Patents by Inventor Jinting Jiu

Jinting Jiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12257622
    Abstract: In the joined body (10) in which the conductor (12) and the substrate (14) are joined by the joining material (13), the joining material (13) includes a sintered body formed by sintering silver powder. A sintered body having a porosity of 8% to 30% and a surface roughness Ra of a joining surface of 500 nm or more and 3.3 ?m or less is adopted.
    Type: Grant
    Filed: October 14, 2020
    Date of Patent: March 25, 2025
    Assignee: SENJU METAL INDUSTRY CO., LTD.
    Inventor: Jinting Jiu
  • Patent number: 12119131
    Abstract: A method for synthesizing a copper-silver alloy includes an ink preparation step, a coating step, a crystal nucleus formation step and a crystal nucleus synthesis step. In the ink preparation step, a copper salt particle, an amine-based solvent, and a silver salt particle are mixed, thereby preparing a copper-silver ink. In the coating step, a member to be coated is coated with the copper-silver ink. In the crystal nucleus formation step, at least one of a crystal nucleus of copper having a crystal grain diameter of 0.2 ?m or less and a crystal nucleus of silver having a crystal grain diameter of 0.2 ?m or less is formed from the copper-silver ink. In the crystal nucleus synthesis step, the crystal nucleus of copper and the crystal nucleus of silver are synthesized.
    Type: Grant
    Filed: August 9, 2021
    Date of Patent: October 15, 2024
    Assignees: SENJU METAL INDUSTRY CO., LTD., OSAKA UNIVERSITY
    Inventors: Jinting Jiu, Minoru Ueshima, Katsuaki Suganuma, Wanli Li
  • Patent number: 11710580
    Abstract: An object of the present invention is to provide an electrically conductive paste and a sintered body thereof having a low electric resistance value and excellent electrical conductivity when made into a sintered body. An electrically conductive paste comprising: a flake-like silver powder having a median diameter D50 of 15 ?m or less; a silver powder having a median diameter D50 of 25 ?m or more; and a solvent, wherein the content of the flake-like silver powder is 15 to 70 parts by mass and the content of the silver powder having a median diameter D50 of 25 ?m or more is 30 to 85 parts by mass based on 100 parts by mass in total of the flake-like silver powder and the silver powder having a median diameter D50 of 25 ?m or more.
    Type: Grant
    Filed: March 20, 2019
    Date of Patent: July 25, 2023
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Jinting Jiu, Tetsu Takemasa, Junko Seino
  • Publication number: 20220347745
    Abstract: In the joined body (10) in which the conductor (12) and the substrate (14) are joined by the joining material (13), the joining material (13) includes a sintered body formed by sintering silver powder. A sintered body having a porosity of 8% to 30% and a surface roughness Ra of a joining surface of 500 nm or more and 3.3 ?m or less is adopted.
    Type: Application
    Filed: October 14, 2020
    Publication date: November 3, 2022
    Inventor: Jinting JIU
  • Patent number: 11278955
    Abstract: An object of the present invention is to provide an electrically conductive paste having excellent bonding strength when bonded to an electronic substrate and the like, a laminated body, and a method for bonding a Cu substrate or Cu electrode to an electrical conductor. An electrically conductive paste comprising: a flake-like silver powder A having a particle size in the range of 1 ?m or more and 15 ?m or less and having a median diameter D50 of 2 ?m or more and 5 ?m or less; a silver powder B having a particle size in the range of 25 ?m or more and 100 ?m or less and having a median diameter D50 of 30 ?m or more and 40 ?m or less; a silver powder C having a particle size in the range of 10 nm or more and 190 nm or less and having a median diameter D50 of 50 nm or more and 150 nm or less; and a solvent, wherein the content of the silver powder C is more than 5.0 parts by mass and less than 90.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: March 22, 2022
    Assignee: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Jinting Jiu, Yoshie Tachibana
  • Publication number: 20220040758
    Abstract: An object of the present invention is to provide an electrically conductive paste having excellent bonding strength when bonded to an electronic substrate and the like, a laminated body, and a method for bonding a Cu substrate or Cu electrode to an electrical conductor. An electrically conductive paste comprising: a flake-like silver powder A having a particle size in the range of 1 ?m or more and 15 ?m or less and having a median diameter D50 of 2 ?m or more and 5 ?m or less; a silver powder B having a particle size in the range of 25 ?m or more and 100 ?m or less and having a median diameter D50 of 30 ?m or more and 40 ?m or less; a silver powder C having a particle size in the range of 10 nm or more and 190 nm or less and having a median diameter D50 of 50 nm or more and 150 nm or less; and a solvent, wherein the content of the silver powder C is more than 5.0 parts by mass and less than 90.
