Patents by Inventor Jinjin HUA

Jinjin HUA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Reading head protection apparatus and information reading device
    Patent number: 12260281
    Abstract: The disclosure relates to the technical field of information reading devices, and provides a reading head protection apparatus and an information reading device. The reading head protection apparatus includes: a protective jacket including a reading head connection end and a chip connection end connected to the reading head connection end, the reading head connection end being configured to connect to a reading head, and the chip connection end being configured to connect to a chip carrier, wherein a first mounting cavity is arranged in the reading head connection end, a second mounting cavity is arranged in the chip connection end, and the second mounting cavity is communicated with the first mounting cavity. The technical solutions of the present application can achieve stable and reliable adhesion between the reading head and the chip, so as to improve the efficiency of the reading head in reading the stored information in the chip.
    Type: Grant
    Filed: July 3, 2023
    Date of Patent: March 25, 2025
    Assignee: CONTEMPORARY AMPEREX TECHNOLOGY (HONG KONG) LIMITED
    Inventors: Jinjin Hua, Haihui Que, Lei Song, Hongtao Li
  • READING HEAD PROTECTION APPARATUS AND INFORMATION READING DEVICE
    Publication number: 20240232547
    Abstract: The disclosure relates to the technical field of information reading devices, and provides a reading head protection apparatus and an information reading device. The reading head protection apparatus includes: a protective jacket including a reading head connection end and a chip connection end connected to the reading head connection end, the reading head connection end being configured to connect to a reading head, and the chip connection end being configured to connect to a chip carrier, wherein a first mounting cavity is arranged in the reading head connection end, a second mounting cavity is arranged in the chip connection end, and the second mounting cavity is communicated with the first mounting cavity. The technical solutions of the present application can achieve stable and reliable adhesion between the reading head and the chip, so as to improve the efficiency of the reading head in reading the stored information in the chip.
    Type: Application
    Filed: July 3, 2023
    Publication date: July 11, 2024
    Applicant: CONTEMPORARY AMPEREX TECHNOLOGY CO., LIMITED
    Inventors: Jinjin HUA, Haihui QUE, Lei SONG, Hongtao LI