Abstract: The battery rack includes a plurality of battery packs vertically arranged, each battery pack including a plurality of secondary batteries stacked in a direction, and a pack housing having an internal space to receive the plurality of secondary batteries and configured to be supplied with a fire extinguishing liquid when an internal temperature equals or rises above a predetermined temperature, and a rack case having a receiving space to receive the plurality of battery packs, and including a plurality of rack plates, each having a mounting surface on which the battery pack is mounted, the mounting surface sloping at a predetermined angle with declining height as it goes in any one direction, and an extension portion having an end of any one direction extending further outward than the lower battery pack.

Abstract: An air extractor grille duct includes: an air extractor grille configured to be selectively opened due to a pressure difference between the interior and exterior of a vehicle so that interior air is discharged; a duct housing connected to the air extractor grille and configured to provide a discharge path for the interior air; and a sound-absorbing cover connected to the duct housing, provided with an inclined surface, and configured to guide discharged interior air to flow along the inclined surface toward the discharge path.

Abstract: A feature map encoding method according to the present disclosure may include generating a feature map from a multi-level feature group; and performing PCA (Picture Component Analysis) transform for the feature map. Here, generating the feature map comprises reshaping the multi-level feature group; and generating the feature map by merging a plurality of base units generated by the reshape.

Abstract: A catheter rotary apparatus for OCT includes a rotary junction module and a catheter. The rotary junction module includes a body part including a through part to enable an optical fiber on a sample stage side of OCT system to pass at one end and an optical fiber on a catheter side to pass at the other end, a fiber optic rotary joint provided at one end on the sample stage side of OCT system of the body part and configured to connect the optical fiber on the sample stage side of OCT system and the optical fiber on the catheter side and a catheter. The catheter includes a female type optical connector connected to the male type optical connector, and a cap part clamped to the body part. The cap part includes an outer cap coupled to a through part formed in the body part, an inner cap inserted into the outer cap, and a fixed cap coupled to the female type optical connector and rotated when the female type optical connector is rotated.

Abstract: A feature map decoding method according to the present disclosure may include decoding a metadata and the feature map; performing inverse conversion on a decoded feature map; and restoring features from inverse converted features. Here, a feature distortion compensation is performed on at least one of the decoded feature map, the inverse converted features or restored features.

Abstract: A battery module includes a sub module including a cell stack having a plurality of battery cells and a pair of bus bar frames respectively coupled to one side and the other side of the cell stack; a module housing configured to accommodate the sub module and configured to have an air inlet and an air outlet formed to circulate air; a sprinkler provided through the module housing at one side of the cell stack in a stacking direction; and an outlet closing device configured to move by a buoyancy generated by a cooling water introduced into the module housing through the sprinkler so that the air outlet is closed.

Abstract: According to an aspect of the present disclosure, a cart for optical coherence tomography includes a rotary catheter unit; a main body including a receiving member configured to receive the rotary catheter unit; a mobile unit coupled to a lower part of the main body and configured to move the main body on the ground; and a display unit connected to an upper part of the main body and configured to output information generated by the rotary catheter unit. Wherein the display unit is located inside at least two side surfaces of the main body.

Abstract: The present disclosure relates to an image encoding/decoding method for a machine and a device therefor. An image encoding method according to the present disclosure includes extracting an encoding method feature from an encoding input signal; determining an encoding method that is optimal for the encoding input signal based on the encoding method feature; transforming the encoding input signal based on the encoding method; and encoding an encoding target signal generated by transforming encoding method information and the encoding input signal.

Abstract: A method for forming a semiconductor die, includes forming an interlayer dielectric layer on a substrate having a semiconductor die region, a seal-ring region, and a scribe line region, forming a metal pad and a test pad on the interlayer dielectric layer, forming a passivation dielectric layer on the interlayer dielectric layer, the metal pad, and the test pad, first etching the passivation dielectric layer and the interlayer dielectric layer existing between the seal-ring region and the scribe line region to a predetermined depth using a plasma etching process, second etching the passivation dielectric layer to expose the metal pad and the test pad, forming a bump on the metal pad, and dicing the substrate while removing the scribe line region by mechanical sawing.

Abstract: A semiconductor chip packaging method includes forming a bump on a wafer, forming a coating film covering the bump, laser grooving the wafer, plasma etching the wafer on which the laser grooving is performed, exposing the bump by removing the coating film covering the bump, fabricating a semiconductor die by performing mechanical sawing of the wafer, and packaging the semiconductor die.

