Abstract: A quinazoline derivative (represented by the formula (I)) salt's crystal form, a preparation method and application are provided; specifically, the hydrochloride crystal form A, B, C, D, F, H, I, Sulphate crystal form A, Maleate crystal form A, Succinate crystal form A, Adipate crystal form A, Glycolate crystal form A, Malate crystal form A, Fumarate Salt crystal form A, besylate crystal form A, B, C, benzoate crystal form A, hippurate crystal form A and oxalate crystal form A of the quinazoline derivative represented by formula (I). The salt crystal form provided by the present invention has good stability, which can be used in the treatment of non-small cell lung cancer brain metastasis, meningeal metastasis, primary brain cancer or glioma, etc., and has good bioavailability, which is of great significance for further research on the efficacy of such solid drugs.

Abstract: A multi-layer circuit board, successively constituted by surface sticking layer, single-layer circuit board, middle sticking layer, single-layer circuit board, surface sticking layer, said multi-layer circuit board is provided with a hole, a hole wall of said hole is formed with conductive seed layer, and partial outer surface of said surface sticking layer is formed with a circuit pattern layer of conductive seed layer, wherein said conductive seed layer comprises a ion implantation layer implanting below the hole wall of said hole and below partial outer surface of said surface sticking layer.

Abstract: A quinazoline derivative (represented by the formula (I)) salt's crystal form, a preparation method and application are provided; specifically, the hydrochloride crystal form A, B, C, D, F, H, I, Sulphate crystal form A, Maleate crystal form A, Succinate crystal form A, Adipate crystal form A, Glycolate crystal form A, Malate crystal form A, Fumarate Salt crystal form A, besylate crystal form A, B, C, benzoate crystal form A, hippurate crystal form A and oxalate crystal form A of the quinazoline derivative represented by formula (I). The salt crystal form provided by the present invention has good stability, which can be used in the treatment of non-small cell lung cancer brain metastasis, meningeal metastasis, primary brain cancer or glioma, etc., and has good bioavailability, which is of great significance for further research on the efficacy of such solid drugs.

Abstract: Novel cyclic peptide GHRP-6 analogs of formula (I): (I) or pharmaceutically acceptable esters or salts thereof, are described. These cyclic peptide GHRP-6 analogs may be used for modulating CD36 activity, for example for the treatment of CD36-related diseases, disorders or conditions in a subject, such as atherosclerosis and age-related macular degeneration.

Abstract: A multi-layer circuit board, successively constituted by surface sticking layer, single-layer circuit board, middle sticking layer, single-layer circuit board, surface sticking layer, said multi-layer circuit board is provided with a hole, a hole wall of said hole is formed with conductive seed layer, and partial outer surface of said surface sticking layer is formed with a circuit pattern layer of conductive seed layer, wherein said conductive seed layer comprises a ion implantation layer implanting below the hole wall of said hole and below partial outer surface of said surface sticking layer.

Abstract: A single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor. The method for manufacturing the single-layer circuit board comprises the following steps: drilling a hole on a substrate, the hole comprising a blind hole and/or a through hole; on a surface of the substrate, forming a photoresist layer having a circuit negative image; forming a conductive seed layer on the surface of the substrate and a hole wall of the hole; removing the photoresist layer, and forming a circuit pattern on the surface of the substrate, wherein forming a conductive seed layer comprises implanting a conductive material below the surface of the substrate and below the hole wall of the hole via ion implantation, and forming an ion implantation layer as at least part of the conductive seed layer.

Abstract: A single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor. The method for manufacturing the single-layer circuit board comprises the following steps: drilling a hole on a substrate, the hole comprising a blind hole and/or a through hole; on a surface of the substrate, forming a photoresist layer having a circuit negative image; forming a conductive seed layer on the surface of the substrate and a hole wall of the hole; removing the photoresist layer, and forming a circuit pattern on the surface of the substrate, wherein forming a conductive seed layer comprises implanting a conductive material below the surface of the substrate and below the hole wall of the hole via ion implantation, and forming an ion implantation layer as at least part of the conductive seed layer.

