Abstract: Examples relate to devices, systems, and methods for fluid collection such as urine. The fluid collection device a urine collection device, a first conduit, a urine collection bag having an interior region, a second conduit, and a modular pump. The urine collection device is configured to be positioned proximate to a urethra of a user. The first conduit is in fluid communication with the fluid collection device. The second conduit is in fluid communication with the interior region of the urine collection bag. The modular pump is configured to pull a vacuum and draw urine from the urine collection device through the first conduit and force the urine through the second conduit into the urine collection bag.

Abstract: An example fluid collection assembly includes a fluid impermeable barrier defining at least one opening, a chamber in fluid communication with the at least one opening, and at least one fluid outlet. The fluid collection assembly also includes at least one porous material (e.g., at least one wicking material) disposed in the chamber. The fluid collection assembly also includes at least one conduit attached to the fluid outlet. Further, the fluid collection assembly includes one or more leak prevention features.

Abstract: An intravenous infusion system with real-time infusion rate monitoring and closed-loop infusion rate control is disclosed. The intravenous infusion system comprises: an infusion module, providing drug solution through an intravenous catheter; a flow sensor module, installed around an outer periphery of the intravenous catheter, transmitting ultrasounds to the intravenous catheter and receiving ultrasounds reflected or penetrated therefrom to determine a real-time volumetric flow rate of the drug solution in the intravenous catheter, and converting the real-time volumetric flow rate into a flow rate electronic signal; and a communicating module, electrically and signally connected with the flow sensor module, receiving the flow rate electronic signal and delivering the flow rate electronic signal to an external agent connected thereto.

Abstract: An intravenous infusion system with real-time infusion rate monitoring and closed-loop infusion rate control is disclosed. The intravenous infusion system comprises: an infusion module, providing drug solution through an intravenous catheter; a flow sensor module, installed around an outer periphery of the intravenous catheter, transmitting ultrasounds to the intravenous catheter and receiving ultrasounds reflected or penetrated therefrom to determine a real-time volumetric flow rate of the drug solution in the intravenous catheter, and converting the real-time volumetric flow rate into a flow rate electronic signal; and a communicating module, electrically and signally connected with the flow sensor module, receiving the flow rate electronic signal and delivering the flow rate electronic signal to an external agent connected thereto.

Abstract: A photoacoustic medical imaging device may include a substrate, an array of ultrasonic transducers on the substrate, at least one groove etched on the substrate, at least one optical fiber, and at least one facet. Each optical fiber is disposed in one of the grooves. Each facet is etched in one of the grooves and coated with a layer of metal having high infrared reflectivity. Each optical fiber is configured to guide infrared light from a light source through the fiber and toward the respective facet. The facet is configured to reflect the infrared light toward a target.

Abstract: A therapeutic ultrasound device may include a substrate, at least one high power capacitive micromachined ultrasonic transducer, and at least one imager transducer comprising a capacitive micromachined ultrasonic transducer. The at least one high power capacitive micromachined ultrasonic transducer and the imager transducer may be monolithically integrated on the substrate.

Abstract: A photoacoustic imaging device includes an array of light sources configured and arranged to illuminate a target region and an array of ultrasonic transducers between the array of light sources and the target region. The array of transducers may be fixedly coupled to the array of light sources, and the array of ultrasonic transducers may be configured and arranged to receive ultrasound transmissions from the target region.

Abstract: Systems, apparatus, and associated methods of forming the systems and/or apparatus may include imaging devices that may comprise multiple arrays of ultrasonic transducer elements for use in a variety of applications. These multiple arrays of ultrasonic transducer elements can be arranged to form a three-dimensional imaging device. Non-coplanar arrays of ultrasonic transducer elements can be coupled together. These imaging devices may be used as medical imaging devices. Additional apparatus, systems, and methods are disclosed.

Abstract: A photoacoustic medical imaging device may include a substrate, an array of ultrasonic transducers on the substrate, at least one groove etched on the substrate, at least one optical fiber, and at least one facet. Each optical fiber is disposed in one of the grooves. Each facet is etched in one of the grooves and coated with a layer of metal having high infrared reflectivity. Each optical fiber is configured to guide infrared light from a light source through the fiber and toward the respective facet. The facet is configured to reflect the infrared light toward a target.

Abstract: A photoacoustic medical imaging device may include a substrate, an array of ultrasonic transducers on the substrate, at least one groove etched on the substrate, at least one optical fiber, and at least one facet. Each optical fiber is disposed in one of the grooves. Each facet is etched in one of the grooves and coated with a layer of metal having high infrared reflectivity. Each optical fiber is configured to guide infrared light from a light source through the fiber and toward the respective facet. The facet is configured to reflect the infrared light toward a target.

