Abstract: The present invention discloses a saturated water explosive device, including a water intake pipe, a flow splitter for splitting a high-pressure liquid, a flow baffle for baffling the high-pressure liquid, a heat receiver having a cavity defined inside, a pillar connected with the heat receiver by a micro-channel wherein the high-pressure liquid is heated to be high-temperature saturated water, and a heat source for heating the cavity. High-pressure water is heated to produce high-temperature high-pressure saturated water, and then by using the saturated water explosive device of the present invention, the produced high-temperature high-pressure saturated water instantaneously explodes as being heated, and a high-temperature high-pressure steam flow is produced due to rapid vaporization, and expansion and is used as a power source.

Abstract: The present invention relates to a spring reset device for a piston mechanism. In certain embodiments, the spring reset device includes: a connecting plate, a pull rod, a plurality of reset springs, and a plurality of brackets. The connecting plate has a plurality of connecting pins. Each of the reset springs has a first end, and a second end. Each of the brackets has a connecting pin. The spring reset device is positioned on a top end of a piston body. The piston body includes a piston cylinder body, a piston plate, a piston rod, and a cylinder cover. A lower side of the piston plate is connected to the piston rod through a thread. First end of each of reset springs is rotatably connected to a hook portion of connecting plate. Second end of each of reset springs is rotatably connected a hook portion of a corresponding bracket.

Abstract: The invention relates to a high pressure water pump and a steam powered nailing gun having the high pressure water pump. In certain embodiments, high pressure water pump includes: an upper pump body, a lower pump body, a water discharge valve, a water intake valve, a plunger, a guide sleeve, a hammering cap, an adjustment knob, and an evacuation valve. Both upper and lower pump body are connected by connecting bolts. A sealing ring is disposed between upper and lower pump body and a sealing element is disposed between the upper pump body and plunger. Plunger is sheathed in upper pump body. The hammering cap is threadedly connected to the plunger. The adjustment knob is connected to an upper end of upper pump body. The hammering cap is moveably connected to the adjustment knob through the plunger. A plunger reset spring is disposed between hammering cap and adjustment knob.

Abstract: The present invention relates to a steam powered nailing gun. In certain embodiments, the steam powered nailing gun includes a handle, a casing, a high pressure water pump, a piston mechanism, a nailing gun base, and a nail magazine. The piston mechanism is connected to the casing. One end of the piston mechanism is connected to the high pressure water pump, and another end is connected to nailing gun base. The nail magazine is disposed at a position corresponding to piston mechanism on the nailing gun base. A phase transition thermal storage device and a steam power generator are positioned inside casing having steam power generator inside phase transition thermal storage device. The steam power generator is connected to high pressure water pump and piston mechanism. The high pressure water pump is further connected to a water supply device 11 on the handle through a second water supply pipe.

Abstract: The invention relates to a cylinder cover for a cylinder of a piston mechanism. In certain embodiments, the cylinder cover includes a cylinder cover body, a valve plate, and a one-directional valve. The cylinder cover body has an exhaust port, and an oil intake. The exhaust port and oil intake are disposed on outer circumference of the cylinder cover body. The one directional oil valve is formed by a compression spring and a ball. An inner end of the oil intake is connected to the compression spring through the ball and the ball is disposed between one end of the compression spring and the inner end of the oil intake. The valve plate is retained on an inner wall of the cylinder cover body by a retaining nut. The cylinder cover further has an auxiliary heating rod inside cylinder cover body for pre-heating cylinder cover to a predetermined temperature.

Abstract: The invention relates to a high pressure water pump and a steam powered nailing gun having the high pressure water pump. In certain embodiments, high pressure water pump includes: an upper pump body, a lower pump body, a water discharge valve, a water intake valve, a plunger, a guide sleeve, a hammering cap, an adjustment knob, and an evacuation valve. Both upper and lower pump body are connected by connecting bolts. A sealing ring is disposed between upper and lower pump body and a sealing element is disposed between the upper pump body and plunger. Plunger is sheathed in upper pump body. The hammering cap is threadedly connected to the plunger. The adjustment knob is connected to an upper end of upper pump body. The hammering cap is moveably connected to the adjustment knob through the plunger. A plunger reset spring is disposed between hammering cap and adjustment knob.

