Patents by Inventor Jin Sook HWANG

Jin Sook HWANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • POLISHING SLURRY COMPOSITION
    Publication number: 20220195243
    Abstract: A polishing slurry composition is provided. The polishing slurry composition includes polishing particles, a first polishing inhibitor containing a hydrophobic amino acid, and a second polishing inhibitor containing a cyclic polymer, and the first polishing inhibitor and the second polishing inhibitor are different.
    Type: Application
    Filed: December 16, 2021
    Publication date: June 23, 2022
    Applicant: KCTECH CO., LTD.
    Inventors: Jin Sook HWANG, Hyun Goo KONG, Yun Su KIM
  • POLISHING SLURRY COMPOSITION
    Publication number: 20220127495
    Abstract: A polishing slurry composition is provided. The polishing slurry composition includes abrasive particles, an oxidizer, an iron-containing catalyst, and a stabilizer, and a retention rate of the oxidizer according to Equation 1 is 70% or greater.
    Type: Application
    Filed: October 27, 2021
    Publication date: April 28, 2022
    Applicant: KCTECH CO., LTD.
    Inventors: Jin Sook HWANG, Hyun Goo KONG, Eun Jin LEE
  • SLURRY COMPOSITION FOR CHEMICAL MECHANICAL POLISHING
    Publication number: 20210269675
    Abstract: A slurry composition for chemical mechanical polishing (CMP) is provided. The slurry composition for CMP includes abrasive particles, an oxidizer, and a carbon polishing inhibitor.
    Type: Application
    Filed: February 25, 2021
    Publication date: September 2, 2021
    Applicant: KCTECH CO., LTD.
    Inventors: Jin Sook HWANG, Hyun Goo KONG, In Seol HWANG
  • Polishing slurry composition
    Patent number: 10077381
    Abstract: A polishing slurry composition is provided. The polishing slurry composition includes at least two types of abrasive particles among first abrasive particles, second abrasive particles, and third abrasive particles, and an oxidizer. A peak-to-valley roughness Rpv decreases when a contact area between the abrasive particles and a tungsten-containing film increases.
    Type: Grant
    Filed: July 8, 2016
    Date of Patent: September 18, 2018
    Assignee: KCTech Co., Ltd.
    Inventors: Dong Kyu Choi, Young Ho Yoon, Hyun Goo Kong, Jin Sook Hwang, Han Teo Park
  • Slurry composition for polishing tungsten
    Patent number: 9994735
    Abstract: A slurry composition for polishing tungsten is provided. The slurry composition for polishing tungsten may include a water-soluble polymer, abrasive particles and an etching adjuster.
    Type: Grant
    Filed: June 22, 2016
    Date of Patent: June 12, 2018
    Assignee: KCTECH CO., LTD.
    Inventors: Jin Sook Hwang, Hyun Goo Kong, Han Teo Park
  • POLISHING SLURRY COMPOSITION
    Publication number: 20170022391
    Abstract: A polishing slurry composition is provided. The polishing slurry composition includes at least two types of abrasive particles among first abrasive particles, second abrasive particles, and third abrasive particles, and an oxidizer. A peak-to-valley roughness Rpv decreases when a contact area between the abrasive particles and a tungsten-containing film increases.
    Type: Application
    Filed: July 8, 2016
    Publication date: January 26, 2017
    Applicant: K.C. Tech Co., Ltd.
    Inventors: Dong Kyu CHOI, Young Ho YOON, Hyun Goo KONG, Jin Sook HWANG, Han Teo PARK
  • SLURRY COMPOSITION FOR POLISHING TUNGSTEN
    Publication number: 20170009353
    Abstract: A slurry composition for polishing tungsten is provided. The slurry composition for polishing tungsten may include a water-soluble polymer, abrasive particles and an etching adjuster.
    Type: Application
    Filed: June 22, 2016
    Publication date: January 12, 2017
    Applicant: K.C. Tech Co., Ltd.
    Inventors: Jin Sook HWANG, Hyun Goo KONG, Han Teo PARK