Patents by Inventor Jini SHIM

Jini SHIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package and method of manufacturing same
    Patent number: 10964656
    Abstract: The present invention relates to a semiconductor package and a method of manufacturing the same. In a semiconductor package which electrically connects a semiconductor chip and a printed circuit board using a solder ball, the semiconductor package further includes a thermal buffer layer which is positioned on a semiconductor chip, absorbs and disperse heat generated by the semiconductor chip, increases a distance between the semiconductor chip and a printed circuit board to decrease a deviation of a heat conduction process, and has a thickness ranging from 7.5 to 50% of a diameter of a solder ball.
    Type: Grant
    Filed: May 30, 2019
    Date of Patent: March 30, 2021
    Assignee: NEPES CO., LTD.
    Inventors: Yong Tae Kwon, Hee Cheol Kim, Seung Jun Moon, Jini Shim
  • SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME
    Publication number: 20190378807
    Abstract: The present invention relates to a semiconductor package and a method of manufacturing the same. In a semiconductor package which electrically connects a semiconductor chip and a printed circuit board using a solder ball, the semiconductor package further includes a thermal buffer layer which is positioned on a semiconductor chip, absorbs and disperse heat generated by the semiconductor chip, increases a distance between the semiconductor chip and a printed circuit board to decrease a deviation of a heat conduction process, and has a thickness ranging from 7.5 to 50% of a diameter of a solder ball.
    Type: Application
    Filed: May 30, 2019
    Publication date: December 12, 2019
    Inventors: Yong Tae KWON, Hee Cheol KIM, Seung Jun MOON, Jini SHIM