Abstract: A method of forming an ultrasonic wave sensing module for a vehicle includes providing a housing having a first containing space and a second containing space separated from each other by a blocking wall, and providing an adapter at the blocking wall that includes a first connecting portion and a first connecting pin. An ultrasonic wave sensor is disposed in the first containing space and a circuit board is disposed in the second containing space. A second connecting pin of the ultrasonic wave sensor extends into the blocking wall and is coupled to the first connecting portion of the adapter at the blocking wall. A second connecting portion of the circuit board is coupled to the first connecting pin of the adapter. The ultrasonic wave sensor is electrically connected with the circuit board via the adapter.

Abstract: A method of forming an ultrasonic wave sensing module for a vehicle includes providing a housing having a first containing space and a second containing space separated from each other by a blocking wall, and providing an adapter at the blocking wall that includes a first connecting portion and a first connecting pin. An ultrasonic wave sensor is disposed in the first containing space and a circuit board is disposed in the second containing space. A second connecting pin of the ultrasonic wave sensor extends into the blocking wall and is coupled to the first connecting portion of the adapter at the blocking wall. A second connecting portion of the circuit board is coupled to the first connecting pin of the adapter. The ultrasonic wave sensor is electrically connected with the circuit board via the adapter.

Abstract: An ultrasonic wave sensing module includes a housing, an ultrasonic wave sensor, an adapter, and a circuit board. The housing has a first containing space and a second containing space being separated from each other by a blocking wall. The ultrasonic wave sensor is disposed within the first containing space and has a first connecting pin. The adapter includes a first connecting portion and a second connecting pin, and is integrally formed with the blocking wall by means of insert molding. The circuit board is provided within the second containing space, and has a second connecting portion. The first connecting pin of the ultrasonic wave sensor is coupled to the first connecting portion of the adapter, and the second connecting pin of the adapter is coupled to the second connecting portion of the circuit board, so that the ultrasonic wave sensor and the circuit board are electrically connected.

Abstract: An ultrasonic wave sensing module includes a housing, an ultrasonic wave sensor, an adapter, and a circuit board. The housing has a first containing space and a second containing space being separated from each other by a blocking wall. The ultrasonic wave sensor is disposed within the first containing space and has a first connecting pin. The adapter includes a first connecting portion and a second connecting pin, and is integrally formed with the blocking wall by means of insert molding. The circuit board is provided within the second containing space, and has a second connecting portion. The first connecting pin of the ultrasonic wave sensor is coupled to the first connecting portion of the adapter, and the second connecting pin of the adapter is coupled to the second connecting portion of the circuit board, so that the ultrasonic wave sensor and the circuit board are electrically connected.