Patents by Inventor Jinpei JU

Jinpei JU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10790565
    Abstract: Provided is a cavity filter that is one of radio frequency filters. The cavity filter includes a printed circuit board (PCB) substrate including a micro band layer, metal layers for grounding, which are arranged on both surfaces of the PCB substrate, having the micro band layer interposed therebetween, a plurality of standard cavity modules which are arranged on the both surfaces of the PCB substrate, in each of which an open side surface is fixed and sealed onto the metal layer, and a plurality of coupling windows, in each of which a part of the metal layer for grounding is removed to expose a part of the PCB substrate.
    Type: Grant
    Filed: August 16, 2016
    Date of Patent: September 29, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Fei Gao, Guangxin Zhao, Jianwang Wu, Jinpei Ju, Lei Cai
  • Publication number: 20180226707
    Abstract: Provided is a cavity filter that is one of radio frequency filters. The cavity filter includes a printed circuit board (PCB) substrate including a micro band layer, metal layers for grounding, which are arranged on both surfaces of the PCB substrate, having the micro band layer interposed therebetween, a plurality of standard cavity modules which are arranged on the both surfaces of the PCB substrate, in each of which an open side surface is fixed and sealed onto the metal layer, and a plurality of coupling windows, in each of which a part of the metal layer for grounding is removed to expose a part of the PCB substrate.
    Type: Application
    Filed: August 16, 2016
    Publication date: August 9, 2018
    Inventors: Fei GAO, Guangxin ZHAO, Jianwang WU, Jinpei JU, Lei CAI
  • Patent number: 9721902
    Abstract: The present disclosure relates to a radio frequency (RF) unit of a base station, and more particularly, to a method of manufacturing an RF power amplifier module, an RF power amplifier module, an RF module, and a base station. The RF power amplifier module includes at least a power device, a power circuit board, a heat-dissipation substrate, and input/output ports. A power device die of the power device and the power circuit board are mounted on the heat-dissipation substrate. The power device die is connected to the power circuit board through packaging lead wires. In one exemplary embodiment, a heat-dissipation effect and manufacturing efficiency of the RF power amplifier module are improved and a cost of the RF power amplifier module is reduced.
    Type: Grant
    Filed: August 26, 2015
    Date of Patent: August 1, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Wei Jiang, Yiwei Ma, Jinpei Ju, Hongmei Hu, Qin Gong
  • Patent number: 9627807
    Abstract: A cable connector assembly includes a connecting frame, wherein an opening through which a cable penetrates is formed at an end of the connecting frame, a cable support connected to another end of the connecting frame and supporting the cable, a first locking part including a fixed end fixed to a first side of the connecting frame and a free end that is movable about the fixed end, a second locking part including a fixed end fixed to a second side of the connecting frame opposite to the first side of the connecting frame, and a free end that is movable about the fixed end, and a sealing portion surrounding the connecting frame and being elastic deformable.
    Type: Grant
    Filed: March 4, 2015
    Date of Patent: April 18, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Fei Gao, Guangxin Zhao, Jinpei Ju, Shengjun Ou, Wensheng Chen, Chunliang Chang
  • Publication number: 20160065144
    Abstract: The present disclosure relates to a radio frequency (RF) unit of a base station, and more particularly, to a method of manufacturing an RF power amplifier module, an RF power amplifier module, an RF module, and a base station. The RF power amplifier module includes at least a power device, a power circuit board, a heat-dissipation substrate, and input/output ports. A power device die of the power device and the power circuit board are mounted on the heat-dissipation substrate. The power device die is connected to the power circuit board through packaging lead wires. In one exemplary embodiment, a heat-dissipation effect and manufacturing efficiency of the RF power amplifier module are improved and a cost of the RF power amplifier module is reduced.
    Type: Application
    Filed: August 26, 2015
    Publication date: March 3, 2016
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Wei JIANG, Yiwei MA, Jinpei JU, Hongmei HU, Qin GONG
  • Publication number: 20150255921
    Abstract: A cable connector assembly includes a connecting frame, wherein an opening through which a cable penetrates is formed at an end of the connecting frame, a cable support connected to another end of the connecting frame and supporting the cable, a first locking part including a fixed end fixed to a first side of the connecting frame and a free end that is movable about the fixed end, a second locking part including a fixed end fixed to a second side of the connecting frame opposite to the first side of the connecting frame, and a free end that is movable about the fixed end, and a sealing portion surrounding the connecting frame and being elastic deformable.
    Type: Application
    Filed: March 4, 2015
    Publication date: September 10, 2015
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Fei GAO, Guangxin ZHAO, Jinpei JU, Shengjun OU, Wensheng CHEN, Chunliang CHANG