Abstract: The present invention relates to a steam powered nailing gun. In certain embodiments, the steam powered nailing gun includes a handle, a casing, a high pressure water pump, a piston mechanism, a nailing gun base, and a nail magazine. The piston mechanism is connected to the casing. One end of the piston mechanism is connected to the high pressure water pump, and another end is connected to nailing gun base. The nail magazine is disposed at a position corresponding to piston mechanism on the nailing gun base. A phase transition thermal storage device and a steam power generator are positioned inside casing having steam power generator inside phase transition thermal storage device. The steam power generator is connected to high pressure water pump and piston mechanism. The high pressure water pump is further connected to a water supply device 11 on the handle through a second water supply pipe.

Abstract: The invention relates to a cylinder cover for a cylinder of a piston mechanism. In certain embodiments, the cylinder cover includes a cylinder cover body, a valve plate, and a one-directional valve. The cylinder cover body has an exhaust port, and an oil intake. The exhaust port and oil intake are disposed on outer circumference of the cylinder cover body. The one directional oil valve is formed by a compression spring and a ball. An inner end of the oil intake is connected to the compression spring through the ball and the ball is disposed between one end of the compression spring and the inner end of the oil intake. The valve plate is retained on an inner wall of the cylinder cover body by a retaining nut. The cylinder cover further has an auxiliary heating rod inside cylinder cover body for pre-heating cylinder cover to a predetermined temperature.

Abstract: The present invention relates to a spring reset device for a piston mechanism. In certain embodiments, the spring reset device includes: a connecting plate, a pull rod, a plurality of reset springs, and a plurality of brackets. The connecting plate has a plurality of connecting pins. Each of the reset springs has a first end, and a second end. Each of the brackets has a connecting pin. The spring reset device is positioned on a top end of a piston body. The piston body includes a piston cylinder body, a piston plate, a piston rod, and a cylinder cover. A lower side of the piston plate is connected to the piston rod through a thread. First end of each of reset springs is rotatably connected to a hook portion of connecting plate. Second end of each of reset springs is rotatably connected a hook portion of a corresponding bracket.

Abstract: The present invention relates to a phase transition heat storage device. In certain embodiments, the phase transition heat storage device includes a housing, a phase transition material body, a plurality of heating devices, a temperature sensor, and a temperature controller. The phase transition material body is disposed inside the housing. The heating devices enter the housing and are implanted inside the phase transition material body. The temperature sensor has a first end and a second end. The temperature controller is disposed outside of the housing. The first end of the temperature sensor is disposed inside the phase transition material body, and the second end of the temperature sensor is connected to the temperature controller through a first wire. The heating devices are connected to the temperature controller through a second wire. The present invention also relates to a steam powered nailing gun having a phase transition heat storage device.

Abstract: The present invention discloses a saturated water explosive device, including a water intake pipe, a flow splitter for splitting a high-pressure liquid, a flow baffle for baffling the high-pressure liquid, a heat receiver having a cavity defined inside, a pillar connected with the heat receiver by a micro-channel wherein the high-pressure liquid is heated to be high-temperature saturated water, and a heat source for heating the cavity. High-pressure water is heated to produce high-temperature high-pressure saturated water, and then by using the saturated water explosive device of the present invention, the produced high-temperature high-pressure saturated water instantaneously explodes as being heated, and a high-temperature high-pressure steam flow is produced due to rapid vaporization, and expansion and is used as a power source.

Abstract: A speaker having a voice coil is disclosed. The voice coil includes two parallel main members and two linking members connecting the two main members for forming a closed loop, one of the linking member having at least a first part from a first circle having a first diameter, and at least a second part from a second circle having a second diameter greater than the first diameter.

Abstract: A speaker having a voice coil is disclosed. The voice coil includes two parallel main members and two linking members connecting the two main members for forming a closed loop, one of the linking member having at least a first part from a first circle having a first diameter, and at least a second part from a second circle having a second diameter greater than the first diameter.

Abstract: An embedded metal heat sink for a semiconductor device is described. The embedded metal heat sink for a semiconductor device comprises a metal thin layer, a metal heat sink and two bonding pads. The metal thin layer including a first surface and a second surface on opposite sides, wherein at least one semiconductor device is embedded in the first surface of the metal thin layer, and the semiconductor device has two electrodes with different conductivity types. The metal heat sink is deposited on the second surface of the metal thin layer. The bonding pads are deposed on the first surface of the metal thin layer around the semiconductor device and are respectively corresponding to the electrodes, wherein the electrodes are electrically and respectively connected to the corresponding bonding pads by at least two wires, and the bonding pads are electrically connected to an outer circuit.