    Type: Application
    Filed: September 30, 2020
    Publication date: February 10, 2022
    Applicant: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Jinting JIU, Yoshie TACHIBANA
  • Patent number: 11217359
    Abstract: A method for synthesizing a copper-silver alloy includes an ink preparation step, a coating step, a crystal nucleus formation step and a crystal nucleus synthesis step. In the ink preparation step, a copper salt particle, an amine-based solvent, and a silver salt particle are mixed, thereby preparing a copper-silver ink. In the coating step, a member to be coated is coated with the copper-silver ink. In the crystal nucleus formation step, at least one of a crystal nucleus of copper having a crystal grain diameter of 0.2 ?m or less and a crystal nucleus of silver having a crystal grain diameter of 0.2 ?m or less is formed from the copper-silver ink. In the crystal nucleus synthesis step, the crystal nucleus of copper and the crystal nucleus of silver are synthesized.
    Type: Grant
    Filed: July 24, 2018
    Date of Patent: January 4, 2022
    Assignees: SENJU METAL INDUSTRY CO., LTD., OSAKA UNIVERSITY
    Inventors: Jinting Jiu, Minoru Ueshima, Katsuaki Suganuma, Wanli Li
  • Publication number: 20210366627
    Abstract: A method for synthesizing a copper-silver alloy includes an ink preparation step, a coating step, a crystal nucleus formation step and a crystal nucleus synthesis step. In the ink preparation step, a copper salt particle, an amine-based solvent, and a silver salt particle are mixed, thereby preparing a copper-silver ink. In the coating step, a member to be coated is coated with the copper-silver ink. In the crystal nucleus formation step, at least one of a crystal nucleus of copper having a crystal grain diameter of 0.2 ?m or less and a crystal nucleus of silver having a crystal grain diameter of 0.2 ?m or less is formed from the copper-silver ink. In the crystal nucleus synthesis step, the crystal nucleus of copper and the crystal nucleus of silver are synthesized.
    Type: Application
    Filed: August 9, 2021
    Publication date: November 25, 2021
    Applicants: SENJU METAL INDUSTRY CO., LTD., OSAKA UNIVERSITY
    Inventors: Jinting JIU, Minoru UESHIMA, Katsuaki SUGANUMA, Wanli LI
  • Publication number: 20210245242
    Abstract: An object of the present invention is to provide an electrically conductive paste and a sintered body thereof having a low electric resistance value and excellent electrical conductivity when made into a sintered body. An electrically conductive paste comprising: a flake-like silver powder having a median diameter D50 of 15 ?m or less; a silver powder having a median diameter D50 of 25 ?m or more; and a solvent, wherein the content of the flake-like silver powder is 15 to 70 parts by mass and the content of the silver powder having a median diameter D50 of 25 ?m or more is 30 to 85 parts by mass based on 100 parts by mass in total of the flake-like silver powder and the silver powder having a median diameter D50 of 25 ?m or more.
    Type: Application
    Filed: March 20, 2019
    Publication date: August 12, 2021
    Applicant: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Jinting JIU, Tetsu TAKEMASA, Junko SEINO
  • Patent number: 10875097
    Abstract: First, a liquid mixture is obtained by mixing at least a silver compound, a reductant, and a dispersant (S1). Then, the liquid mixture is heated to cause reaction between the silver compound and the reductant and generate first silver particles each having a sheet-like or plate-like shape and second silver particles each having a spherical shape or a shape closer to a sphere than the first silver particles and a particle diameter smaller than a maximum value of a length of a side of each of the first silver particles (S2).
