Patents by Inventor Jinqiang CHU

Jinqiang CHU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HEAT SINK FOR IC COMPONENT AND IC HEAT SINK ASSEMBLY
    Publication number: 20220293488
    Abstract: A heat sink for an IC component and an IC heat sink assembly are provided. The heat sink for an IC component has a contact surface suitable for thermally contacting with the IC component. A groove is provided in the contact surface. The IC heat sink assembly includes: a heat sink for an IC component; an IC component thermally connected to the heat sink; and a thermally conductive interface material provided between the heat sink and the IC component.
    Type: Application
    Filed: August 7, 2020
    Publication date: September 15, 2022
    Inventors: Jinqiang CHU, Mieslinger ALEXANDER, Jiale WU, Huobing HUANG