Abstract: An embedded metal heat sink for a semiconductor device and a method for manufacturing the same are described. The embedded metal heat sink for a semiconductor device comprises a metal thin layer, a metal heat sink and two bonding pads. The metal thin layer including a first surface and a second surface on opposite sides, wherein at least one semiconductor device is embedded in the first surface of the metal thin layer, and the semiconductor device has two electrodes with different conductivity types. The metal heat sink is deposited on the second surface of the metal thin layer. The bonding pads are deposed on the first surface of the metal thin layer around the semiconductor device and are respectively corresponding to the electrodes, wherein the electrodes are electrically and respectively connected to the corresponding bonding pads by at least two wires, and the bonding pads are electrically connected to an outer circuit.

Abstract: An embedded metal heat sink for a semiconductor device is described. The embedded metal heat sink for a semiconductor device comprises a metal thin layer, a metal heat sink and two bonding pads. The metal thin layer including a first surface and a second surface on opposite sides, wherein at least one semiconductor device is embedded in the first surface of the metal thin layer, and the semiconductor device has two electrodes with different conductivity types. The metal heat sink is deposited on the second surface of the metal thin layer. The bonding pads are deposed on the first surface of the metal thin layer around the semiconductor device and are respectively corresponding to the electrodes, wherein the electrodes are electrically and respectively connected to the corresponding bonding pads by at least two wires, and the bonding pads are electrically connected to an outer circuit.

Abstract: A method for manufacturing a heat sink of a semiconductor device is described. In the method, an adhesive tape is provided, wherein the adhesive tape includes a first surface and a second surface on opposite sides, and the first surface of the adhesive tape adheres to a surface of a temporary substrate. At least one semiconductor device is provided, wherein the semiconductor device includes a first side and a second side opposite to the first side, and the first side of the one semiconductor device is pressed and set into a portion of the second surface of the adhesive tape, and the second side of the one semiconductor device is exposed. A thin metal layer is formed on the second side of the semiconductor device and the exposed portion of the second surface of the adhesive tape. A metal heat sink is formed on the thin metal layer. Then, the adhesive tape and the temporary substrate are removed.

Abstract: An embedded metal heat sink for a semiconductor device and a method for manufacturing the same are described. The embedded metal heat sink for a semiconductor device comprises a metal thin layer, a metal heat sink and two bonding pads. The metal thin layer including a first surface and a second surface on opposite sides, wherein at least one semiconductor device is embedded in the first surface of the metal thin layer, and the semiconductor device has two electrodes with different conductivity types. The metal heat sink is deposited on the second surface of the metal thin layer. The bonding pads are deposed on the first surface of the metal thin layer around the semiconductor device and are respectively corresponding to the electrodes, wherein the electrodes are electrically and respectively connected to the corresponding bonding pads by at least two wires, and the bonding pads are electrically connected to an outer circuit.

Abstract: A method for manufacturing a heat sink of a semiconductor device is described. In the method, an adhesive tape is provided, wherein the adhesive tape includes a first surface and a second surface on opposite sides, and the first surface of the adhesive tape adheres to a surface of a temporary substrate. At least one semiconductor device is provided, wherein the semiconductor device includes a first side and a second side opposite to the first side, and the first side of the one semiconductor device is pressed and set into a portion of the second surface of the adhesive tape, and the second side of the one semiconductor device is exposed. A thin metal layer is formed on the second side of the semiconductor device and the exposed portion of the second surface of the adhesive tape. A metal heat sink is formed on the thin metal layer. Then, the adhesive tape and the temporary substrate are removed.

Abstract: A light-emitting device and a process for manufacturing the same are described. The light-emitting device comprises: a thin metal layer including a first surface and a second surface on opposite sides; a metal heat sink directly formed and closely connected to the second surface of the thin metal layer; and a light-emitting chip deposed on a portion of the first surface of the thin metal layer, wherein the thin metal layer directly contacts and is closely connected with the light-emitting chip.