Abstract: The present disclosure provides a functional substrate and a preparation method thereof, and belongs to the technical field of passive devices. A functional substrate of the present disclosure has a central region and a peripheral region surrounding the central region; the functional substrate includes: a dielectric substrate including a first surface and a second surface opposite to each other in a thickness direction thereof; the dielectric substrate includes functional holes and anchor holes each at least penetrating through the first surface; wherein the functional holes are located in the central region and the anchor holes are located in the peripheral region; the first connection structure is in the functional hole, the second connection structure is in the anchor hole, and the first connection structure and the second connection structure are made of the same material.

Abstract: An encapsulation substrate and a manufacturing method therefor, and a functional substrate and a manufacturing method therefor are provided. The method for manufacturing an encapsulation substrate includes providing an initial substrate having first and second surfaces oppositely arranged along a thickness direction thereof; processing the initial substrate to form a blind hole extending through a part of the initial substrate in the thickness direction; forming a first connection electrode in the blind hole, and forming a first signal trace on the first surface; thinning the initial substrate from a side of the second surface to form a dielectric substrate and expose the first connection electrode; forming a second signal trace on a side of the dielectric substrate away from the first signal trace such that one of the first and second signal traces is electrically connected to the chip; the other one is electrically connected to the printed circuit board.

Abstract: A composite substrate, a method for manufacturing a composite substrate, and an electronic device are provided.

Abstract: Sensing circuit, detection control method, fingerprint identification module and display apparatus are provided. The sensing circuit comprises a photoelectric conversion element, an energy storage circuit, a switch control circuit, a discharge control circuit and a voltage conversion circuit. The photoelectric conversion element controls potential of first terminal of energy storage circuit according to received optical signal; the switch control circuit controls first terminal of energy storage circuit to be connected to or disconnected from conversion control node; the discharge control circuit controls conversion control node be connected to or disconnected from first voltage terminal; the voltage conversion circuit controls to output voltage signal outputted by output terminal according to second and/or third voltage signals.

Abstract: Sensing circuit, detection control method, fingerprint identification module and display apparatus are provided. The sensing circuit comprises a photoelectric conversion element, an energy storage circuit, a switch control circuit, a discharge control circuit and a voltage conversion circuit. The photoelectric conversion element controls potential of first terminal of energy storage circuit according to received optical signal; the switch control circuit controls first terminal of energy storage circuit to be connected to or disconnected from conversion control node; the discharge control circuit controls conversion control node be connected to or disconnected from first voltage terminal; the voltage conversion circuit controls to output voltage signal outputted by output terminal according to second and/or third voltage signals.