Patents by Inventor Jinwon BAEK

Jinwon BAEK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Laser processing apparatus and method of manufacturing the same
    Patent number: 11819941
    Abstract: A laser processing apparatus includes: a laser light source configured to emit a laser beam; an optical scanner located along a path of the laser beam and configured to adjust the path of the laser beam; a lens unit located along the path of the laser beam, the lens unit being configured to condense the laser beam; a first adapter located between the lens unit and the optical scanner and coupled to the lens unit; and a second adapter located between the first adapter and the optical scanner, the second adapter being coupled to the first adapter and the optical scanner.
    Type: Grant
    Filed: April 15, 2019
    Date of Patent: November 21, 2023
    Assignee: Samsung Display Co., Ltd.
    Inventors: Jinwon Baek, Seokjoo Lee, Sangsun Han, Kyongho Hong
  • Substrate processing apparatus and substrate processing method
    Patent number: 11565351
    Abstract: A substrate processing apparatus includes the following: a support frame, first stage, a suction part, and a plurality of island-type second stages. The support frame is disposed on the first stage. The height of the support frame is lower than the height of the first stage. A plurality of island-type second stages are disposed on the support frame on the same plane as the first stage. The suction part is disposed on the support frame.
    Type: Grant
    Filed: April 4, 2019
    Date of Patent: January 31, 2023
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Toshinaru Suzuki, Dokyun Kwon, Jaebum Pahk, Jinwon Baek, Jeongho Yi, Jinpyung Lee, Kyongho Hong
  • Stage for cutting substrate and substrate cutting device
    Patent number: 11565354
    Abstract: A stage for cutting a substrate includes: a body member; a plurality of first discharging members, each including a first suction portion in the body member and a first partition wall portion connected to the first suction portion and protruding from a top surface of the body member, each of the first discharging members defining a first space connected to an outside; a plurality of second discharging members, each including a second suction portion in the body member and a second partition wall portion connected to the second suction portion and protruding from the top surface of the body member, each of the second discharging members defining a second space connected to the outside; a plurality of connecting pipes each connected to the first partition wall portion and the second partition wall portion; and a plurality of supply pipes connected to the connecting pipes.
    Type: Grant
    Filed: January 15, 2019
    Date of Patent: January 31, 2023
    Assignee: Samsung Display Co., Ltd.
    Inventors: Kyongho Hong, Jinwon Baek, Jeongho Yi, Jinpyung Lee
  • LASER PROCESSING APPARATUS AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20200086423
    Abstract: A laser processing apparatus includes: a laser light source configured to emit a laser beam; an optical scanner located along a path of the laser beam and configured to adjust the path of the laser beam; a lens unit located along the path of the laser beam, the lens unit being configured to condense the laser beam; a first adapter located between the lens unit and the optical scanner and coupled to the lens unit; and a second adapter located between the first adapter and the optical scanner, the second adapter being coupled to the first adapter and the optical scanner.
    Type: Application
    Filed: April 15, 2019
    Publication date: March 19, 2020
    Inventors: Jinwon Baek, Seokjoo Lee, Sangsun Han, Kyongho Hong
  • SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
    Publication number: 20190308276
    Abstract: A substrate processing apparatus includes the following: a support frame, first stage, a suction part, and a plurality of island-type second stages. The support frame is disposed on the first stage. The height of the support frame is lower than the height of the first stage. A plurality of island-type second stages are disposed on the support frame on the same plane as the first stage. The suction part is disposed on the support frame.
    Type: Application
    Filed: April 4, 2019
    Publication date: October 10, 2019
    Inventors: TOSHINARU SUZUKI, DOKYUN KWON, JAEBUM PAHK, JINWON BAEK, JEONGHO YI, JINPYUNG LEE, KYONGHO HONG
  • STAGE FOR CUTTING SUBSTRATE AND SUBSTRATE CUTTING DEVICE
    Publication number: 20190217427
    Abstract: A stage for cutting a substrate includes: a body member; a plurality of first discharging members, each including a first suction portion in the body member and a first partition wall portion connected to the first suction portion and protruding from a top surface of the body member, each of the first discharging members defining a first space connected to an outside; a plurality of second discharging members, each including a second suction portion in the body member and a second partition wall portion connected to the second suction portion and protruding from the top surface of the body member, each of the second discharging members defining a second space connected to the outside; a plurality of connecting pipes each connected to the first partition wall portion and the second partition wall portion; and a plurality of supply pipes connected to the connecting pipes.
    Type: Application
    Filed: January 15, 2019
    Publication date: July 18, 2019
    Inventors: Kyongho HONG, Jinwon BAEK, Jeongho YI, Jinpyung LEE