Abstract: A method for predicting plasma micro-arcing includes obtaining a spectrum signal in a given plasma process, classifying an optical intensity of the spectrum signal into soft and hard arcing events according to an amplitude of the optical intensity of the spectrum signal, separately counting a number of occurrences of the soft arcing event in a given unit time, comparing the number of occurrences of the soft arcing event during the given unit time with the number of occurrences of the soft arcing event during a previous unit time, and determining that a number of occurrences of the hard arcing event will increase during a next unit time subsequent to the given unit time, when the number of occurrences of the soft arcing event during the given unit time increases in comparison with the number of occurrences of the soft arcing event during the previous unit time.

Abstract: A polishing head and method for handling and polishing semiconductor wafers uses a base structure with at least one recess region and an outer flexible membrane that can conform to the at least one recess region to form at least one depression to hold a semiconductor wafer onto the outer flexible membrane when suction is applied to the at least one depression.

Abstract: A polishing head and method for chucking a semiconductor wafer onto the polishing head uses a base structure and an outer flexible membrane with at least a first annular chamber and a second annular chamber positioned between the base structure and the outer flexible membrane. The polishing head includes a central cavity positioned below the base structure and at least partly defined by the outer flexible membrane, which is used to hold the semiconductor wafer onto the outer flexible membrane.

Abstract: A polishing head and method for handling and polishing semiconductor wafers uses a base structure with at least one recess region and an outer flexible membrane that can conform to the at least one recess region to form at least one depression to hold a semiconductor wafer onto the outer flexible membrane when suction is applied to the at least one depression.

Abstract: A controller for a photoresist dispense pump is described that actively monitors the operation of the pump and dynamically determines completion of the refill of the pump. In one embodiment, pressure measurements are made during the refill step. Changes in the pressure measurements are used to indicate completion of the refill. After refill is completed, the refill step is terminated and the operation cycle is continued.

Abstract: A controller for a photoresist dispense pump is described that actively monitors the operation of the pump and dynamically determines completion of the refill of the pump. In one embodiment, pressure measurements are made during the refill step. Changes in the pressure measurements are used to indicate completion of the refill. After refill is completed, the refill step is terminated and the operation cycle is continued.