Abstract: A fiber optic connector comprises an outer housing, an inner housing installed in the outer housing, a fiber optic ferrule accommodated in the inner housing, an optical cable inserted into the inner housing and connected to the fiber optic ferrule, an elastic boot that is wrapped around both a connecting portion of the fiber optic ferrule connecting to the optical cable and a portion of the optical cable adjacent to the connecting portion, and a sealing structure. The sealing structure is disposed between a rear end portion of the outer housing and the elastic boot to provide a seal between the outer housing and the elastic boot.

Abstract: A single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor. The method for manufacturing the single-layer circuit board comprises the following steps: drilling a hole on a substrate, the hole comprising a blind hole and/or a through hole; on a surface of the substrate, forming a photoresist layer having a circuit negative image; forming a conductive seed layer on the surface of the substrate and a hole wall of the hole; removing the photoresist layer, and forming a circuit pattern on the surface of the substrate, wherein forming a conductive seed layer comprises implanting a conductive material below the surface of the substrate and below the hole wall of the hole via ion implantation, and forming an ion implantation layer as at least part of the conductive seed layer.

Abstract: A single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor. The method for manufacturing the single-layer circuit board comprises the following steps: drilling a hole on a substrate, the hole comprising a blind hole and/or a through hole; on a surface of the substrate, forming a photoresist layer having a circuit negative image; forming a conductive seed layer on the surface of the substrate and a hole wall of the hole; removing the photoresist layer, and forming a circuit pattern on the surface of the substrate, wherein forming a conductive seed layer comprises implanting a conductive material below the surface of the substrate and below the hole wall of the hole via ion implantation, and forming an ion implantation layer as at least part of the conductive seed layer.

Abstract: A single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor. The method for manufacturing the single-layer circuit board (10) comprises the following steps: drilling a hole on a substrate (11), the hole comprising a blind hole and/or a through hole (S1); on a surface (12) of the substrate, forming a photoresist layer having a circuit negative image (S2); forming a conductive seed layer on the surface (12) of the substrate and a hole wall (19) of the hole (S3); removing the photoresist layer, and forming a circuit pattern on the surface (12) of the substrate (S4), wherein Step S3 comprises implanting a conductive material below the surface (12) of the substrate and below the hole wall (19) of the hole via ion implantation, and forming an ion implantation layer as at least part of the conductive seed layer.

Abstract: A single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor. The method for manufacturing the single-layer circuit board (10) comprises the following steps: drilling a hole on a substrate (11), the hole comprising a blind hole and/or a through hole (S1); on a surface (12) of the substrate, forming a photoresist layer having a circuit negative image (S2); forming a conductive seed layer on the surface (12) of the substrate and a hole wall (19) of the hole (S3); removing the photoresist layer, and forming a circuit pattern on the surface (12) of the substrate (S4), wherein Step S3 comprises implanting a conductive material below the surface (12) of the substrate and below the hole wall (19) of the hole via ion implantation, and forming an ion implantation layer as at least part of the conductive seed layer.

Abstract: A connector that includes an outer housing having an assembly channel with a stopping step on an inner wall of thereof and an optical beam expanding module assembled with the assembly channel of the outer housing. The optical beam expanding module includes a rear seat, formed with a snap ring groove, in which a C-shaped snap ring is fitted. A cable having a strengthening element is fixed on a rear end portion of the rear seat. When the cable of the optical beam expanding module is pulled outwardly, the C-shaped snap ring abuts against the stopping step, so that a pulling force exerted on the cable is transferred to the outer housing through the strengthening element of the cable, instead of being transferred to an optical fiber of the cable, thus preventing the optoelectronic coupling end faces of the connector from being separated.

