Patents by Inventor Jintang SHANG

Jintang SHANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Micro three-dimensional shell resonator gyroscope
    Patent number: 10527422
    Abstract: The present invention discloses a micro three-dimensional shell resonator gyroscope, a method for fabricating a micro shell resonator, a method for fabricating a composite structure substrate, and a method for fabricating a micro three-dimensional shell resonator gyroscope. A micro three-dimensional shell resonator gyroscope includes a packaging shell cover, a micro shell resonator, and a composite structure substrate. The micro shell resonator includes a shell, a single-ended column, and a flange. The composite structure substrate includes a non-planar electrode, a conductive structure, an electrical isolation part, and a main body part. The non-planar electrode includes a driving electrode, a detection circuit, an annular exciting electrode, and an isolation electrode.
    Type: Grant
    Filed: December 15, 2016
    Date of Patent: January 7, 2020
    Assignee: SOUTHEAST UNIVERSITY
    Inventors: Jintang Shang, Bin Luo
  • Wafer-level manufacturing method for embedding passive element in glass substrate
    Patent number: 10321577
    Abstract: A wafer-level manufacturing method for embedding a passive element in a glass substrate is disclosed.
    Type: Grant
    Filed: June 11, 2017
    Date of Patent: June 11, 2019
    Assignee: Southeast University
    Inventors: Jintang Shang, Mengying Ma
  • MICRO THREE-DIMENSIONAL SHELL RESONATOR GYROSCOPE
    Publication number: 20180188030
    Abstract: The present invention discloses a micro three-dimensional shell resonator gyroscope, a method for fabricating a micro shell resonator, a method for fabricating a composite structure substrate, and a method for fabricating a micro three-dimensional shell resonator gyroscope. A micro three-dimensional shell resonator gyroscope includes a packaging shell cover, a micro shell resonator, and a composite structure substrate. The micro shell resonator includes a shell, a single-ended column, and a flange. The composite structure substrate includes a non-planar electrode, a conductive structure, an electrical isolation part, and a main body part. The non-planar electrode includes a driving electrode, a detection circuit, an annular exciting electrode, and an isolation electrode.
    Type: Application
    Filed: December 15, 2016
    Publication date: July 5, 2018
    Applicant: SOUTHEAST UNIVERSITY
    Inventors: Jintang SHANG, Bin LUO
  • WAFER-LEVEL MANUFACTURING METHOD FOR EMBEDDING PASSIVE ELEMENT IN GLASS SUBSTRATE
    Publication number: 20170280566
    Abstract: A wafer-level manufacturing method for embedding a passive element in a glass substrate is disclosed.
    Type: Application
    Filed: June 11, 2017
    Publication date: September 28, 2017
    Applicant: Southeast University
    Inventors: Jintang SHANG, Mengying MA
  • Foaming process for preparing wafer-level glass micro-cavities
    Patent number: 8887527
    Abstract: A foaming process for preparing wafer-level glass micro-cavities that include, etching silicon trenches on a Si wafer through Si micro-machining process; placing high-temperature outgassing agent in the silicon trenches; bonding the Si wafer with a piece of glass wafer by anodic bonding to form sealing cavities; heating up the bonded wafer, and holding the temperature the high-temperature outgassing agent such that the molten glass corresponding to the sealing cavities deforms and structures corresponding to the silicon trenches are formed in the glass; cooling down to obtain wafer-level glass micro-flow channels.
    Type: Grant
    Filed: June 18, 2012
    Date of Patent: November 18, 2014
    Assignee: Southeast University
    Inventor: Jintang Shang
  • FOAMING PROCESS FOR PREPARING WAFER-LEVEL GLASS MICRO-CAVITIES
    Publication number: 20120285198
    Abstract: A foaming process for preparing wafer-level glass micro-cavities that include, etching silicon trenches on a Si wafer through Si micro-machining process; placing high-temperature outgassing agent in the silicon trenches; bonding the Si wafer with a piece of glass wafer by anodic bonding to form sealing cavities; heating up the bonded wafer, and holding the temperature the high-temperature outgassing agent such that the molten glass corresponding to the sealing cavities deforms and structures corresponding to the silicon trenches are formed in the glass; cooling down to obtain wafer-level glass micro-flow channels.
    Type: Application
    Filed: June 18, 2012
    Publication date: November 15, 2012
    Inventor: Jintang SHANG