Abstract: Provided is a smartphone vapor chamber of a stainless steel material coated with SiO2. The smartphone vapor chamber is configured such that strength of the existing smartphone vapor chamber, which employs a copper material, is increased by employing a stainless steel material, movement of a working fluid is facilitated by forming a wick groove in the smartphone vapor chamber, all surfaces or any one surface of upper and lower plates forming the smartphone vapor chamber is coated with SiO2. Owing to the SiO2 coating, a circulation of the working fluid is accelerated by improving heat transfer, an infiltration rate, and a capillary force, heat radiation is maximized, and the smartphone vapor chamber has effects of having thermal resistance and operation performance which are similar to those of a vapor chamber using copper and of not affecting a variation in thickness of a frame.

Abstract: Provided is a vapor chamber integrated with a smartphone, and more specifically, a vapor chamber integrated with a smartphone, in which a vapor chamber unit is mounted integrally in a smartphone frame without a change in thickness, a mounting portion is formed in the smartphone frame, the vapor chamber unit is correspondingly mounted in the mounting portion, stepped portions are formed at edges of the mounting portion and the vapor chamber unit so as to facilitate corresponding fastening between the mounting portion and the vapor chamber unit, and a groove and a protrusion are further formed at the stepped portions to increase a fastening force, whereby the vapor chamber is applicable to a structure in which the vapor chamber unit is integrally coupled to the smartphone frame and a structure in which the vapor chamber unit is formed in the smartphone frame itself.

Abstract: Provided is a thin film vapor chamber for portable electronic devices. The vapor chamber includes: a lower plate formed in a plate shape and having protrusions formed on an upper surface thereof, first protrusions formed to protrude and formed on one side of the upper surface thereof to be spaced apart from each other, and a first joint body formed to protrude upward and formed inward from an outer edge thereof; and an upper plate formed in a shape corresponding to the lower plate and including a second joint body formed to protrude and joined to an upper side of the lower plate, second protrusions formed to correspond to the first protrusions, an inlet formed on an inner side of each of the second protrusions and into which a working fluid is injected, and a step formed to protrude downward to close the inlet by contact with the lower plate.

Abstract: Provided is a method of manufacturing a stainless steel (SUS) integral thin film plate type heat pipe for a smartphone frame, and more specifically, a method of manufacturing an SUS integral thin film plate type heat pipe for a smartphone frame, which is formed by coupling an upper plate and a lower plate, has an accommodation space for a working fluid formed therein, allows the working fluid to be evaporated and condensed to cool a heating unit of a smartphone, and includes various wicks formed on the upper and lower plates so that the working fluid is smoothly moved. In addition, the heat pipe may be used to be integrated into a frame of a smartphone through insert injection and may implement a frame and a cooling device of the smartphone at the same time without an increase in thickness.