Patents by Inventor Jinsong Lu

Jinsong Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240069403
    Abstract: The display panel includes: a first substrate and a second substrate disposed opposite to the first substrate, wherein an electrophoresis layer and electrophoresis ions are disposed on the first substrate, the electrophoresis layer is located between the second substrate and the first substrate, the electrophoresis layer is provided with a plurality of electrophoresis tanks arranged in an array, openings of the electrophoresis tanks face the second substrate, and the electrophoresis ions are located in the electrophoresis tanks; and one of the electrophoresis layer and the second substrate is provided with a positioning groove, the other is provided with a positioning block embedded into the positioning groove, and orthographic projections of the positioning groove and the positioning block on the first substrate are at least partially located between orthographic projections of two adjacent electrophoresis tanks on the first substrate. The pressure resistance of the display panel is improved.
    Type: Application
    Filed: December 22, 2022
    Publication date: February 29, 2024
    Inventors: Jinsong LU, Song Sun, Qin Xiong, Kaijun Liu, Haoxuan Zheng
  • Publication number: 20230137855
    Abstract: A method of fabricating an array substrate and an array substrate are disclosed. The array substrate includes a bonding portion, the bonding portion being fabricated by: providing a substrate, and forming a metal layer on the substrate; sequentially depositing a first and a second insulating layer material on the metal layer; etching the first and second insulating layer material respectively at a first etching rate and a second etching rate to form a first insulating layer having a first via hole and a second insulating layer having a second via hole, respectively, thus obtaining a composite insulating layer of a double-layer structure; forming on the composite insulating layer an electrode layer connected to the metal layer through the first and second via holes to form the bonding portion; where the first etching rate and the second etching rate are different, and the first and second via holes are arranged correspondingly.
    Type: Application
    Filed: October 25, 2022
    Publication date: May 4, 2023
    Inventors: SONG SUN, Qin Xiong, Jinsong Lu, Je-Hao Hsu, Haijiang Yuan