Abstract: The present disclosure discloses a preparation method for a transparent conductive polymer film, wherein the method comprises the following steps: (a) providing a precursor solution, wherein the precursor solution comprises a main solvent, an auxiliary solvent, an oxidizing agent and a thiophene monomer, wherein the auxiliary solvent comprises one or more of water, an aqueous solution containing hydrogen ions, a cyclic amide, a cyclic urea, a chain alkyl urea, phosphate or phosphoramide, and (b) coating the surface of a substrate with the precursor solution, so that the thiophene monomer is subjected to a polymerization reaction to form a conductive polymer film. The preparation method according to the present disclosure is economical, effective and simple, and the fabrication of high-quality transparent conductive polymer films by a one-step solution method has promising applications.

Abstract: A dual wafer stage exchanging system for a lithographic device is disclosed, said system comprises two wafer stages running between an exposure workstation and a pre-processing workstation, and said two stages are set on a base and suspended above the upper surface of the base by air bearings. Each wafer stages is passed through by a Y-direction guide rail respectively, wherein one end of said guide rail is connected with a main driving unit and another end of said guide rail is detachably coupled with one of the two X-direction auxiliary driving units with single degree of freedom, and said two wafer stages are capable of moving in Y-direction along the guide rails and moving in X-direction under the drive of the auxiliary driving units with single degree of freedom. The position exchange of said two wafer stages can be enabled by the detachment and connection of the Y-direction guide rails and the auxiliary units with single degree of freedom.

Abstract: A dual-stage exchange system for a lithographic apparatus comprises a silicon chip stage (13) operating in an exposure workstation (3) and a silicon chip (14) stage operating in a pre-processing workstation (4). The two silicon chip stages (13, 14) are provided on the same base stage (1), and suspended on an upper surface (2) of the base stage by air bearings. The two silicon chip stages (13, 14) can move along guide rails (15, 16) in the Y direction. One end of each guide rail (15, 16) is connected to a main driving unit (11, 12), and the other end of each guide rail (15, 16) is butt-jointed with an X-direction single-freedom auxiliary driving unit (7, 8). The silicon chip stages (13, 14) are driven by the single-freedom auxiliary driving units (7, 8) cooperated with the main driving units (11, 12) to move along the X direction.

Abstract: A dual-stage exchange system for a lithographic apparatus comprises a silicon chip stage (10) operating in an exposure workstation (6) and a silicon chip stage (12) operating in a pre-processing workstation (7). Each silicon chip stage (10, 12) is supported by a six-freedom micro-motion stage, respectively. The silicon chip stage (10, 12) and the six-freedom micro-motion stage form a silicon chip stage group. The two silicon chip stage groups are provided on the same rectangular base stage (1) and suspended on an upper surface (2) of the base sage by air bearings. A double-freedom driving unit (21a, 21b, 22a, 22b) is provided on each edge of the base stage (1), respectively. The six-freedom micro-motion stage of the silicon chip stage group has an upper layer driver and a lower layer driver, capable of achieving six-freedom control.

Abstract: A dual wafer stage exchanging system for a lithographic device is disclosed, said system comprises two wafer stages running between an exposure workstation and a pre-processing workstation, and said two stages are set on a base and suspended above the upper surface of the base by air bearings. Each wafer stages is passed through by a Y-direction guide rail respectively, wherein one end of said guide rail is connected with a main driving unit and another end of said guide rail is detachably coupled with one of the two X-direction auxiliary driving units with single degree of freedom, and said two wafer stages are capable of moving in Y-direction along the guide rails and moving in X-direction under the drive of the auxiliary driving units with single degree of freedom. The position exchange of said two wafer stages can be enabled by the detachment and connection of the Y-direction guide rails and the auxiliary units with single degree of freedom.

Abstract: A dual-stage exchange system for a lithographic apparatus comprises a silicon chip stage (13) operating in an exposure workstation (3) and a silicon chip (14) stage operating in a pre-processing workstation (4). The two silicon chip stages (13, 14) are provided on the same base stage (1), and suspended on an upper surface (2) of the base stage by air bearings. The two silicon chip stages (13, 14) can move along guide rails (15, 16) in the Y direction. One end of each guide rail (15, 16) is connected to a main driving unit (11, 12), and the other end of each guide rail (15, 16) is butt-jointed with an X-direction single-freedom auxiliary driving unit (7, 8). The silicon chip stages (13, 14) are driven by the single-freedom auxiliary driving units (7, 8) cooperated with the main driving units (11, 12) to move along the X direction.

Abstract: A dual-stage exchange system for a lithographic apparatus comprises a silicon chip stage (10) operating in an exposure workstation (6) and a silicon chip stage (12) operating in a pre-processing workstation (7). Each silicon chip stage (10, 12) is supported by a six-freedom micro-motion stage, respectively. The silicon chip stage (10, 12) and the six-freedom micro-motion stage form a silicon chip stage group. The two silicon chip stage groups are provided on the same rectangular base stage (1) and suspended on an upper surface (2) of the base sage by air bearings. A double-freedom driving unit (21a, 21b, 22a, 22b) is provided on each edge of the base stage (1), respectively. The six-freedom micro-motion stage of the silicon chip stage group has an upper layer driver and a lower layer driver, capable of achieving six-freedom control.

Abstract: Inhibitors that block the DC-SIGN mediated transmission of the HIV-virus from mucosal infection sites to T-lymphocytes. In one embodiment, the inhibitors include at least one oligosaccharide chain attached to a scaffolding framework in which the number of the oligosaccharide chains attached to the scaffold can be 2, 3, 4 or more. In another embodiment, HIV-I viral infection is treated by administration of a composition including a therapeutically effective amount of an oligosaccharide cluster and/or oligosaccharide/protein cluster binding DC-SIGN, to inhibit DC-SIGN from binding to HIV envelope glycoprotein.