is not an acid-containing or acid generating polymer. Also disclosed is an article comprising or produced from the composition. Further disclosed is a process combining a first modifier, a second modifier, or both, with a poly(hydroxyalkanoic acid) to produce the composition and optionally injection molding or thermoforming the composition into the article.

Abstract: A method of forming and controlling air gaps between adjacent raised features on a substrate includes forming a silicon-containing film in a bottom region between the adjacent raised features using a flowable deposition process. The method also includes forming carbon-containing material on top of the silicon-containing film and forming a second film over the carbon-containing material using a flowable deposition process. The second film fills an upper region between the adjacent raised features. The method also includes curing the materials at an elevated temperature for a period of time to form the air gaps between the adjacent raised features. The thickness and number layers of films can be used to control the thickness, vertical position and number of air gaps.

Abstract: Methods and apparatus for forming a sacrificial during a novel process sequence of lithography and photoresist patterning are provided. In one embodiment, a method of processing a substrate having a resist material and an anti-reflective coating material thereon includes depositing an organic polymer layer over the surface of the substrate inside a process chamber using a CVD technique. The CVD technique includes flowing a monomer into a processing region of the process chamber, flowing an initiator into the processing region through one or more filament wires heated to a temperature between about 200° C. and about 450° C., and forming the organic polymer layer. In addition, the organic polymer layer is ashable and can be removed from the surface of the substrate when the resist material is removed from the surface of the substrate.

Abstract: Embodiments of the present invention provide a vapor phase organic polymer film deposited using a CVD process at low temperature during a process sequence for wafer-level chip scale packaging (WL-CSP), including system-in package (SiP), Package-on-Package (PoP) and Package-in-Package (PiP).

Abstract: Disclosed is a substantially alternating copolymer that is conformal, hard, flexible, and has low oxygen permeability. Also disclosed is an iCVD-based method of coating a substrate with the substantially alternating copolymer.

Abstract: Disclosed is a substantially alternating copolymer that is conformal, hard, flexible, and has low oxygen permeability. Also disclosed is an iCVD-based method of coating a substrate with the substantially alternating copolymer.

Abstract: Disclosed is a substantially alternating copolymer that is conformal, hard, flexible, and has low oxygen permeability. Also disclosed is an iCVD-based method of coating a substrate with the substantially alternating copolymer.

Abstract: Disclosed is a substantially alternating copolymer that is conformal, hard, flexible, and has low oxygen permeability. Also disclosed is an iCVD-based method of coating a substrate with the substantially alternating copolymer.

Abstract: A nanofiller masterbatch comprising a nanofiller and an ethylene/ester copolymer having copolymerized units of ethylene and a comonomer selected from monoesters of C4-C8 unsaturated acids having at least two carboxylic acid groups, diesters of C4-C8 unsaturated acids having at least two carboxylic acid groups, and mixtures of two or more thereof; and a nanocomposite comprising a polyolefin and the nanofiller masterbatch are disclosed. Processes for preparing the nanofiller masterbatch and the nanocomposite are also disclosed.

Abstract: A composition comprises or is produced from polyester, a first modifier, and a second modifier wherein the first modifier includes a polymer that is incompatible with poly(hydroxyalkanoic acid) and is not an acid-containing or acid generating polymer. Also provided is an article comprising or produced from the composition.

Abstract: The present invention is a dispersion composition comprising (1) a curable mixture of monomers, oligomers, or a combination thereof; and (2) superparamagnetic particles dispersed in the mixture of part (1) and a method for preparing such superparamagnetic particles. The composition of the present invention can be useful as a tool for detecting and/or deterring theft, counterfeiting, or the like in commercial transactions.