Abstract: A hanging neck fan is provided, which includes a fan component, a fan body, and an installation portion provided on one side of the fan body; a hanging neck component wearing at a human's neck, the hanging neck component is filled with a heat absorbing medium. The hanging neck component includes a first end, a second end, and an arc-shaped main body between the first end and the second end that are sealed with each other. At least one of the first end and the second end is provided with an installation hole; and at least one connection mechanism connecting the fan component and the hanging neck component, the at least one connection mechanism includes a first portion and a second portion, the first portion is detachably connected to the hanging neck component, the second portion is detachably connected to the installation portion of the fan component.

Abstract: A connection component for a fan and a fan are provided, the connection component includes a first interface component including a first housing and an actuator accommodated within the first housing, the actuator is configured to connect to a bracket of the fan and capable of rotating along a first axis relative to the first housing; a second interface component including a second housing configured to connect to a fan head; and a rotation mechanism including a first mechanism and a second mechanism that can rotate with each other along a second axis. The second axis is perpendicular to the first axis, the first mechanism is rotationally and fixedly connected to the first interface component, the second mechanism is rotationally and fixedly connected to the second interface component, so that the first interface component and the second interface component can rotate with each other along the second axis.

Abstract: A backplane includes: a substrate including a circuit structure layer and a second reflective layer, a first reflective layer disposed on a bearing surface of the substrate, a plurality of light-emitting diode chips, and a plurality of optical structures. The first reflective layer includes a plurality of through holes spaced apart. A light-emitting diode chip in the plurality of light-emitting diode chips is located in a through hole. The plurality of light-emitting diode chips are electrically connected to the circuit structure layer. The circuit structure layer is configured to drive the plurality of light-emitting diode chips to emit light. An optical structure in the plurality of optical structures covers the light-emitting diode chip, a light incident surface of the optical structure is in contact with a light exit surface of the light-emitting diode chip, and a light exit surface of the optical structure is a curved surface.

Abstract: A light-emitting chip and a light-emitting substrate are provided. The light-emitting chip includes a base substrate and at least two sub-light-emitting chips disposed on a side of the base substrate, wherein each sub-light-emitting chip includes a first semiconductor layer, a second semiconductor layer and an light-emitting layer located between the first semiconductor layer and the second semiconductor layer which are stacked.

Abstract: A display substrate includes a substrate, light-emitting devices disposed on a side of the substrate, a first light dimming layer disposed on the side of the substrate, and a first fixing layer disposed on a side of the light-emitting devices and the first light dimming layer away from the substrate. The light-emitting devices are arranged at intervals from each other and divided into a plurality of groups of light-emitting devices, and each group of light-emitting devices includes at least one light-emitting device. The first light dimming layer includes portions each located between two adjacent groups of light-emitting devices, and a gap exists between a portion of the first light dimming layer and at least one side face of at least one light-emitting device adjacent thereto. A portion of the first fixing layer is located in the gap. The first fixing layer is a light-transmitting film.

Abstract: A light-emitting substrate includes a substrate and a plurality of light-emitting assemblies. The plurality of light-emitting assemblies are located on a side of the substrate. At least one light-emitting assembly includes a light-emitting element and a light adjustment portion arranged around the light-emitting element. The light adjustment portion includes a plurality of sub-structures spaced apart from each other. In any two sub-structures in the light adjustment portion in any direction away from the light-emitting element, a height of a sub-structure closer to the light-emitting element is less than a height of a sub-structure farther from the light-emitting element.

Abstract: A light-emitting chip and a light-emitting substrate are provided. The light-emitting chip includes a base substrate and at least two sub-light-emitting chips disposed on a side of the base substrate, wherein each sub-light-emitting chip includes a first semiconductor layer, a second semiconductor layer and an light-emitting layer located between the first semiconductor layer and the second semiconductor layer which are stacked.

Abstract: The present disclosure provides a charging system and charging method for an electric automobile, and an electric automobile: including a human-machine interaction module, a power source module and a main control module; the human-machine interaction module configured to receive charging demand information of the electric automobile and send the charging demand information to the main control module; the power source module includes a plurality of power source branches each of which includes a switch unit and a power source unit, and the switch unit is configured to switch on or switch off the power source branch in which it is located; and the main control module is configured to determine the power source unit to be turned on or the power source unit to be turned off, and send the turn-on signal or the turn-off signal to the power source branch.

Abstract: Provided are a display baseplate, a mould assembly, a spliced display module, and a display apparatus. The display baseplate includes a backplate light emitters and an encapsulation layer. The backplate includes a first main surface and a second main surface that are opposite to each other, and side surfaces connected to the first main surface and the second main surface light emitters are located on the first main surface, the encapsulation layer is at least partially located on the first main surface and covers the plurality of light emitters. The spliced display module includes a splicing units, the splicing units each include a splicing frame and a display baseplate, the display baseplate is fixed on the splicing frame with the light emitters away from the splicing frame; and the splicing frames of adjacent splicing units are spliced together. The display apparatus includes a display baseplate or a spliced display module.

Abstract: The present invention discloses a vibration suppression system and method for a star simulation system using laser interference detection. The system includes a laser light source, a first beam splitter, a collimator set, a second beam splitter, a mirror, a detection convergent mirror assembly, a CCD detector, a computer control system, a jitter compensating mirror and a flat splitter; the optical path of the whole system includes a reference optical path and a detection compensating signal optical path. The reference optical path and the detection compensating signal optical path converge at the same time on the CCD detector to constitute a vibration detection interference optical path, and the computer control system performs feedback compensation according to the interferogram intensity change formed by the vibration detection interference optical path. Both the CCD detector and the jitter compensating mirror are connected to the computer control system.

