Patents by Inventor Jingkun Mao

Jingkun Mao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Shielding for a semiconductor package
    Patent number: 8129824
    Abstract: A semiconductor device has a substrate. A first die is electrically attached to a first surface of the substrate. A shield spacer having a first and second surface is provided wherein the second surface of the shield spacer is attached to a first surface of the first die. A plurality of wirebonds are attached to the shield spacer and to the substrate. A mold compound is provided for encapsulating the first die, the shield spacer, and the wirebonds.
    Type: Grant
    Filed: December 3, 2008
    Date of Patent: March 6, 2012
    Assignee: Amkor Technology, Inc.
    Inventors: Roger D. St. Amand, Nozad O. Karim, Joseph M. Longo, Lee J. Smith, Robert F. Darveaux, Jong Ok Chun, Jingkun Mao
  • System and method to provide RF shielding for a MEMS microphone package
    Patent number: 7915715
    Abstract: A semiconductor package has a substrate. An opening is formed through the substrate. A first RF shield is formed around a perimeter of the opening. A first die is attached to the first surface of the substrate and positioned over the opening.
    Type: Grant
    Filed: November 25, 2008
    Date of Patent: March 29, 2011
    Assignee: Amkor Technology, Inc.
    Inventors: Nozad O. Karim, Bob Shih Wei Kuo, Jingkun Mao
  • SYSTEM AND METHOD TO PROVIDE RF SHIELDING FOR A MEMS MICROPHONE PACKAGE
    Publication number: 20100127376
    Abstract: A semiconductor package has a substrate. An opening is formed through the substrate. A first RF shield is formed around a perimeter of the opening. A first die is attached to the first surface of the substrate and positioned over the opening.
    Type: Application
    Filed: November 25, 2008
    Publication date: May 27, 2010
    Inventors: Nozad O. Karim, Bob Shih Wei Kuo, Jingkun Mao