Patents by Inventor Jin Hyung TAK

Jin Hyung TAK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus, method and recording medium storing command for determining mounting information
    Patent number: 11770921
    Abstract: The present disclosure provides an apparatus for determining mounting information. The apparatus according to the present disclosure may be configured to acquire solder measurement information indicating a state of a solder printed on a first substrate, determine whether or not the state of the solder is changed from states of solders printed on second substrates, which are measured prior to measurement of the first substrate, based on the solder measurement information, upon the determination that the state of the solder is not changed, determine mounting information indicating a mounting condition for mounting a first component on the first substrate using one or more models, and deliver the mounting information to a mounter. The one or more models may be configured to output the mounting information based on a correlation between states of a second component before and after a reflow process for each of the second substrates.
    Type: Grant
    Filed: April 20, 2021
    Date of Patent: September 26, 2023
    Assignee: KOH YOUNG TECHNOLOGY INC.
    Inventors: Duk Young Lee, Jae Hwan Lee, Jin Hyung Tak, Chan Woo Park, Guk Han
  • APPARATUS, METHOD AND RECORDING MEDIUM STORING COMMAND FOR DETERMINING MOUNTING INFORMATION
    Publication number: 20220142028
    Abstract: The present disclosure provides an apparatus for determining mounting information. The apparatus according to the present disclosure may be configured to acquire solder measurement information indicating a state of a solder printed on a first substrate, determine whether or not the state of the solder is changed from states of solders printed on second substrates, which are measured prior to measurement of the first substrate, based on the solder measurement information, upon the determination that the state of the solder is not changed, determine mounting information indicating a mounting condition for mounting a first component on the first substrate using one or more models, and deliver the mounting information to a mounter. The one or more models may be configured to output the mounting information based on a correlation between states of a second component before and after a reflow process for each of the second substrates.
    Type: Application
    Filed: April 20, 2021
    Publication date: May 5, 2022
    Applicant: KOH YOUNG TECHNOLOGY INC.
    Inventors: Duk Young LEE, Jae Hwan LEE, Jin Hyung TAK, Chan Woo PARK, Guk HAN