Abstract: A polishing apparatus includes a shank including a rotation shaft extending in a first direction, a first cushion unit covering a side surface of the shank and having a first hardness, a first film unit adjacent to the first cushion unit in a second direction crossing the first direction and covering a side surface of the first cushion unit, a second cushion unit disposed below the shank, having a second hardness different from the first hardness, and including a first part and a second part. The first part has a cylindrical shape and the second part is disposed below the first part and has a conical shape protruding in a direction opposite to the first part, and a second film unit covering the second part.

Abstract: A storage device may include a memory, a humidity sensor that collects humidity information of the storage device, and a storage controller that performs a heating operation set to increase a temperature of the storage device through the memory if a humidity value of the humidity information exceeds a reference humidity value.

Abstract: A semiconductor package includes; a package substrate including an upper surface with a bonding pad, a lower semiconductor chip disposed on the upper surface of the package substrate, wherein an upper surface of the lower semiconductor chip includes a connect edge region including a connection pad and an open edge region including a dam structure including dummy bumps, a bonding wire having a first height above the upper surface of the lower semiconductor chip and connecting the bonding pad and the connection pad, an upper semiconductor chip disposed on the upper surface of the lower semiconductor chip using an inter-chip bonding layer, and a molding portion on the package substrate and substantially surrounding the lower semiconductor chip and the upper semiconductor chip.

Abstract: An apparatus for measuring blood components, includes: an impedance sensor configured to measure a bio-impedance of a user; and a processor configured to measure, by using a multiple-output artificial neural network (ANN) learning model, a concentration of a basic blood component and a concentration of at least one auxiliary blood component associated with the basic blood component, based on user metadata and the measured bio-impedance.

Abstract: A semiconductor package device includes a package substrate, an interposer on the package substrate, a semiconductor package on the interposer, and an under-fill between the interposer and the semiconductor package. The interposer includes at least one first trench at an upper portion of the interposer that extends in a first direction parallel to a top surface of the package substrate. The at least one first trench vertically overlaps an edge region of the semiconductor package. The under-fill fills at least a portion of the at least one trench.

Abstract: Disclosed is a semiconductor module comprising a module substrate having a top surface and a bottom surface that are opposite to each other, a plurality of semiconductor packages on the top surface of the module substrate and arranged in a first direction parallel to the top surface of the module substrate, and a clip structure on the top surface of the module substrate and spaced apart from the plurality of semiconductor packages in the first direction. The clip structure includes a body part on the top surface of the module substrate and spaced apart from the plurality of semiconductor packages in the first direction, and a connection part that extends from the body part across a lateral surface of the module substrate onto the bottom surface of the module substrate.

Abstract: A semiconductor package includes; a package substrate including an upper surface with a bonding pad, a lower semiconductor chip disposed on the upper surface of the package substrate, wherein an upper surface of the lower semiconductor chip includes a connect edge region including a connection pad and an open edge region including a dam structure including dummy bumps, a bonding wire having a first height above the upper surface of the lower semiconductor chip and connecting the bonding pad and the connection pad, an upper semiconductor chip disposed on the upper surface of the lower semiconductor chip using an inter-chip bonding layer, and a molding portion on the package substrate and substantially surrounding the lower semiconductor chip and the upper semiconductor chip.

Abstract: An apparatus for estimating lipid concentration is provided. According to an example embodiment, the apparatus may include a training data collector configured to collect, as training data, a reference lipid concentration measured through blood samples of a plurality of users for a predetermined time period and sensor data obtained through light signals detected from the plurality of users for the predetermined time period and a processor configured to perform preprocessing including a moving average and data augmentation on the obtained sensor data, select a valid variable relevant to a change in lipid concentration based on the preprocessed sensor data and the reference lipid concentration, and generate a lipid concentration prediction model based on the selected valid variable.

Abstract: A semiconductor package device includes a package substrate, an interposer on the package substrate, a semiconductor package on the interposer, and an under-fill between the interposer and the semiconductor package. The interposer includes at least one first trench at an upper portion of the interposer that extends in a first direction parallel to a top surface of the package substrate. The at least one first trench vertically overlaps an edge region of the semiconductor package. The under-fill fills at least a portion of the at least one trench.