Patents by Inventor Jinjia WEI

Jinjia WEI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11913727
    Abstract: The present invention discloses a flat heat pipe, comprising a bottom plate, a top plate, and a support plate located between the bottom plate and the top plate; a micron-level radial strip is processed on the inner surface of the bottom plate; the inner surface of the top plate is processed with superhydrophilic and superhydrophobic radial structures arranged at intervals to transport the condensate to the direction of the surrounding pipe wall; a wick is arranged on the inner side of the support plate. The present invention has the function of pumpless directional transport of liquid and convergence of refluxed condensate; thereby improving the heat exchange performance of the entire flat heat pipe.
    Type: Grant
    Filed: May 21, 2021
    Date of Patent: February 27, 2024
    Assignee: Xi'an Jiaotong University
    Inventors: Baojin Qi, Jinjia Wei, Ya Wang, Ting Yu, Chenyi Cui
  • Publication number: 20210278141
    Abstract: The present invention discloses a flat heat pipe, comprising a bottom plate, a top plate, and a support plate located between the bottom plate and the top plate; a micron-level radial strip is processed on the inner surface of the bottom plate; the inner surface of the top plate is processed with superhydrophilic and superhydrophobic radial structures arranged at intervals to transport the condensate to the direction of the surrounding pipe wall; a wick is arranged on the inner side of the support plate. The present invention has the function of pumpless directional transport of liquid and convergence of refluxed condensate; thereby improving the heat exchange performance of the entire flat heat pipe.
    Type: Application
    Filed: May 21, 2021
    Publication date: September 9, 2021
    Inventors: Baojin Qi, Jinjia Wei, Ya Wang, Ting Yu, Chenyi Cui
  • Patent number: 10996003
    Abstract: A loop heat pipe with a vapor-liquid two-phase flow injector, including: an evaporator, the vapor-liquid two-phase flow injector, a boiling pool and a condenser. The two-phase flow injector has a central vapor inlet and a circumferential liquid inlet, and is connected to an outlet of the evaporator and an inlet of the boiling pool. The condensate inlet of the condenser is connected to an outlet of the boiling pool. An outlet of the condenser is connected to the evaporator. With the vapor-liquid two-phase flow injector, the invention can directly introduce a part of the supercooled liquid working medium to the boiling pool without passing through the evaporator, solving the problem of insufficient liquid supply for the boiling pool and increasing the driving force for the system operation. Therefore, the invention enables the efficient cooling of electronic devices and the long-distance heat transfer.
    Type: Grant
    Filed: September 29, 2019
    Date of Patent: May 4, 2021
    Assignee: Xi'an Jiaotong University
    Inventors: Jinjia Wei, Xiaoping Yang, Lei Liu, Jie Liu
  • Publication number: 20200292244
    Abstract: A loop heat pipe with a vapor-liquid two-phase flow injector, including: an evaporator, the vapor-liquid two-phase flow injector, a boiling pool and a condenser. The two-phase flow injector has a central vapor inlet and a circumferential liquid inlet, and is connected to an outlet of the evaporator and an inlet of the boiling pool. The condensate inlet of the condenser is connected to an outlet of the boiling pool. An outlet of the condenser is connected to the evaporator. With the vapor-liquid two-phase flow injector, the invention can directly introduce a part of the supercooled liquid working medium to the boiling pool without passing through the evaporator, solving the problem of insufficient liquid supply for the boiling pool and increasing the driving force for the system operation. Therefore, the invention enables the efficient cooling of electronic devices and the long-distance heat transfer.
    Type: Application
    Filed: September 29, 2019
    Publication date: September 17, 2020
    Inventors: Jinjia WEI, Xiaoping YANG, Lei LIU, Jie LIU