Patents by Inventor Jin-Myung Choi

Jin-Myung Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250234523
    Abstract: A semiconductor memory device includes a bit line, a word line, first and second mold dielectric patterns overlapping the bit line and extending parallel to the word line, the first and second mold dielectric patterns vertically stacked on each other, a first metal oxide pattern disposed between the word line and a top surface of the bit line and between the word line and a lateral surface of the first mold dielectric pattern, a second metal oxide pattern contacting a lateral surface of the second mold dielectric pattern, and a channel pattern disposed between the first metal oxide pattern and the word line and contacting a bottom surface of each of the second mold dielectric pattern and the second metal oxide pattern.
    Type: Application
    Filed: December 26, 2024
    Publication date: July 17, 2025
    Inventors: HIDEKI HORII, Minseo YOON, SUKHWAN CHUNG, Jin Myung CHOI
  • Publication number: 20250081865
    Abstract: A memory device comprising a stacking structure including a plurality of electrodes and an insulation layer between the plurality of electrodes. The stacking structure has a recess portion corresponding to the plurality of electrodes or the insulation layer at a side surface of the stacking structure. The memory device also comprising a resistance variable layer on the side surface of the stacking structure having the recess portion, and includes a portion extending in an extension direction crossing the stacking structure. The resistance variable layer includes a first portion including a first expanded portion along a recess surface of the recess portion, a second portion including a second expanded portion along the recess surface of the recess portion on the first portion, and a third portion on the second portion. The second portion has a resistance smaller than a resistance of the first portion.
    Type: Application
    Filed: August 29, 2024
    Publication date: March 6, 2025
    Applicants: Samsung Electronics Co., Ltd., POSTECH Research and Business Development Foundation
    Inventors: JINWOO LEE, Hyunsang Hwang, Youngdong Kim, DONGHO AHN, Jin Myung Choi, Geon Hui Han
  • Publication number: 20240365567
    Abstract: A semiconductor device according to an embodiment includes a gate stack structure and a channel structure. The gate stack structure includes a plurality of gate electrodes and a plurality of insulating layers alternately stacked on a substrate in a first direction perpendicular to an upper surface of the substrate. The channel structure includes a portion penetrating through the gate stack structure and extending in the first direction. The channel structure includes a channel layer, a resistance change layer, and a metal-containing layer sequentially stacked. The metal-containing layer includes a metal or a metal compound.
    Type: Application
    Filed: September 21, 2023
    Publication date: October 31, 2024
    Inventors: Jinwoo Lee, Dongho Ahn, Jin Myung Choi
  • Publication number: 20230046753
    Abstract: An embodiment can provide a motor comprising: a shaft; a rotor coupled to the shaft; a stator disposed between the shaft and the rotor; a bearing disposed between the shaft and the stator; and a base plate, wherein: the rotor includes a yoke coupled to the shaft; the base plate includes a body, a first partition protruding from the body, and a second partition extending from the first partition; the first partition is disposed between the bearing and the stator; a portion of the second partition is disposed to be overlapped with the first partition; and the first partition is in contact with the lateral surface of an outer ring of the bearing and the second partition is in contact with the one surface of the outer ring of the bearing.
    Type: Application
    Filed: January 19, 2021
    Publication date: February 16, 2023
    Inventors: Jin Myung CHOI, Young Dae PARK, Jin Yong KIM, Jin Seob LEE
  • Patent number: 6733854
    Abstract: Disclosed are a polyamide resin composition and a synthetic resin product prepared therefrom. The polyamide resin composition comprises 30-95 parts by weight of polyamide resin, 1-45 parts by weight of impact resistant component, 0.1-20 parts by weight of nylon plasticizer, 0.01-5 parts by weight of nylon thickener having at least two functional groups at the ends of its polymer chain and 0.5-10 parts by weight of core-shell rubber. Such composition is advantageous in light of much lower preparation cost, while retaining higher flexibility, moldability and excellent external appearance, compared to conventional nylon elastomer reinforced polyamide resin composition. Thereby, the composition can be effectively applied to internal or external decorative articles for motor vehicles and electrical or electronic components.
    Type: Grant
    Filed: December 19, 2001
    Date of Patent: May 11, 2004
    Assignees: Hyundai Motor Company, Honeyell Korea Ltd.
    Inventors: Sang-Rok Lee, Jin-Myung Choi
  • Publication number: 20020147272
    Abstract: Disclosed are a polyamide resin composition and a synthetic resin product prepared therefrom. The polyamide resin composition comprises 30-95 parts by weight of polyamide resin, 1-45 parts by weight of impact resistant component, 0.1-20 parts by weight of nylon plasticizer, 0.01-5 parts by weight of nylon thickener having at least two functional groups at the ends of its polymer chain and 0.5-10 parts by weight of core-shell rubber. Such composition is advantageous in light of much lower preparation cost, while retaining higher flexibility, moldability and excellent external appearance, compared to conventional nylon elastomer reinforced polyamide resin composition. Thereby, the composition can be effectively applied to internal or external decorative articles for motor vehicles and electrical or electronic components.
    Type: Application
    Filed: December 19, 2001
    Publication date: October 10, 2002
    Inventors: Sang-Rok Lee, Jin-Myung Choi