Patents by Inventor Jingsheng XIA
Jingsheng XIA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10624203Abstract: The disclosure discloses an optical module, and relates to the field of optic fiber communications. A circuit according to an embodiment of the disclosure includes: a chip, which includes at least one wiring side, and on which there are arranged first signal interface pads arranged parallel to the wiring side; a circuit board on which there are arranged a number of second signal interface pads corresponding to the first signal interface pads, wherein at least two of the distances between the respective second signal interface pads and the wiring side are different from each other; and signal wires configured to connect the corresponding first signal interface pads and second signal interface pads.Type: GrantFiled: July 6, 2018Date of Patent: April 14, 2020Assignees: Hisense Broadband Multimedia Technologies Co., Ltd., Hisense USA Corporation, Hisense International Co., Ltd.Inventors: Sigeng Yang, Shijian Ben, Jingsheng Xia, Yongliang Huang
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Patent number: 10459180Abstract: The disclosure provides an optical module, including a housing, a circuit board and a light conducting structure; a portion of the light conducting structure is disposed in the housing, another portion of the light conducting structure juts out from the housing; the circuit board is provided with a light source, and the light conducting structure is configured to conduct light emitted by the light source to an outside of the housing. The optical conducting module in the optical module can conduct light emitted from the optical module to outside of the optical module. The optical module allows the state inside the optical module to be conducted to and displayed in the outside of the optical module with optical signals as propagation medium. The state inside the optical module can be directly learned from the outside of the optical module housing, thereby extending application scenarios of the optical module.Type: GrantFiled: April 24, 2018Date of Patent: October 29, 2019Assignees: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD., HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES, LTD.Inventors: Sigeng Yang, Yinlong Liu, Yongliang Huang, Shijian Ben, Jingsheng Xia, Peng He, Haiqiang Xu, Shengwei Bo, Tengyue Li
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Publication number: 20180314018Abstract: The disclosure provides an optical module, including a housing, a circuit board and a light conducting structure; a portion of the light conducting structure is disposed in the housing, another portion of the light conducting structure juts out from the housing; the circuit board is provided with a light source, and the light conducting structure is configured to conduct light emitted by the light source to an outside of the housing. The optical conducting module in the optical module can conduct light emitted from the optical module to outside of the optical module. The optical module allows the state inside the optical module to be conducted to and displayed in the outside of the optical module with optical signals as propagation medium. The state inside the optical module can be directly learned from the outside of the optical module housing, thereby extending application scenarios of the optical module.Type: ApplicationFiled: April 24, 2018Publication date: November 1, 2018Inventors: SIGENG YANG, YINLONG LIU, YONGLIANG HUANG, SHIJIAN BEN, JINGSHENG XIA, PENG HE, HAIQIANG XU, SHENGWEI BO, TENGYUE LI
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Publication number: 20180317315Abstract: The disclosure discloses an optical module, and relates to the field of optic fiber communications. A circuit according to an embodiment of the disclosure includes: a chip, which includes at least one wiring side, and on which there are arranged first signal interface pads arranged parallel to the wiring side; a circuit board on which there are arranged a number of second signal interface pads corresponding to the first signal interface pads, wherein at least two of the distances between the respective second signal interface pads and the wiring side are different from each other; and signal wires configured to connect the corresponding first signal interface pads and second signal interface pads.Type: ApplicationFiled: July 6, 2018Publication date: November 1, 2018Inventors: Sigeng YANG, Shijian BEN, Jingsheng XIA, Yongliang HUANG
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Patent number: 9983373Abstract: The disclosure provides an optical module, including a housing, a circuit board and a light conducting structure; a portion of the light conducting structure is disposed in the housing, another portion of the light conducting structure juts out from the housing; the circuit board is provided with a light source, and the light conducting structure is configured to conduct light emitted by the light source to an outside of the housing. The optical conducting module in the optical module can conduct light emitted from the optical module to outside of the optical module. The optical module allows the state inside the optical module to be conducted to and displayed in the outside of the optical module with optical signals as propagation medium. The state inside the optical module can be directly learned from the outside of the optical module housing, thereby extending application scenarios of the optical module.Type: GrantFiled: December 30, 2016Date of Patent: May 29, 2018Assignees: Hisense Broadband Multimedia Technologies Co., Ltd., Hisense Broadband Multimedia Technologies Ltd.Inventors: Sigeng Yang, Yinlong Liu, Yongliang Huang, Shijian Ben, Jingsheng Xia, Peng He, Haiqiang Xu, Shengwei Bo, Tengyue Li
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Publication number: 20170363827Abstract: The disclosure provides an optical module, including a housing, a circuit board and a light conducting structure; a portion of the light conducting structure is disposed in the housing, another portion of the light conducting structure juts out from the housing; the circuit board is provided with a light source, and the light conducting structure is configured to conduct light emitted by the light source to an outside of the housing. The optical conducting module in the optical module can conduct light emitted from the optical module to outside of the optical module. The optical module allows the state inside the optical module to be conducted to and displayed in the outside of the optical module with optical signals as propagation medium. The state inside the optical module can be directly learned from the outside of the optical module housing, thereby extending application scenarios of the optical module.Type: ApplicationFiled: December 30, 2016Publication date: December 21, 2017Inventors: SIGENG YANG, YINLONG LIU, YONGLIANG HUANG, SHIJIAN BEN, JINGSHENG XIA, PENG HE, HAIQIANG XU, SHENGWEI BO, TENGYUE LI
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Publication number: 20170208678Abstract: The disclosure discloses an optical module, and relates to the field of optic fiber communications. A circuit according to an embodiment of the disclosure includes: a chip, which includes at least one wiring side, and on which there are arranged first signal interface pads arranged parallel to the wiring side; a circuit board on which there are arranged a number of second signal interface pads corresponding to the first signal interface pads, wherein at least two of the distances between the respective second signal interface pads and the wiring side are different from each other; and signal wires configured to connect the corresponding first signal interface pads and second signal interface pads.Type: ApplicationFiled: September 19, 2016Publication date: July 20, 2017Inventors: Sigeng YANG, Shijian BEN, Jingsheng XIA, Yongliang HUANG