Abstract: The present disclosure relates to the field of wafer processing, and discloses a wafer processing system. A wafer includes a substrate and a film on the substrate. The wafer processing system includes: an etching unit, configured to output a plurality of wafers to be separated; and a separation unit, including at least two first carrying platforms and a manipulator component, wherein the first carrying platforms are provided on a side of the etching unit, and are configured to carry the plurality of wafers to be separated, and the manipulator component is switched in turns at each position of all the first carrying platforms, and separates the films of the plurality of wafers on the first carrying platform from the substrates.