Abstract: An array substrate, a method of manufacturing the array substrate, and a display device are provided. The array substrate includes: a transparent rigid base; light-emitting chips on the transparent rigid base, each light-emitting chip including a chip body and a pin coupled to the chip body, a light-exiting surface of the chip body facing towards the transparent rigid base, and the pin being on a side of the chip body facing away from the transparent rigid base; a driving wire layer on a side of the pin facing away from the transparent rigid base; and a driving chip structure on a side of the driving wire layer facing away from the transparent rigid base. The driving chip structure is coupled to pins of the plurality of light-emitting chips through the driving wire layer, and is used for provide driving signals for the light-emitting chips.

Abstract: A display substrate includes a base, a plurality of light-emitting devices disposed on a side of the base, and a light adjustment layer. The plurality of light-emitting devices are spaced apart from each other. At least part of the light adjustment layer is located in gaps among the plurality of light-emitting devices, so that side walls of at least one of the plurality of light-emitting devices are surrounded by the light adjustment layer. A material of the light adjustment layer includes a light-absorbing material. The light adjustment layer is configured to absorb light incident on the light adjustment layer.

Abstract: A light-emitting substrate includes a substrate and a plurality of light-emitting assemblies. The plurality of light-emitting assemblies are located on a side of the substrate. At least one light-emitting assembly includes a light-emitting element and a light adjustment portion arranged around the light-emitting element. The light adjustment portion includes a plurality of sub-structures spaced apart from each other. In any two sub-structures in the light adjustment portion in any direction away from the light-emitting element, a height of a sub-structure closer to the light-emitting element is less than a height of a sub-structure farther from the light-emitting element.

Abstract: The present disclosure provides a temperature processing method and apparatus. The method includes: acquiring a current frame temperature value of each channel (S101); calculating an absolute value of a difference between the current frame temperature value and a previous frame temperature value of each channel to obtain a current frame temperature variation of each channel (S102); determining each first effective channel based on a first threshold and the current frame temperature variation of each channel (S103); determining each second effective channel based on multi-frame temperature values of each first effective channel (S104); and obtaining a current frame output temperature value based on the current frame temperature value of each second effective channel (S105). The apparatus is configured to perform the above method. The provided temperature processing method and apparatus improve the accuracy of temperature collection.

Abstract: Provided are a light-emitting chip, a light-emitting substrate, a display device, and a manufacturing method for a light-emitting substrate. The light-emitting chip includes: a substrate; a light-emitting structure, the light-emitting structure disposed on a side of the substrate; a reflective layer disposed on a side, facing away from the substrate, of the light-emitting structure; at least two sub-light-emitting auxiliary bonding layers disposed on a side, facing away from the light-emitting structure, of the reflective layer; and a raised portion, disposed on a side, facing away from the light-emitting structure, of the reflective layer, an orthographic projection of the raised portion on the substrate and an orthographic projection of the sub-light-emitting auxiliary bonding layers on the substrate do not overlap with each other, and a thickness of the raised portion is smaller than a thickness of each of the at least two sub-light-emitting auxiliary bonding layers.

Abstract: A display substrate includes a base, a plurality of light-emitting devices disposed on a side of the base, and a light adjustment layer. The plurality of light-emitting devices are spaced apart from each other. At least part of the light adjustment layer is located in gaps among the plurality of light-emitting devices, so that side walls of at least one of the plurality of light-emitting devices are surrounded by the light adjustment layer. A material of the light adjustment layer includes a light-absorbing material. The light adjustment layer is configured to absorb light incident on the light adjustment layer.

Abstract: A backplane includes: a substrate including a circuit structure layer and a second reflective layer, a first reflective layer disposed on a bearing surface of the substrate, a plurality of light-emitting diode chips, and a plurality of optical structures. The first reflective layer includes a plurality of through holes spaced apart. A light-emitting diode chip in the plurality of light-emitting diode chips is located in a through hole. The plurality of light-emitting diode chips are electrically connected to the circuit structure layer. The circuit structure layer is configured to drive the plurality of light-emitting diode chips to emit light. An optical structure in the plurality of optical structures covers the light-emitting diode chip, a light incident surface of the optical structure is in contact with a light exit surface of the light-emitting diode chip, and a light exit surface of the optical structure is a curved surface.

Abstract: The present disclosure provides an encapsulating structure, a display substrate and a manufacturing method therefor, and a display apparatus. The encapsulating structure is used for encapsulating components, and includes: a first encapsulating layer configured to cover the components; and a second encapsulating layer stacked with the first encapsulating layer; the second encapsulating layer is located on the side of the first encapsulating layer away from the components, a surface of the second encapsulating layer facing the first encapsulating layer is in contact with a surface of the first encapsulating layer facing the second encapsulating layer, and a surface of the second encapsulating layer away from the first encapsulating layer is substantially parallel to a plane where the encapsulating structure is located.

Abstract: A backplane includes: a substrate including a circuit structure layer, a first reflective layer disposed on a bearing surface of the substrate, a plurality of light-emitting diode chips, and a plurality of optical structures. The first reflective layer includes a plurality of through holes spaced apart. A light-emitting diode chip in the plurality of light-emitting diode chips is located in one of the plurality of through holes. The plurality of light-emitting diode chips are electrically connected to the circuit structure layer. The circuit structure layer is configured to drive the plurality of light-emitting diode chips to emit light. An optical structure in the plurality of optical structures covers the light-emitting diode chip, a light incident surface of the optical structure is in contact with a light exit surface of the light-emitting diode chip, and a light exit surface of the optical structure is a curved surface.