Abstract: A brush cleaning device includes a brush including an electrode therein; a cleaning tank in which the brush is accommodatable; a platen in the cleaning tank, the platen being spaced apart from the brush, and including an electrode therein that interacts with the electrode of the brush; and a voltage supplier having an electrode interacting with the electrode of the brush, and supplying a voltage to form an electrical field on the brush and the platen, wherein the brush includes a cylindrical body including a plurality of protrusions on a surface thereof, and pores in at least a portion of the plurality of protrusions; a particle collection pipe at a center of the cylindrical body; and a particle suction pipe in fluid communication with the particle collection pipe and extending radially to the pores at an outer surface of the brush.

Abstract: A chemical mechanical polishing apparatus according to an example embodiment includes a polishing platen; a polishing pad which is located on the polishing platen and includes a polishing surface; a slurry supplier configured to supply a slurry to the polishing pad; a polishing head which is located above the polishing pad and configured to mount a wafer thereon; and an additional CMP process condition generator which generates an additional chemical mechanical polishing (CMP) process condition according to a type of residue when there is a residue on a wafer after a CMP process is performed on the wafer.