Patents by Inventor Jintaro Tatsu

Jintaro Tatsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9990577
    Abstract: Provided is a card with a built-in electronic component, which has a superior button click sensation. A card of the present invention into which is built-in a module substrate upon which an electronic component has been disposed is provided with: a front cover sheet stacked upon a side above the module substrate; an adhesion layer adhering between the module substrate and the front cover sheet; and a dome switch which is disposed upon the module substrate, and by way of the card upper surface being pressed, the switch's movable portion deforms to the module substrate side so that the electrical contact comes into tactile contact with the module substrate in order to operate the card; wherein the switch's movable portion is such that the upper surface does not adhere to the adhesion layer and the deformation to the module substrate side is unrestrained with respect to the adhesion layer.
    Type: Grant
    Filed: May 4, 2017
    Date of Patent: June 5, 2018
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventor: Jintaro Tatsu
  • Publication number: 20170236046
    Abstract: Provided is a card with a built-in electronic component, which has a superior button click sensation. A card of the present invention into which is built-in a module substrate upon which an electronic component has been disposed is provided with: a front cover sheet stacked upon a side above the module substrate; an adhesion layer adhering between the module substrate and the front cover sheet; and a dome switch which is disposed upon the module substrate, and by way of the card upper surface being pressed, the switch's movable portion deforms to the module substrate side so that the electrical contact comes into tactile contact with the module substrate in order to operate the card; wherein the switch's movable portion is such that the upper surface does not adhere to the adhesion layer and the deformation to the module substrate side is unrestrained with respect to the adhesion layer.
    Type: Application
    Filed: May 4, 2017
    Publication date: August 17, 2017
    Inventor: Jintaro Tatsu
  • Patent number: 9656505
    Abstract: Provided is a card with a built-in electronic component, which has a superior button click sensation. A card of the present invention into which is built-in a module substrate upon which an electronic component has been disposed is provided with: a front cover sheet stacked upon a side above the module substrate; an adhesion layer adhering between the module substrate and the front cover sheet; and a dome switch which is disposed upon the module substrate, and by way of the card upper surface being pressed, the switch's movable portion deforms to the module substrate side so that the electrical contact comes into tactile contact with the module substrate in order to operate the card; wherein the switch's movable portion is such that the upper surface does not adhere to the adhesion layer and the deformation to the module substrate side is unrestrained with respect to the adhesion layer.
    Type: Grant
    Filed: June 2, 2016
    Date of Patent: May 23, 2017
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventor: Jintaro Tatsu
  • Publication number: 20160275392
    Abstract: Provided is a card with a built-in electronic component, which has a superior button click sensation. A card of the present invention into which is built-in a module substrate upon which an electronic component has been disposed is provided with: a front cover sheet stacked upon a side above the module substrate; an adhesion layer adhering between the module substrate and the front cover sheet; and a dome switch which is disposed upon the module substrate, and by way of the card upper surface being pressed, the switch's movable portion deforms to the module substrate side so that the electrical contact comes into tactile contact with the module substrate in order to operate the card; wherein the switch's movable portion is such that the upper surface does not adhere to the adhesion layer and the deformation to the module substrate side is unrestrained with respect to the adhesion layer.
    Type: Application
    Filed: June 2, 2016
    Publication date: September 22, 2016
    Inventor: Jintaro Tatsu
  • Patent number: 9384436
    Abstract: Provided is a card with a built-in electronic component, which has a superior button click sensation. A card of the present invention into which is built-in a module substrate upon which an electronic component has been disposed is provided with: a front cover sheet stacked upon a side above the module substrate; an adhesion layer adhering between the module substrate and the front cover sheet; and a dome switch which is disposed upon the module substrate, and by way of the card upper surface being pressed, the switch's movable portion deforms to the module substrate side so that the electrical contact comes into tactile contact with the module substrate in order to operate the card; wherein the switch's movable portion is such that the upper surface does not adhere to the adhesion layer and the deformation to the module substrate side is unrestrained with respect to the adhesion layer.
    Type: Grant
    Filed: December 5, 2011
    Date of Patent: July 5, 2016
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventor: Jintaro Tatsu
  • Patent number: 9104949
    Abstract: Provided are a card and card manufacturing method that enable clear visual recognition of a display in a display portion even if the card surface has been provided with a matte finish, and enable an improvement in texture related to position drift between a display device and a window portion, as well as an improvement in workability during manufacture. The card (1) has: a display portion (10); an electronic component that controls a display to the display portion (10); a surface layer (20) placed as the topmost layer of the card (1) and formed from a clear material; a mirror-surface portion (21) provided on a portion that overlaps the display portion (10); and a matte portion (22) provided on a portion outside the mirror-surface portion (21), said matte portion (22) having a coarser grain than the mirror-surface portion (21).
    Type: Grant
    Filed: August 23, 2012
    Date of Patent: August 11, 2015
    Assignee: DAI NIPPON PRINTING CO., LTD
    Inventors: Kiyoaki Kawahara, Jintaro Tatsu
  • Publication number: 20140299666
    Abstract: Provided are a card and card manufacturing method that enable clear visual recognition of a display in a display portion even if the card surface has been provided with a matte finish, and enable an improvement in texture related to position drift between a display device and a window portion, as well as an improvement in workability during manufacture. The card (1) has: a display portion (10); an electronic component that controls a display to the display portion (10); a surface layer (20) placed as the topmost layer of the card (1) and formed from a clear material; a mirror-surface portion (21) provided on a portion that overlaps the display portion (10); and a matte portion (22) provided on a portion outside the mirror-surface portion (21), said matte portion (22) having a coarser grain than the mirror-surface portion (21).
    Type: Application
    Filed: August 23, 2012
    Publication date: October 9, 2014
    Inventors: Kiyoaki Kawahara, Jintaro Tatsu
  • Publication number: 20140016286
    Abstract: Provided is a card with a built-in electronic component, which has a superior button click sensation. A card of the present invention into which is built-in a module substrate upon which an electronic component has been disposed is provided with: a front cover sheet stacked upon a side above the module substrate; an adhesion layer adhering between the module substrate and the front cover sheet; and a dome switch which is disposed upon the module substrate, and by way of the card upper surface being pressed, the switch's movable portion deforms to the module substrate side so that the electrical contact comes into tactile contact with the module substrate in order to operate the card; wherein the switch's movable portion is such that the upper surface does not adhere to the adhesion layer and the deformation to the module substrate side is unrestrained with respect to the adhesion layer.
    Type: Application
    Filed: December 5, 2011
    Publication date: January 16, 2014
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventor: Jintaro Tatsu