Abstract: A method by a user equipment (UE) in a wireless communication system includes: receiving a first physical downlink shared channel (PDSCH) transmission and a second PDSCH transmission that carry a same transport block (TB) and are associated with a first transmission configuration indicator (TCI) state and a second TCI state, respectively; determining a transport block size (TBS) of the first PDSCH transmission; and determining low-density parity-check (LDPC) base graph corresponding to the transport block based on the determined TBS for each of the first PDSCH transmission and the second PDSCH transmission, wherein the determined TBS of the first PDSCH transmission is applied to the second PDSCH transmission.

Abstract: An example electronic device may receive user input in a state in which security of the electronic device is configured; based on receiving of the user input, display a designated screen on a display; acquire image data including a face of a user through an image sensor; detect a radial movement from a part of the face using a DVS while acquiring the image data; detect first face data corresponding to the face from the image data and compare the detected first face data with second face data stored in the electronic device; and, based on the detection of the radial movement and correspondence between the first face data and the second face data, release the state in which the security is configured.

Abstract: A semiconductor package includes a package substrate. An interposer is disposed on the package substrate. The interposer includes a semiconductor substrate, a wiring layer disposed on an upper surface of the semiconductor substrate and having a plurality of wirings therein, redistribution wiring pads disposed on the wiring layer and electrically connected to the wirings, bonding pads disposed on the redistribution wiring pads, and an insulation layer pattern disposed on the wiring layer and exposing at least a portion of the bonding pad, and first and second semiconductor devices disposed on the interposer. The first and second semiconductor devices are spaced apart from each other and are electrically connected to each other by at least one of the wirings.

Abstract: A semiconductor package includes a package substrate. An interposer is disposed on the package substrate. The interposer in a semiconductor substrate, a wiring layer disposed on an upper surface of the semiconductor substrate and having a plurality of wirings therein, redistribution wiring pads disposed on the wiring layer and electrically connected to the wirings, bonding pads disposed on the redistribution wiring pads, and an insulation layer pattern disposed on the wiring layer and exposing at least a portion of the bonding pad, and first and second semiconductor devices disposed on the interposer. The first and second semiconductor devices are spaced apart from each other and are electrically connected to each other by at least one of the wirings.

Abstract: A semiconductor package including a substrate including, at an upper surface thereof, an inner area and an edge area surrounding the inner area, a chip set on the inner area of the substrate, a stiffener set on the edge area of the substrate, the stiffener set including a plurality of stiffeners spaced apart from one another, and an adhesive member attaching the plurality of stiffeners to the substrate may be provided.

Abstract: A semiconductor package includes a package substrate. An interposer is disposed on the package substrate. The interposer in a semiconductor substrate, a wiring layer disposed on an upper surface of the semiconductor substrate and having a plurality of wirings therein, redistribution wiring pads disposed on the wiring layer and electrically connected to the wirings, bonding pads disposed on the redistribution wiring pads, and an insulation layer pattern disposed on the wiring layer and exposing at least a portion of the bonding pad, and first and second semiconductor devices disposed on the interposer. The first and second semiconductor devices are spaced apart from each other and are electrically connected to each other by at least one of the wirings.