    Type: Grant
    Filed: July 22, 2016
    Date of Patent: December 29, 2020
    Assignee: OSAKA UNIVERSITY
    Inventors: Katsuaki Suganuma, Jinting Jiu
  • Publication number: 20200381136
    Abstract: A method for synthesizing a copper-silver alloy includes an ink preparation step, a coating step, a crystal nucleus formation step and a crystal nucleus synthesis step. In the ink preparation step, a copper salt particle, an amine-based solvent, and a silver salt particle are mixed, thereby preparing a copper-silver ink. In the coating step, a member to be coated is coated with the copper-silver ink. In the crystal nucleus formation step, at least one of a crystal nucleus of copper having a crystal grain diameter of 0.2 ?m or less and a crystal nucleus of silver having a crystal grain diameter of 0.2 ?m or less is formed from the copper-silver ink. In the crystal nucleus synthesis step, the crystal nucleus of copper and the crystal nucleus of silver are synthesized.
    Type: Application
    Filed: July 24, 2018
    Publication date: December 3, 2020
    Applicants: SENJU METAL INDUSTRY CO., LTD., OSAKA UNIVERSITY
    Inventors: Jinting JIU, Minoru UESHIMA, Katsuaki SUGANUMA, Wanli LI
  • Patent number: 10651143
    Abstract: Provided is an electrode like a protruding electrode that is self-standing on a substrate. A conductive paste (202) contains a conductive powder, an alcoholic liquid component, and no adhesives. The conductive powder contains conductive particles having a thickness of 0.05 ?m or more and 0.1 ?m or less and a representative length of 5 ?m or more and 10 ?m or less, the representative length being a maximum diameter in a plane perpendicular to the direction of the thickness. The weight percentage of the alcoholic liquid component relative to the conductive paste is 8% or more and 20% or less.
    Type: Grant
    Filed: April 28, 2017
    Date of Patent: May 12, 2020
    Assignees: SHARP KABUSHIKI KAISHA, OSAKA UNIVERSITY
    Inventors: Tomotoshi Satoh, Hiroya Sato, Katsuaki Suganuma, Aiji Suetake, Shijo Nagao, Jinting Jiu, Seiichiro Kihara
  • Patent number: 10625344
    Abstract: A method for producing copper particles includes a preparation step and a heating step. In the preparation step, a copper compound, a salt of a main group metal, and a polyhydric alcohol are prepared. In the heating step, a mixture of the copper compound, the salt of the main group metal, and the polyhydric alcohol is heated. Preferably, the main group metal is at least one selected from the group consisting of lithium, beryllium, sodium, magnesium, aluminum, potassium, calcium, zinc, gallium, germanium, rubidium, strontium, cadmium, indium, tin, antimony, cesium, and barium.
    Type: Grant
    Filed: March 4, 2016
    Date of Patent: April 21, 2020
    Assignee: OSAKA UNIVERSITY
    Inventors: Katsuaki Suganuma, Jinting Jiu
  • Publication number: 20200086391
    Abstract: First, a liquid mixture is obtained by mixing at least a silver compound, a reductant, and a dispersant (S1). Then, the liquid mixture is heated to cause reaction between the silver compound and the reductant and generate first silver particles each having a sheet-like or plate-like shape and second silver particles each having a spherical shape or a shape closer to a sphere than the first silver particles and a particle diameter smaller than a maximum value of a length of a side of each of the first silver particles (S2).
    Type: Application
    Filed: July 22, 2016
    Publication date: March 19, 2020
    Applicant: OSAKA UNIVERSITY
    Inventors: Katsuaki SUGANUMA, Jinting JIU
  • Publication number: 20190157229
    Abstract: Provided is an electrode like a protruding electrode that is self-standing on a substrate. A conductive paste (202) contains a conductive powder, an alcoholic liquid component, and no adhesives. The conductive powder contains conductive particles having a thickness of 0.05 ?m or more and 0.1 ?m or less and a representative length of 5 ?m or more and 10 ?m or less, the representative length being a maximum diameter in a plane perpendicular to the direction of the thickness. The weight percentage of the alcoholic liquid component relative to the conductive paste is 8% or more and 20% or less.