Abstract: A single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor. The method for manufacturing the single-layer circuit board (10) comprises the following steps: drilling a hole on a substrate (11), the hole comprising a blind hole and/or a through hole (S1); on a surface (12) of the substrate, forming a photoresist layer having a circuit negative image (S2); forming a conductive seed layer on the surface (12) of the substrate and a hole wall (19) of the hole (S3); removing the photoresist layer, and forming a circuit pattern on the surface (12) of the substrate (S4), wherein Step S3 comprises implanting a conductive material below the surface (12) of the substrate and below the hole wall (19) of the hole via ion implantation, and forming an ion implantation layer as at least part of the conductive seed layer.

Abstract: A single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor. The method for manufacturing the single-layer circuit board (10) comprises the following steps: drilling a hole on a substrate (11), the hole comprising a blind hole and/or a through hole (S1); on a surface (12) of the substrate, forming a photoresist layer having a circuit negative image (S2); forming a conductive seed layer on the surface (12) of the substrate and a hole wall (19) of the hole (S3); removing the photoresist layer, and forming a circuit pattern on the surface (12) of the substrate (S4), wherein Step S3 comprises implanting a conductive material below the surface (12) of the substrate and below the hole wall (19) of the hole via ion implantation, and forming an ion implantation layer as at least part of the conductive seed layer.

Abstract: Novel cyclic peptide GHRP-6 analogs of formula (I): (I) or pharmaceutically acceptable esters or salts thereof, are described. These cyclic peptide GHRP-6 analogs may be used for modulating CD36 activity, for example for the treatment of CD36-related diseases, disorders or conditions in a subject, such as atherosclerosis and age-related macular degeneration.

Abstract: A single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor. The method for manufacturing the single-layer circuit board (10) comprises the following steps: drilling a hole on a substrate (11), the hole comprising a blind hole and/or a through hole (S1); on a surface (12) of the substrate, forming a photoresist layer having a circuit negative image (S2); forming a conductive seed layer on the surface (12) of the substrate and a hole wall (19) of the hole (S3); removing the photoresist layer, and forming a circuit pattern on the surface (12) of the substrate (S4), wherein Step S3 comprises implanting a conductive material below the surface (12) of the substrate and below the hole wall (19) of the hole via ion implantation, and forming an ion implantation layer as at least part of the conductive seed layer.

Abstract: A fiber optic connector comprises an outer housing, an inner housing installed in the outer housing, a fiber optic ferrule accommodated in the inner housing, an optical cable inserted into the inner housing and connected to the fiber optic ferrule, an elastic boot that is wrapped around both a connecting portion of the fiber optic ferrule connecting to the optical cable and a portion of the optical cable adjacent to the connecting portion, and a sealing structure. The sealing structure is disposed between a rear end portion of the outer housing and the elastic boot to provide a seal between the outer housing and the elastic boot.

Abstract: A single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor. The method for manufacturing the single-layer circuit board (10) comprises the following steps: drilling a hole on a substrate (11), the hole comprising a blind hole and/or a through hole (S1); on a surface (12) of the substrate, forming a photoresist layer having a circuit negative image (S2); forming a conductive seed layer on the surface (12) of the substrate and a hole wall (19) of the hole (S3); removing the photoresist layer, and forming a circuit pattern on the surface (12) of the substrate (S4), wherein Step S3 comprises implanting a conductive material below the surface (12) of the substrate and below the hole wall (19) of the hole via ion implantation, and forming an ion implantation layer as at least part of the conductive seed layer.

Abstract: A connector that includes an outer housing having an assembly channel with a stopping step on an inner wall of thereof and an optical beam expanding module assembled with the assembly channel of the outer housing. The optical beam expanding module includes a rear seat, formed with a snap ring groove, in which a C-shaped snap ring is fitted. A cable having a strengthening element is fixed on a rear end portion of the rear seat. When the cable of the optical beam expanding module is pulled outwardly, the C-shaped snap ring abuts against the stopping step, so that a pulling force exerted on the cable is transferred to the outer housing through the strengthening element of the cable, instead of being transferred to an optical fiber of the cable, thus preventing the optoelectronic coupling end faces of the connector from being separated.