Abstract: A method for fabricating a CMOS integrated circuit (IC) includes the step of providing a substrate having a semiconductor surface. A gate stack including a metal gate electrode on a metal including high-k dielectric layer is formed on the semiconductor surface. Dry etching is used to pattern the gate stack to define a patterned gate electrode stack having exposed sidewalls of the metal gate electrode. The dry etching forms post etch residuals some of which are deposited on the substrate. The substrate including the patterned gate electrode stack is exposed to a solution cleaning sequence including a first clean step including a first acid and a fluoride for removing at least a portion of the post etch residuals, wherein the first clean step has a high selectivity to avoid etching the exposed sidewalls of the metal gate electrode. A second clean after the first clean consists essentially of a fluoride which removes residual high-k material on the semiconductor surface.

Abstract: A method for fabricating a CMOS integrated circuit (IC) includes the step of providing a substrate having a semiconductor surface. A gate stack including a metal gate electrode on a metal including high-k dielectric layer is formed on the semiconductor surface. Dry etching is used to pattern the gate stack to define a patterned gate electrode stack having exposed sidewalls of the metal gate electrode. The dry etching forms post etch residuals some of which are deposited on the substrate. The substrate including the patterned gate electrode stack is exposed to a solution cleaning sequence including a first clean step including a first acid and a fluoride for removing at least a portion of the post etch residuals, wherein the first clean step has a high selectivity to avoid etching the exposed sidewalls of the metal gate electrode. A second clean after the first clean consists essentially of a fluoride which removes residual high-k material on the semiconductor surface.

Abstract: A method of forming an integrated circuit having an NMOS transistor and a PMOS transistor is disclosed. The method includes performing pre-gate processing in a NMOS region and a PMOS region over and/or in a semiconductor body, and depositing a polysilicon layer over the semiconductor body in both the NMOS and PMOS regions. The method further includes performing a first type implant into the polysilicon layer in one of the NMOS region and PMOS region, and performing an amorphizing implant into the polysilicon layer in both the NMOS and PMOS regions, thereby converting the polysilicon layer into an amorphous silicon layer. The method further includes patterning the amorphous silicon layer to form gate electrodes, wherein a gate electrode resides in both the NMOS and PMOS regions.

Abstract: In accordance with the present teachings, methods of making dual doped polysilicon gates are provided. The method can include providing a semiconductor structure including a plurality of polysilicon gates having a first critical dimension disposed over a dielectric layer and planarizing the plurality of polysilicon gates with a spin-on material to form a plurality of planarized polysilicon gates. The method can further include doping an exposed first region with p-type dopants to form a plurality of p-doped planarized polysilicon gates and doping an exposed second region with n-type dopants to form a plurality of n-doped planarized polysilicon gates. The method can also include removing the spin-on material to form a plurality of p-doped polysilicon gates and a plurality of n-doped polysilicon gates, wherein critical dimension of each of the plurality of n-doped polysilicon gates and the plurality of p-doped polysilicon gates are substantially similar to the first critical dimension.

Abstract: A method of manufacturing a semiconductor device. The method comprises forming a gate stack layer. The gate stack has an insulating layer on a substrate, a metal-containing layer on the insulating layer, a metal nitride barrier layer on the metal-containing layer, and a silicon-containing layer on the metal nitride barrier layer. The method also comprises patterning the gate stack layer. Pattering includes a plasma etch of the metal nitride barrier layer. The plasma etch has a chloride-containing feed gas and a physical etch component. The physical etch component includes a high-mass species having a molecular weight of greater than about 71 gm/mol.

Abstract: In one aspect, there us provided a method of manufacturing a semiconductor device that comprises placing an oxide layer over a gate electrode and sidewall spacers located adjacent thereto, placing a protective layer over the oxide layer, conducting a plasma etch to remove portions of the protective layer and the first oxide layer that are located over the gate electrode and expose a surface of the gate electrode, wherein the plasma etch is selective to polysilicon. A soft etch is conducted subsequent to the plasma etch. The soft etch includes an inorganic-based fluorine containing gas and an inert gas, wherein the plasma etch leaves a film on the gate electrode that inhibits silicidation of the gate electrode and wherein the soft etch removes the film. The gate electrode is silicided with a metal subsequent to conducting the soft etch.

Abstract: A method of etching metals and/or metal-containing compounds using a plasma comprising a bromine-containing gas. In one embodiment, the method is used during fabrication of a gate structure of a field effect transistor having a titanium nitride gate electrode, an ultra-thin (about 10 to 20 Angstroms) silicon dioxide gate dielectric, and a polysilicon upper contact. In a further embodiment, the gate electrode is selectively notched to a pre-determined width.

Abstract: A method of plasma etching tungsten silicide over polysilicon particularly useful in fabricating flash memory having both a densely packed area and an open (iso) area requiring a long over etch due to microloading. Wafer biasing is decreased in the over etch. The principal etchant include NF3 and Cl2. Argon is added to prevent undercutting at the dense/iso interface. Oxygen and nitrogen oxidize any exposed silicon to increase etch selectivity and straightens the etch profile. SiCl4 as an example of a silicon and chlorine containing passivating gas may be added for additional selectivity.

Abstract: A method of plasma etching tungsten silicide over polysilicon particularly useful in fabricating flash memory having both a densely packed area and an open (iso) area requiring a long over etch due to microloading. Wafer biasing is decreased in the over etch. The principal etchant include NF3 and Cl2. Argon is added to prevent undercutting at the dense/iso interface. Oxygen and nitrogen oxidize any exposed silicon to increase etch selectivity and straightens the etch profile. SiCl4 may be added for additional selectivity.

Abstract: A method of etching oxide in a high-density plasma using a fluorinated hydrocarbon gas and a fluorocarbon gas chemistry to provide a selectivity of oxide to photoresist in excess of 300:1.

Abstract: A method of etching metals and/or metal-containing compounds using a plasma comprising a bromine-containing gas. In one embodiment, the method is used during fabrication of a gate structure of a field effect transistor having a titanium nitride gate electrode, an ultra-thin (about 10 to 20 Angstroms) silicon dioxide gate dielectric, and a polysilicon upper contact. In a further embodiment, the gate electrode is selectively notched to a pre-determined width.

Abstract: We have developed a method of selectively etching silicon nitride relative to oxides in a high density plasma chamber of the kind presently known in the art. We have obtained selectivities for silicon nitride:silicon oxide in the range of about 15:1 to about 24:1. We have employed the method in the etching of silicon nitride spacers for sub 0.25 &mgr;m devices, where the spacers are adjacent to exposed oxides during the etch process. We have obtained silicon nitride spacers having rounded top corners and an extended “tail” toward the bottom outer edge of the nitride spacer. The method employs a plasma source gas which typically includes SF6, HBr, N2 and optionally, O2. Typically, the pressure in the etch chamber during etching is at least 35 mTorr and the substrate temperature is about 20° C. or less.

Abstract: We have developed a method of selectively etching silicon nitride relative to oxides in a high density plasma chamber of the kind presently known in the art. We have obtained selectivities for silicon nitride:silicon oxide in the range of about 15:1 to about 24:1. We have employed the method in the etching of silicon nitride spacers for sub 0.25 &mgr;m devices, where the spacers are adjacent to exposed oxides during the etch process. We have obtained silicon nitride spacers having rounded top corners and an extended “tail” toward the bottom outer edge of the nitride spacer. The method employs a plasma source gas which typically includes SF6, HBr, N2 and optionally, O2. Typically, the pressure in the etch chamber during etching is at least 35 mTorr and the substrate temperature is about 20° C. or less.