    Type: Application
    Filed: April 28, 2017
    Publication date: May 23, 2019
    Applicants: Sharp Kabushiki Kaisha, Osaka University
    Inventors: Tomotoshi SATOH, Hiroya SATO, Katsuaki SUGANUMA, Aiji SUETAKE, Shijo NAGAO, Jinting JIU, Seiichiro KIHARA
  • Patent number: 10201852
    Abstract: A silver particle synthesizing method includes reducing a dispersant from first silver particles each covered with the dispersant to obtain second silver particles. The method further includes synthesizing third silver particles each having a larger particle diameter than the second silver particles by causing a reaction between a silver compound and a reductant in a liquid phase containing the second silver particles.
    Type: Grant
    Filed: June 16, 2015
    Date of Patent: February 12, 2019
    Assignee: OSAKA UNIVERSITY
    Inventors: Katsuaki Suganuma, Jinting Jiu
  • Patent number: 10099291
    Abstract: Provided are a metal nanowire production method capable of producing long and thin metal nanowires, and metal nanowires produced thereby. A metal nanowire production method comprising, a step for preparing a solution containing a metal salt, a polymer, at least one selected from a group consisting of halides, sulfides, carbonates, and sulfates, and an aliphatic alcohol, and a step for heating and reacting the solution at the temperature of 100° C. to 250° C. for 10 minutes or more while maintaining a practical shear stress applied to the solution at 10 mPa·m or less, wherein, during the heating and reacting step, ultraviolet-visible absorption spectrum change of the solution is measured, and a reaction time is controlled on the basis of the ultraviolet-visible absorption spectrum information.
    Type: Grant
    Filed: May 26, 2014
    Date of Patent: October 16, 2018
    Assignees: SHOWA DENKO K.K., OSAKA UNIVERSITY
    Inventors: Katsuaki Suganuma, Jinting Jiu, Masaya Nogi, Tohru Sugahara, Teppei Araki, Hiroshi Uchida, Hideki Ohata, Masanao Hara, Eri Okazaki
  • Publication number: 20180104747
    Abstract: A method for producing copper particles includes a preparation step and a heating step. In the preparation step, a copper compound, a salt of a main group metal, and a polyhydric alcohol are prepared. In the heating step, a mixture of the copper compound, the salt of the main group metal, and the polyhydric alcohol is heated. Preferably, the main group metal is at least one selected from the group consisting of lithium, beryllium, sodium, magnesium, aluminum, potassium, calcium, zinc, gallium, germanium, rubidium, strontium, cadmium, indium, tin, antimony, cesium, and barium.
    Type: Application
    Filed: March 4, 2016
    Publication date: April 19, 2018
    Applicant: OSAKA UNIVERSITY
    Inventors: Katsuaki SUGANUMA, Jinting JIU
  • Publication number: 20170144220
    Abstract: A silver particle synthesizing method includes reducing a dispersant from first silver particles each covered with the dispersant to obtain second silver particles. The method further includes synthesizing third silver particles each having a larger particle diameter than the second silver particles by causing a reaction between a silver compound and a reductant in a liquid phase containing the second silver particles.
    Type: Application
    Filed: June 16, 2015
    Publication date: May 25, 2017
    Applicant: OSAKA UNIVERSITY
    Inventors: Katsuaki SUGANUMA, Jinting JIU
  • Publication number: 20160121403
    Abstract: Provided are a metal nanowire production method capable of producing long and thin metal nanowires, and metal nanowires produced thereby. A metal nanowire production method comprising, a step for preparing a solution containing a metal salt, a polymer, at least one selected from a group consisting of halides, sulfides, carbonates, and sulfates, and an aliphatic alcohol, and a step for heating and reacting the solution at the temperature of 100° C. to 250° C. for 10 minutes or more while maintaining a practical shear stress applied to the solution at 10 mPa·m or less, wherein, during the heating and reacting step, ultraviolet-visible absorption spectrum change of the solution is measured, and a reaction time is controlled on the basis of the ultraviolet-visible absorption spectrum information.
    Type: Application
    Filed: May 26, 2014
    Publication date: May 5, 2016
    Applicants: SHOWA DENKO K.K., OSAKA UNIVERSITY
    Inventors: Katsuaki SUGANUMA, Jinting JIU, Masaya NOGI, Tohru SUGAHARA, Teppei ARAKI, Hiroshi UCHIDA, Hideki OHATA, Masanao HARA, Eri OKAZAKI