Patents by Inventor Jin-Gyo Kim

Jin-Gyo Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CMP SLURRY COMPOSITION FOR POLISHING TUNGSTEN PATTERN WAFER AND METHOD OF POLISHING TUNGSTEN PATTERN WAFER USING THE SAME
    Publication number: 20230220241
    Abstract: A CMP slurry composition for polishing a tungsten pattern wafer and a method of polishing a tungsten pattern wafer, the CMP slurry composition includes a solvent; an abrasive agent containing silica modified with a silane compound having at least one nitrogen atom; and an alkylene oxide group-containing fluorine surfactant.
    Type: Application
    Filed: November 7, 2022
    Publication date: July 13, 2023
    Inventors: Tae Won PARK, Jin Gyo KIM, Ji Ho LEE, Eui Rang LEE, Dong Hyeon LEE
  • ALUMINUM ALLOY MATERIAL
    Publication number: 20220127702
    Abstract: An aluminum alloy material contains Mg: 7.0% to 10.0% (% by mass, the same applies hereinafter) and Ca: not more than 0.1%, and the aluminum alloy material contains a remainder constituted by aluminum and an inevitable impurity. The aluminum alloy material has a tensile strength of not less than 300 MPa and less than 500 MPa and an elongation of not less than 20%.
    Type: Application
    Filed: October 8, 2020
    Publication date: April 28, 2022
    Inventors: Tomohito Kurosaki, Tadashi Minoda, Mitsuhiro Tamaki, Jin-Gyo Kim
  • ALUMINUM ALLOY MATERIAL
    Publication number: 20220127701
    Abstract: An aluminum alloy material contains Mg: 7.0% to 10.0% (% by mass, the same applies hereinafter) and Ca: not more than 0.1%, and the aluminum alloy material contains a remainder constituted by aluminum and an inevitable impurity. The aluminum alloy material has a tensile strength of not less than 500 MPa and an elongation of not less than 3% and less than 10%.
    Type: Application
    Filed: October 8, 2020
    Publication date: April 28, 2022
    Inventors: Tomohito Kurosaki, Tadashi Minoda, Mitsuhiro Tamaki, Jin-Gyo Kim
  • Composition for forming silica layer, silica layer, and electronic device
    Patent number: 10020185
    Abstract: A composition for forming a silica layer including a silicon-containing polymer having a weight average molecular weight of about 20,000 to about 70,000 and a polydispersity index of about 5.0 to about 17.0 and a solvent; a silica layer manufactured using the same; and an electronic device including the silica layer.
    Type: Grant
    Filed: May 22, 2015
    Date of Patent: July 10, 2018
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Hui-Chan Yun, Woo-Han Kim, Sang-Ran Koh, Taek-Soo Kwak, Bo-Sun Kim, Jin-Gyo Kim, Yoong-Hee Na, Kun-Bae Noh, Sae-Mi Park, Jin-Hee Bae, Jun Sakong, Eun-Seon Lee, Wan-Hee Lim, Jun-Young Jang, Il Jung, Byeong-Gyu Hwang
  • COMPOSITION FOR FORMING SILICA LAYER, SILICA LAYER, AND ELECTRONIC DEVICE
    Publication number: 20160099145
    Abstract: A composition for forming a silica layer including a silicon-containing polymer having a weight average molecular weight of about 20,000 to about 70,000 and a polydispersity index of about 5.0 to about 17.0 and a solvent; a silica layer manufactured using the same; and an electronic device including the silica layer.
    Type: Application
    Filed: May 22, 2015
    Publication date: April 7, 2016
    Inventors: Hui-Chan Yun, Woo-Han Kim, Sang-Ran Koh, Taek-Soo Kwak, Bo-Sun Kim, Jin-Gyo Kim, Yoong-Hee Na, Kun-Bae Noh, Sae-Mi Park, Jin-Hee Bae, Jun Sakong, Eun-Seon Lee, Wan-Hee Lim, Jun-Young Jang, Il Jung, Byeong-Gyu Hwang