Patents by Inventor Jinsu HEO

Jinsu HEO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250219302
    Abstract: The disclosure relates to a 5th generation (5G) or pre-5G communication system for supporting a higher data transmission rate than a 4th generation (4G) communication system such as long term evolution (LTE). An antenna module is provided. The antenna module includes a plurality of antennas, a first printed circuit board (PCB) on which the plurality of antennas are disposed, a second PCB on which one or more elements for processing a radio frequency (RF) signal are disposed, and an adhesive material for bonding the first PCB and the second PCB, wherein the first PCB includes a first metal layer, a second metal layer, a dielectric, and a coupling structure plated along the first metal layer, the second metal layer, and a via hole between the first metal layer and the second metal layer, and may be disposed to provide a coupling connection through the coupling structure of the first PCB.
    Type: Application
    Filed: March 19, 2025
    Publication date: July 3, 2025
    Inventors: Sanghoon PARK, Kwanghyun BAEK, Juneseok LEE, Dohyuk HA, Jungho PARK, Youngju LEE, Jungyub LEE, Jinsu HEO
  • Patent number: 12316008
    Abstract: According to various embodiments of the disclosure, an antenna device comprises: a first antenna array including an array of a plurality of first radiation patches, a communication circuit configured to transmit and/or receive a radio signal using at least one of the first radiation patches, and at least one first isolator comprising a conductor disposed in an area between two adjacent first radiation patches among the first radiation patches. The first isolator may include a first portion, a second portion disposed in parallel with the first portion, and a third portion electrically connecting the first portion with the second portion. The first portion and the second portion may be configured to generate current flows having a phase difference of 180 degrees with respect to each other.
    Type: Grant
    Filed: December 29, 2023
    Date of Patent: May 27, 2025
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Juneseok Lee, Jinsu Heo, Youngsub Kim, Jungho Park, Kwanghyun Baek, Youngju Lee, Kyoungho Jeong, Dohyuk Ha
  • Patent number: 12300898
    Abstract: The disclosure relates to a 5th generation (5G) or pre-5G communication system for supporting a higher data transmission rate than a 4th generation (4G) communication system such as long term evolution (LTE). An antenna module is provided. The antenna module includes a plurality of antennas, a first printed circuit board (PCB) on which the plurality of antennas are disposed, a second PCB on which one or more elements for processing a radio frequency (RF) signal are disposed, and an adhesive material for bonding the first PCB and the second PCB, wherein the first PCB includes a first metal layer, a second metal layer, a dielectric, and a coupling structure plated along the first metal layer, the second metal layer, and a via hole between the first metal layer and the second metal layer, and may be disposed to provide a coupling connection through the coupling structure of the first PCB.
    Type: Grant
    Filed: March 30, 2023
    Date of Patent: May 13, 2025
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sanghoon Park, Kwanghyun Baek, Juneseok Lee, Dohyuk Ha, Jungho Park, Youngju Lee, Jungyub Lee, Jinsu Heo
  • Publication number: 20250096486
    Abstract: An antenna assembly is provided. The antenna assembly includes a first flexible printed circuit board (FPCB) for multiple first antennas, a second flexible printed circuit board (FPCB) for multiple second antennas, a metal plate including multiple holes, a first adhesive material layer for bonding between the metal plate and the first FPCB, and a second adhesive material layer for bonding between the metal plate and the second FPCB, wherein the metal plate is disposed such that the multiple first antennas are located in the multiple holes, respectively and the multiple second antennas to be located in the multiple holes, respectively.
    Type: Application
    Filed: November 29, 2024
    Publication date: March 20, 2025
    Inventors: Sanghoon PARK, Jungho PARK, Kwanghyun BAEK, Youngju LEE, Jungyub LEE, Juneseok LEE, Dohyuk HA, Jinsu HEO
  • Patent number: 12218407
    Abstract: The disclosure relates to a pre-5th-Generation (5G) or 5G communication system for supporting higher data rates Beyond 4th-Generation (4G) communication system, such as long term evolution (LTE). An antenna device is provided. The antenna device includes a first printed circuit board (PCB), a second PCB for a plurality of antenna elements, and a radio frequency integrated circuit (RFIC) coupled through a first surface of the first PCB. The second PCB may include a radio frequency (RF) routing layer including RF lines for the respective plurality of antenna elements. The first PCB may include a feeding structure for connecting the RF routing layer and the RFIC. The second PCB may be electrically connected to a second surface of the first PCB opposite to the first surface of the first PCB, through a first surface of the second PCB. The second PCB may be coupled to the plurality of antenna elements.
