Patents by Inventor Jin Hui MENG

Jin Hui MENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Die bonding tool and system
    Patent number: 10096568
    Abstract: Disclosed is a die bonding tool comprising: a rigid body; and a collet having a die-holding portion; wherein the collet is mechanically coupled to the rigid body by a flexible element which is configured to angularly deflect relative to the rigid body on application of a torque to the collet and/or to a die held by the collet. Also disclosed is a die bonding system comprising the die bonding tool, and an adhesive dispenser for a die bonding system.
    Type: Grant
    Filed: September 18, 2014
    Date of Patent: October 9, 2018
    Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD
    Inventors: Kwok Yuen Cheung, Kwok Wah Tong, Jin Hui Meng, Wan Yin Yau, Man Kit Chow
  • DIE BONDING TOOL AND SYSTEM
    Publication number: 20160086830
    Abstract: Disclosed is a die bonding tool comprising: a rigid body; and a collet having a die-holding portion; wherein the collet is mechanically coupled to the rigid body by a flexible element which is configured to angularly deflect relative to the rigid body on application of a torque to the collet and/or to a die held by the collet. Also disclosed is a die bonding system comprising the die bonding tool, and an adhesive dispenser for a die bonding system.
    Type: Application
    Filed: September 18, 2014
    Publication date: March 24, 2016
    Inventors: Kwok Yuen CHEUNG, Kwok Wah TONG, Jin Hui MENG, Wan Yin YAU, Man Kit CHOW
  • Universal die detachment apparatus
    Patent number: 8470130
    Abstract: A die detachment apparatus for partially delaminating a die from an adhesive tape on which it is mounted comprises a cover having a support surface that is operative to support the adhesive tape, the support surface including a set of cover holes. A movable pin chuck is positioned below the support surface and includes a set of pin holes that are arranged coaxially with the cover holes. The movable pin chuck is configured for detachably inserting a set of pins in a first desired configuration on some of the pin holes, and the pins are also operable to be relocated on the pin chuck to form another desired configuration. The pins are operative to protrude from the cover by passing through the cover holes to contact and lift the die.
    Type: Grant
    Filed: October 14, 2010
    Date of Patent: June 25, 2013
    Assignee: ASM Assembly Automation Ltd
    Inventors: Chi Ming Chong, Jin Hui Meng, Man Wai Chan, Yuk Cheung Au
  • UNIVERSAL DIE DETACHMENT APPARATUS
    Publication number: 20110088845
    Abstract: A die detachment apparatus for partially delaminating a die from an adhesive tape on which it is mounted comprises a cover having a support surface that is operative to support the adhesive tape, the support surface including a set of cover holes. A movable pin chuck is positioned below the support surface and includes a set of pin holes that are arranged coaxially with the cover holes. The movable pin chuck is configured for detachably inserting a set of pins in a first desired configuration on some of the pin holes, and the pins are also operable to be relocated on the pin chuck to form another desired configuration. The pins are operative to protrude from the cover by passing through the cover holes to contact and lift the die.
    Type: Application
    Filed: October 14, 2010
    Publication date: April 21, 2011
    Inventors: Chi Ming CHONG, Jin Hui MENG, Man Wai CHAN, Yuk Cheung AU