Patents by Inventor Jinmou QIN

Jinmou QIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10714148
    Abstract: A SSD storage module comprising a printed circuit board, an encapsulating colloid, and an electronic circuit welded on an inner surface of the printed circuit board and having a data storage function; the encapsulating colloid is formed on the inner surface of the printed circuit board and is configured for seamlessly encapsulating the electronic circuit, an outer surface of the printed circuit board is provided with a plurality of metal contact pieces, the plurality of metal contact pieces are electrically connected with the electronic circuit, and the plurality of metal contact pieces comprise a plurality of SATA interface contact pieces. The encapsulating colloid seamlessly encapsulates the electronic circuit and isolates the electronic circuit from the air, such that a problem that the electronic circuit is directly exposed to the air, and performances of components of the electronic circuit may be affected, thereby resulting in an unstable functionality of a SSD can be avoided.
    Type: Grant
    Filed: July 16, 2019
    Date of Patent: July 14, 2020
    Assignee: SHENZHEN LONGSYS ELECTRONICS CO., LTD.
    Inventors: Zhixiong Li, Weiwen Pang, Xiaoqiang Li, Honghui Hu, Jinmou Qin
  • Publication number: 20190341081
    Abstract: A SSD storage module comprising a printed circuit board, an encapsulating colloid, and an electronic circuit welded on an inner surface of the printed circuit board and having a data storage function; the encapsulating colloid is formed on the inner surface of the printed circuit board and is configured for seamlessly encapsulating the electronic circuit, an outer surface of the printed circuit board is provided with a plurality of metal contact pieces, the plurality of metal contact pieces are electrically connected with the electronic circuit, and the plurality of metal contact pieces comprise a plurality of SATA interface contact pieces. The encapsulating colloid seamlessly encapsulates the electronic circuit and isolates the electronic circuit from the air, such that a problem that the electronic circuit is directly exposed to the air, and performances of components of the electronic circuit may be affected, thereby resulting in an unstable functionality of a SSD can be avoided.
    Type: Application
    Filed: July 16, 2019
    Publication date: November 7, 2019
    Applicant: SHENZHEN LONGSYS ELECTRONICS CO., LTD.
    Inventors: Zhixiong LI, Weiwen PANG, Xiaoqiang LI, Honghui HU, Jinmou QIN
  • Patent number: 10388329
    Abstract: A SSD storage module comprising a printed circuit board (1), an encapsulating colloid (2), and an electronic circuit (3) welded on an inner surface of the printed circuit board (1) and having a data storage function; the encapsulating colloid (2) is formed on the inner surface of the printed circuit board (1) and is configured for seamlessly encapsulating the electronic circuit (3), an outer surface of the printed circuit board (1) is provided with a plurality of metal contact pieces (11), the plurality of metal contact pieces (11) are electrically connected with the electronic circuit (3), and the plurality of metal contact pieces (11) comprise a plurality of SATA interface contact pieces (110).
    Type: Grant
    Filed: July 18, 2016
    Date of Patent: August 20, 2019
    Assignee: SHENZHEN LONGSYS ELECTRONICS CO., LTD.
    Inventors: Zhixiong Li, Weiwen Pang, Xiaoqiang Li, Honghui Hu, Jinmou Qin
  • Publication number: 20170236558
    Abstract: A SSD storage module comprising a printed circuit board (1), an encapsulating colloid (2), and an electronic circuit (3) welded on an inner surface of the printed circuit board (1) and having a data storage function; the encapsulating colloid (2) is formed on the inner surface of the printed circuit board (1) and is configured for seamlessly encapsulating the electronic circuit (3), an outer surface of the printed circuit board (1) is provided with a plurality of metal contact pieces (11), the plurality of metal contact pieces (11) are electrically connected with the electronic circuit (3), and the plurality of metal contact pieces (11) comprise a plurality of SATA interface contact pieces (110).
    Type: Application
    Filed: July 18, 2016
    Publication date: August 17, 2017
    Inventors: Zhixiong LI, Weiwen PANG, Xiaoqiang LI, Honghui HU, Jinmou QIN
  • Patent number: D819037
    Type: Grant
    Filed: July 18, 2016
    Date of Patent: May 29, 2018
    Assignee: Shenzhen Longsys Electronics Co., Ltd.
    Inventors: Zhixiong Li, Weiwen Pang, Xiaoqiang Li, Honghui Hu, Jinmou Qin