    Type: Grant
    Filed: September 16, 2022
    Date of Patent: February 4, 2025
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Juneseok Lee, Youngsub Kim, Sanghoon Park, Jungho Park, Kwanghyun Baek, Youngju Lee, Jungyub Lee, Dohyuk Ha, Jinsu Heo
  • Patent number: 12183969
    Abstract: The present disclosure relates to a communication technique for converging, with IoT technology, a 5G communication system for supporting a higher data transfer rate beyond the 4G system, and a system therefor. The present disclosure may be applied to intelligent services (for example, smart homes, smart buildings, smart cities, smart cars or connected cars, healthcare, digital education, retail businesses, security- and safety-related services, etc.) on the basis of 5G communication technology and IoT-related technology. Disclosed is a cover device for protecting an antenna device which is mounted in an electronic device to radiate a beam in an ultrahigh-frequency band, the cover device comprising: a cover frame including an open window region corresponding to a radiation region of the antenna device; and a thickness compensation structure disposed in the window region on the cover frame and having a different thickness according to the frequency band of the beam radiated from the antenna device.
    Type: Grant
    Filed: December 15, 2020
    Date of Patent: December 31, 2024
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Sanghoon Park, Juneseok Lee, Dohyuk Ha, Jinsu Heo, Youngju Lee
  • Patent number: 12176620
    Abstract: According to various embodiments of the disclosure, an antenna device comprises: a first antenna array including an array of a plurality of first radiation patches, a communication circuit configured to transmit and/or receive a radio signal using at least one of the first radiation patches, and at least one first isolator comprising a conductor disposed in an area between two adjacent first radiation patches among the first radiation patches. The first isolator may include a first portion, a second portion disposed in parallel with the first portion, and a third portion electrically connecting the first portion with the second portion. The first portion and the second portion may be configured to generate current flows having a phase difference of 180 degrees with respect to each other.
    Type: Grant
    Filed: October 7, 2021
    Date of Patent: December 24, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Juneseok Lee, Jinsu Heo, Youngsub Kim, Jungho Park, Kwanghyun Baek, Youngju Lee, Kyoungho Jeong, Dohyuk Ha
  • Patent number: 12160047
    Abstract: An antenna assembly is provided. The antenna assembly includes a first flexible printed circuit board (FPCB) for multiple first antennas, a second flexible printed circuit board (FPCB) for multiple second antennas, a metal plate including multiple holes, a first adhesive material layer for bonding between the metal plate and the first FPCB, and a second adhesive material layer for bonding between the metal plate and the second FPCB, wherein the metal plate is disposed such that the multiple first antennas are located in the multiple holes, respectively and the multiple second antennas to be located in the multiple holes, respectively.
    Type: Grant
    Filed: January 10, 2023
    Date of Patent: December 3, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sanghoon Park, Jungho Park, Kwanghyun Baek, Youngju Lee, Jungyub Lee, Juneseok Lee, Dohyuk Ha, Jinsu Heo
  • Publication number: 20240235059
    Abstract: According to various embodiments of the disclosure, an antenna device comprises: a first antenna array including an array of a plurality of first radiation patches, a communication circuit configured to transmit and/or receive a radio signal using at least one of the first radiation patches, and at least one first isolator comprising a conductor disposed in an area between two adjacent first radiation patches among the first radiation patches. The first isolator may include a first portion, a second portion disposed in parallel with the first portion, and a third portion electrically connecting the first portion with the second portion. The first portion and the second portion may be configured to generate current flows having a phase difference of 180 degrees with respect to each other.