Abstract: A medical device may include a micro-machined substrate, at least one thermo-electric assembly associated with the substrate, and a cooling system configured to configured to remove heat from the a region of the substrate proximal the substrate. According to various aspects, a method of clearing plaque from a blood vessel may include implanting a micro-device in the blood vessel, wherein the micro-device may include at least one ultrasonic transducer, and operably controlling the micro-device to emit high frequency ultrasonic waves for breaking up said plaque.

Abstract: Medical imaging devices may comprise an array of ultrasonic transducer elements. Each transducer element may comprise a substrate having a doped surface creating a highly conducting surface layer, a layer of thermal oxide on the substrate, a layer of silicon nitride on the layer of thermal oxide, a layer of silicon dioxide on the layer of silicon nitride, and a layer of conducting thin film on the layer of silicon dioxide. The layers of silicon dioxide and thermal oxide may sandwich the layer of silicon nitride, and the layer of conducting thin film may be separated from the layer of silicon nitride by the layer of silicon dioxide.

Abstract: Method and device for forming a membrane includes providing a glass substrate, and depositing a thin layer of chromium on the glass substrate. The thin layer of chromium is patterned to form a deflection electrode and interconnect leads. A sacrificial layer of aluminum is deposited on top of the patterned chromium layer, then the sacrificial layer is patterned to define anchor regions. On top of the sacrificial layer, a thick layer of chromium is deposited, and the thick layer of chromium is patterned to form a membrane. The sacrificial layer is then etched to release the membrane.

Abstract: A photoacoustic imaging device includes an array of light sources configured and arranged to illuminate a target region and an array of ultrasonic transducers between the array of light sources and the target region. The array of transducers may be fixedly coupled to the array of light sources, and the array of ultrasonic transducers may be configured and arranged to receive ultrasound transmissions from the target region.

Abstract: A therapeutic ultrasound device may include a substrate, at least one high power capacitive micromachined ultrasonic transducer, and at least one imager transducer comprising a capacitive micromachined ultrasonic transducer. The at least one high power capacitive micromachined ultrasonic transducer and the imager transducer may be monolithically integrated on the substrate.

Abstract: Method and device for forming a membrane includes providing a glass substrate, and depositing a thin layer of chromium on the glass substrate. The thin layer of chromium is patterned to form a deflection electrode and interconnect leads. A sacrificial layer of aluminum is deposited on top of the patterned chromium layer, then the sacrificial layer is patterned to define anchor regions. On top of the sacrificial layer, a thick layer of chromium is deposited, and the thick layer of chromium is patterned to form a membrane. The sacrificial layer is then etched to release the membrane.

Abstract: A photoacoustic medical imaging device may include a substrate, an array of ultrasonic transducers on the substrate, at least one groove etched on the substrate, at least one optical fiber, and at least one facet. Each optical fiber is disposed in one of the grooves. Each facet is etched in one of the grooves and coated with a layer of metal having high infrared reflectivity. Each optical fiber is configured to guide infrared light from a light source through the fiber and toward the respective facet. The facet is configured to reflect the infrared light toward a target.

Abstract: A heterogeneous device comprises a substrate and a plurality of heterogeneous circuit devices defined in the substrate. In embodiments, a plurality of heterogeneous circuit devices are integrated by successively masking and ion implanting the substrate. The heterogeneous device may further comprise at least one microelectromechanical system-based element and/or at least one photodiode. In embodiments, the heterogeneous circuit devices comprise at least one CMOS transistor and at least one DMOS transistor. In embodiments, the substrate comprises a layer of silicon or a layer of p-type silicon. In other embodiments, the substrate comprises a silicon-on-insulator wafer comprising a single-crystal-silicon layer or a single-crystal-P-silicon layer, a substrate and an insulator layer therebetween.

Abstract: A memory cell uses a pair of cantilevers to store a bit of information. Changing the relative position of the cantilevers determines whether they are electrically conducting or not. The on and off state of this mechanical latch is switched by using, for example, electrostatic, electromagnetic or thermal forces applied sequentially on the two cantilevers to change their relative position. The amount of power required to change the state of the cell is reduced by supporting at least one of the cantilevers with at least one lateral projection that is placed in torsion during cantilever displacement. After a bit of data is written, the cantilevers are locked by mechanical forces inherent in the cantilevers and will not change state unless a sequential electrical writing signal is applied. The sequential nature of the required writing signal makes inadvertent, radiation or noise related data corruption unlikely.

Abstract: A heterogeneous device comprises a substrate and a plurality of heterogeneous circuit devices defined in the substrate. In embodiments, a plurality of heterogeneous circuit devices are integrated by successively masking and ion implanting the substrate. The heterogeneous device may further comprise at least one microelectromechanical system-based element and/or at least one photodiode. In embodiments, the heterogeneous circuit devices comprise at least one CMOS transistor and at least one DMOS transistor. In embodiments, the substrate comprises a layer of silicon or a layer of p-type silicon. In other embodiments, the substrate comprises a silicon-on-insulator wafer comprising a single-crystal-silicon layer or a single-crystal-P-silicon layer, a substrate and an insulator layer therebetween.