Patents by Inventor Jinjin CAO

Jinjin CAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11734622
    Abstract: A method, apparatus and device for determining production capacity boundaries are provided. In the method, related data for producing a run size of elements by a production device lot by lot is acquired and time intervals between production ending time points of adjacent lots are determined according to the related data; the determined time intervals are sorted to obtain a time interval sequence; distribution features of time intervals at two boundaries are parsed respectively to determine whether a data removing condition is satisfied; if Yes, an outlier is determined according to a mean value of the present time interval sequence, the time interval of the extraction step length where the outlier is located is removed, and whether the data removing condition is satisfied is determined; and if No, production capacity boundaries are determined according to minimum and maximum time intervals of the present time interval sequence and the run size.
    Type: Grant
    Filed: August 9, 2021
    Date of Patent: August 22, 2023
    Assignee: CHANGXIN MEMORY TECHNOLOGIES, INC.
    Inventors: Jianping Wang, Xiao Wang, Jinjin Cao
  • Publication number: 20230059538
    Abstract: The present application relates to the technical field of semiconductors, and in particular, to a wafer scheduling method and a wafer scheduling apparatus for an etching equipment. The wafer scheduling method includes: obtaining a wafer processing request, where the wafer processing request includes at least process information of wafers and an equipment processing parameter of the etching equipment; responding to the wafer processing request, and determining a wafer scheduling parameter corresponding to the process information and the equipment processing parameter, based on the process information, the equipment processing parameter, and a preset wafer scheduling policy, where the wafer scheduling parameter is used to determine a transfer time for transferring the wafers to the etching equipment for processing; and performing wafer scheduling processing on the wafers by using the wafer scheduling parameter. In this way, the wafer processing productivity of the etching equipment can be improved.
    Type: Application
    Filed: July 13, 2021
    Publication date: February 23, 2023
    Inventors: Jianping WANG, Chien-Hung CHEN, Jinjin CAO
  • Publication number: 20220383214
    Abstract: A method, apparatus and device for determining production capacity boundaries are provided. In the method, related data for producting a run size of elements by a production device lot by lot is acquired and time intervals between production ending time points of adjacent lots are determined according to the related data; the determined time intervals are sorted to obtain a time interval sequence; distribution features of time intervals at two boundaries are parsed respectively to determine whether a data removing condition is satisfied; if Yes, an outlier is determined according to a mean value of the present time interval sequence, the time interval of the extraction step length where the outlier is located is removed, and whether the data removing condition is satisfied is redetermined; and if No, production capacity boundaries are determined according to minimum and maximum time intervals of the present time interval sequence and the run size.
    Type: Application
    Filed: August 9, 2021
    Publication date: December 1, 2022
    Inventors: Jianping WANG, Xiao WANG, Jinjin CAO