    Type: Application
    Filed: December 29, 2023
    Publication date: July 11, 2024
    Inventors: Juneseok LEE, Jinsu Heo, Youngsub Kim, Jungho Park, Kwanghyun Baek, Youngju Lee, Kyoungho Jeong, Dohyuk Ha
  • Patent number: 12027774
    Abstract: The present disclosure relates to a 5th generation (5G) or pre-5G communication system for supporting higher data transmission rates than a 4th generation (4G) communication system such as long-term evolution (LTE). An antenna module in a wireless communication system includes: a printed circuit board (PCB); a radio frequency integrated circuit (RFIC); and a plurality of antenna elements for emitting a radio frequency (RF) signal, wherein the plurality of antenna elements may be disposed in a first area of a first surface of the PCB, and the RFIC may be disposed in a second area, different from the first area, of the first surface of the PCB.
    Type: Grant
    Filed: October 14, 2020
    Date of Patent: July 2, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Dohyuk Ha, Kwanghyun Baek, Juneseok Lee, Jinsu Heo, Youngju Lee, Jungyub Lee
  • Patent number: 12009579
    Abstract: The disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. Disclosed is a cover device configured to protect an antenna device embedded in an electronic device to radiate a beam of an ultra-high frequency band, the cover device including: a cover frame including a window area corresponding to a radiation area of the antenna device; and a functional structure disposed in the window area on the cover frame and having a stacked structure comprising one or more functional layers.
    Type: Grant
    Filed: June 12, 2023
    Date of Patent: June 11, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sanghoon Park, Juneseok Lee, Dohyuk Ha, Jungyub Lee, Jinsu Heo, Youngju Lee
  • Publication number: 20240136734
    Abstract: According to various embodiments of the disclosure, an antenna device comprises: a first antenna array including an array of a plurality of first radiation patches, a communication circuit configured to transmit and/or receive a radio signal using at least one of the first radiation patches, and at least one first isolator comprising a conductor disposed in an area between two adjacent first radiation patches among the first radiation patches. The first isolator may include a first portion, a second portion disposed in parallel with the first portion, and a third portion electrically connecting the first portion with the second portion. The first portion and the second portion may be configured to generate current flows having a phase difference of 180 degrees with respect to each other.
    Type: Application
    Filed: December 29, 2023
    Publication date: April 25, 2024
    Inventors: Juneseok LEE, Jinsu Heo, Youngsub Kim, Jungho Park, Kwanghyun Baek, Youngju Lee, Kyoungho Jeong, Dohyuk Ha
  • Patent number: 11871516
    Abstract: The disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. An electronic apparatus is provided. The electronic apparatus includes a printed circuit board (PCB), an antenna module mounted on a surface of the printed circuit board, and a radio frequency integrated circuit (RFIC) module mounted on another surface of the printed circuit. The printed circuit board includes a coaxial plated through-hole (PTH) electrically connected with the antenna module and the RFIC.
    Type: Grant
    Filed: September 30, 2022
    Date of Patent: January 9, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kwanghyun Baek, Juneseok Lee, Dohyuk Ha, Youngju Lee, Jinsu Heo
  • Publication number: 20230387598
    Abstract: The disclosure relates to a 5th generation (5G) or pre-5G communication system for supporting a data transmission rate higher than that of a 4th generation (4G) communication system such as long term evolution (LTE). An antenna structure of a wireless communication system is provided. The antenna structure includes a first radiator, a first printed circuit board (PCB) in which the first radiator is arranged, a plurality of second radiators, a second PCB in which the plurality of second radiators are arranged, and a frame structure, wherein the frame structure is arranged such that an air layer is formed between the first PCB and the second PCB, and the plurality of second radiators can include a first metal patch arranged in a region corresponding to the first radiator, and a plurality of second metal patches arranged to be separated from the first metal patch so as to be fed by coupling.
    Type: Application
    Filed: August 9, 2023
    Publication date: November 30, 2023
    Inventors: Youngsub KIM, Sanghoon PARK, Jungho PARK, Kwanghyun BAEK, Youngju LEE, Jungyub LEE, Juneseok LEE, Dohyuk HA, Jinsu HEO
  • Publication number: 20230361451
    Abstract: The disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. Disclosed is a cover device configured to protect an antenna device embedded in an electronic device to radiate a beam of an ultra-high frequency band, the cover device including: a cover frame including a window area corresponding to a radiation area of the antenna device; and a functional structure disposed in the window area on the cover frame and having a stacked structure comprising one or more functional layers.