Abstract: A method for forming a semiconductor die, includes forming an interlayer dielectric layer on a substrate having a semiconductor die region, a seal-ring region, and a scribe line region, forming a metal pad and a test pad on the interlayer dielectric layer, forming a passivation dielectric layer on the interlayer dielectric layer, the metal pad, and the test pad, first etching the passivation dielectric layer and the interlayer dielectric layer existing between the seal-ring region and the scribe line region to a predetermined depth using a plasma etching process, second etching the passivation dielectric layer to expose the metal pad and the test pad, forming a bump on the metal pad, and dicing the substrate while removing the scribe line region by mechanical sawing.

Abstract: The present disclosure provides systems and methods for monitoring inventory transfer in real-time, comprising a memory storing instructions and a processor configured to execute the instructions to receive a tote identifier associated with a tote configured to store one or more products and receive a container identifier associated with a container configured to store the tote. The processor is configured to receive, from a user device in the first fulfillment center, a code associated with a vehicle for transferring the container from a first to a second fulfillment center, receive, from a user device in the second fulfillment center, the code associated with the vehicle, receive, from the user device in the second fulfillment center, at least one of the container identifier or the tote identifier, and validate the transfer of the first product, based on the code and at least one of the container identifier or the tote identifier.

Abstract: A semiconductor chip packaging method includes forming a bump on a wafer, forming a coating film covering the bump, laser grooving the wafer, plasma etching the wafer on which the laser grooving is performed, exposing the bump by removing the coating film covering the bump, fabricating a semiconductor die by performing mechanical sawing of the wafer, and packaging the semiconductor die.

Abstract: A semiconductor chip packaging method includes forming a bump on a wafer, forming a coating film covering the bump, laser grooving the wafer, plasma etching the wafer on which the laser grooving is performed, exposing the bump by removing the coating film covering the bump, fabricating a semiconductor die by performing mechanical sawing of the wafer, and packaging the semiconductor die.

Abstract: Provided is a method of recognizing an item as a removal target based on expiration date-related information of the item, acquiring information regarding an actual quantity of the removal target and a remaining quantity among the actual quantity, and updating information regarding stock based on the acquired information, and an electronic apparatus therefor.

Abstract: A semiconductor package includes a first metal interconnection disposed in a semiconductor chip, a first bump group configured to be connected to the first metal interconnection, a first inner lead pattern group configured to be connected to the first bump group, a second metal interconnection disposed in the semiconductor chip, a second bump group configured to be connected to the second metal interconnection; and a second inner lead pattern group configured to be connected to the second bump group, wherein a density of the first metal interconnection is greater than a density of the second metal interconnection, such that a first pitch of the first lead pattern group is greater than a second pitch of the second lead pattern group.

Abstract: A method for forming a semiconductor die, includes forming an interlayer dielectric layer on a substrate having a semiconductor die region, a seal-ring region, and a scribe line region, forming a metal pad and a test pad on the interlayer dielectric layer, forming a passivation dielectric layer on the interlayer dielectric layer, the metal pad, and the test pad, first etching the passivation dielectric layer and the interlayer dielectric layer existing between the seal-ring region and the scribe line region to a predetermined depth using a plasma etching process, second etching the passivation dielectric layer to expose the metal pad and the test pad, forming a bump on the metal pad, and dicing the substrate while removing the scribe line region by mechanical sawing.

Abstract: A semiconductor die forming method includes preparing a wafer, forming a low-k dielectric layer on the wafer, forming a metal pad on the low-k dielectric layer, forming a passivation layer on the metal pad, patterning the passivation layer, laser grooving the low-k dielectric layer using an ultrashort pulse laser, and cutting the wafer by mechanical sawing to form one or more semiconductor dies.

Abstract: The present disclosure provides systems and methods for monitoring inventory transfer in real-time, comprising a memory storing instructions and a processor configured to execute the instructions to receive a tote identifier associated with a tote configured to store one or more products and receive a container identifier associated with a container configured to store the tote. The processor is configured to receive, from a user device in the first fulfillment center, a code associated with a vehicle for transferring the container from a first to a second fulfillment center, receive, from a user device in the second fulfillment center, the code associated with the vehicle, receive, from the user device in the second fulfillment center, at least one of the container identifier or the tote identifier, and validate the transfer of the first product, based on the code and at least one of the container identifier or the tote identifier.

Abstract: A semiconductor chip packaging method includes forming a bump on a wafer, forming a coating film covering the bump, laser grooving the wafer, plasma etching the wafer on which the laser grooving is performed, exposing the bump by removing the coating film covering the bump, fabricating a semiconductor die by performing mechanical sawing of the wafer, and packaging the semiconductor die.