    Type: Application
    Filed: June 12, 2023
    Publication date: November 9, 2023
    Inventors: Sanghoon PARK, Juneseok LEE, Dohyuk HA, Jungyub LEE, Jinsu HEO, Youngju LEE
  • Publication number: 20230299506
    Abstract: The disclosure relates to a 5th generation (5G) or pre-5G communication system for supporting a higher data transmission rate than a 4th generation (4G) communication system such as long term evolution (LTE). An antenna module is provided. The antenna module includes a plurality of antennas, a first printed circuit board (PCB) on which the plurality of antennas are disposed, a second PCB on which one or more elements for processing a radio frequency (RF) signal are disposed, and an adhesive material for bonding the first PCB and the second PCB, wherein the first PCB includes a first metal layer, a second metal layer, a dielectric, and a coupling structure plated along the first metal layer, the second metal layer, and a via hole between the first metal layer and the second metal layer, and may be disposed to provide a coupling connection through the coupling structure of the first PCB.
    Type: Application
    Filed: March 30, 2023
    Publication date: September 21, 2023
    Inventors: Sanghoon PARK, Kwanghyun BAEK, Juneseok LEE, Dohyuk HA, Jungho PARK, Youngju LEE, Jungyub LEE, Jinsu HEO
  • Patent number: 11764459
    Abstract: The disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. An antenna module is provided. The antenna module includes a flexible printed circuit board (FPCB) including a first surface directed in a first direction and a second surface directed in a second direction that forms a predetermined first angle with respect to the first direction, a first antenna deployed on one surface of the first surface, and a second antenna deployed on one surface of the second surface.
    Type: Grant
    Filed: December 28, 2022
    Date of Patent: September 19, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Juneseok Lee, Junsig Kum, Kwanghyun Baek, Dohyuk Ha, Jinsu Heo, Youngju Lee, Jungyub Lee
  • Patent number: 11677138
    Abstract: The disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. Disclosed is a cover device configured to protect an antenna device embedded in an electronic device to radiate a beam of an ultra-high frequency band, the cover device including: a cover frame including a window area corresponding to a radiation area of the antenna device; and a functional structure disposed in the window area on the cover frame and having a stacked structure comprising one or more functional layers.
    Type: Grant
    Filed: December 1, 2020
    Date of Patent: June 13, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sanghoon Park, Juneseok Lee, Dohyuk Ha, Jungyub Lee, Jinsu Heo, Youngju Lee
  • Publication number: 20230132490
    Abstract: The disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. An antenna module is provided. The antenna module includes a flexible printed circuit board (FPCB) including a first surface directed in a first direction and a second surface directed in a second direction that forms a predetermined first angle with respect to the first direction, a first antenna deployed on one surface of the first surface, and a second antenna deployed on one surface of the second surface.
    Type: Application
    Filed: December 28, 2022
    Publication date: May 4, 2023
    Inventors: Juneseok LEE, Junsig KUM, Kwanghyun BAEK, Dohyuk HA, Jinsu HEO, Youngju LEE, Jungyub LEE
  • Patent number: 11641063
    Abstract: The present invention relates to a communication technique for fusing a 5G communication system to support a higher data transmission rate than a 4G system, with IoT technology, and a system thereof. This disclosure is based on 5G communication technology and the IoT related technology and can be applied to intelligent services (for example, smart home, smart building, smart city, smart car or connected car, healthcare, digital education, retail, security, safety-related services, or the like). In addition, the present invention provides an antenna module comprising an antenna and a lens, wherein the antenna comprises a first antenna array which deflects and radiates a radio wave from a vertical plane of the antenna by a predetermined first angle, and the lens can be spaced apart from the antenna by a first determined distance to change the phase of the radio wave radiated from the antenna.
    Type: Grant
    Filed: November 19, 2018
    Date of Patent: May 2, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seungtae Ko, Yoongeon Kim, Hyunjin Kim, Jinsu Heo, Youngju Lee