Patents by Inventor Jin-won Jeong
Jin-won Jeong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250149572Abstract: A positive electrode active material includes a lithium composite transition metal oxide in the form of a single particle. The lithium composite transition metal oxide includes Al, Y, and Zr. The method for preparing the positive electrode active material is also provided. Additionally, a positive electrode and a lithium secondary battery including the same are also provided.Type: ApplicationFiled: June 28, 2023Publication date: May 8, 2025Applicant: LG Chem, Ltd.Inventors: Jin Hoo Jeong, Myung Gi Jeong, Jin Wook Ju, Sang Won Woo, Joo Kyoung Hwang, Jin Hee Jung, Ye Hyeon Gu
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Patent number: 12291630Abstract: The present invention relates to a method for preparing a conjugated diene-based polymer, characterized in using a dimer acid saponified material as an emulsifier in a polymerization initiation step and injecting a monomer and the emulsifier in three or more installments after initiating polymerization, and the conjugated diene-based polymer prepared by the preparation method of the present invention has excellent physical properties such as impact strength and reflection haze.Type: GrantFiled: September 23, 2020Date of Patent: May 6, 2025Assignee: LG CHEM, LTD.Inventors: Young Hwan Jeong, Yoo Vin Kim, Jin Hyoung Lee, Jae Won Heo, Young Min Kim
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Patent number: 12285055Abstract: As an embodiment of the present disclosure, there is disclosed an aerosol generating device including: a heater configured to generate an aerosol by heating an aerosol generating substrate; a storage unit configured to store information regarding a first time period and a second time period for controlling a temperature of the heater; and a controller configured to control power supplied to the heater, wherein the controller, when the first time period time elapses after the temperature of the heater reaches the first target temperature, changes the temperature of the heater to a second target temperature for the second time period, and the sum of the first time period and the second time period is a time period in a preset change.Type: GrantFiled: October 5, 2023Date of Patent: April 29, 2025Assignee: KT&G CORPORATIONInventors: Yong Joon Jang, Gyoung Min Go, Jang Won Seo, Chul Ho Jang, Min Seok Jeong, Jong Seong Jeong, Jin Chul Jung
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Publication number: 20250133221Abstract: A device for decoding a feature map according to the present disclosure comprises an image decoding unit to decode an image from a bitstream; an inverse format conversion unit to restore a feature map latent representation by converting a formation of a decoded image; and a feature map restoration unit to restore a multi-layer feature map from the feature map latent representation. Here, the feature map restoration unit restores the multi-layer feature map based on a learned neural network parameter.Type: ApplicationFiled: October 11, 2024Publication date: April 24, 2025Applicants: Electronics and Telecommunications Research Institute, UNIVERSITY-INDUSTRY COOPERATION GROUP OF KYUNG HEE UNIVERSITYInventors: JooYoung LEE, Youn Hee KIM, Se Yoon JEONG, Jin Soo CHOI, Jung Won KANG, Hui Yong KIM, Hye Won JEONG, Seung Hwan JANG, Yeong Woong KIM, Jang Hyun YU
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Publication number: 20250113863Abstract: An aerosol generating device according to an embodiment includes a heater configured to heat an aerosol generating article accommodated in an accommodation space of the aerosol generating device, a battery configured to supply power to the heater, a temperature sensor configured to measure a temperature of the aerosol generating article, and a processor configured to control power supplied to the heater from the battery according to a preset temperature profile including a preheating period and a heating period, wherein the processor is further configured to detect whether an amount of moisture in the aerosol generating article is in a preset range based on the temperature of the aerosol generating article in the preheating period, and control a duration of the preheating period according to whether the amount of moisture in the aerosol generating article is included in the preset range.Type: ApplicationFiled: June 8, 2022Publication date: April 10, 2025Applicant: KT&G CORPORATIONInventors: Jin Chul JUNG, Jang Won SEO, Min Seok JEONG, Gyoung Min GO, Hyung Jin BAE, Chul Ho JANG, Jong Seong JEONG
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Publication number: 20250109076Abstract: A boron nitride composite is proposed. The boron nitride composite may include an aggregate including a plurality of boron nitride particles bonded to each other to form a plurality of pores. The boron nitride composite may also include a filler containing at least one of an organic material or an inorganic material, and filled in at least some of the plurality of pores such that the organic material and the inorganic material do not cover an outer surface of the aggregate.Type: ApplicationFiled: December 13, 2024Publication date: April 3, 2025Inventors: Jae Min JEONG, Jong Gu KANG, Jin Hwan KIM, Sang Won PARK
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Patent number: 12261312Abstract: The battery rack includes a plurality of battery packs vertically arranged, each battery pack including a plurality of secondary batteries stacked in a direction, and a pack housing having an internal space to receive the plurality of secondary batteries and configured to be supplied with a fire extinguishing liquid when an internal temperature equals or rises above a predetermined temperature, and a rack case having a receiving space to receive the plurality of battery packs, and including a plurality of rack plates, each having a mounting surface on which the battery pack is mounted, the mounting surface sloping at a predetermined angle with declining height as it goes in any one direction, and an extension portion having an end of any one direction extending further outward than the lower battery pack.Type: GrantFiled: March 4, 2021Date of Patent: March 25, 2025Assignee: LG ENERGY SOLUTION, LTD.Inventors: Ji-Won Jeong, Seung-Hyun Kim, Young-Seok Lee, Kyung-Hyun Bae, Jin-Kyu Shin
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Publication number: 20250074152Abstract: An air extractor grille duct includes: an air extractor grille configured to be selectively opened due to a pressure difference between the interior and exterior of a vehicle so that interior air is discharged; a duct housing connected to the air extractor grille and configured to provide a discharge path for the interior air; and a sound-absorbing cover connected to the duct housing, provided with an inclined surface, and configured to guide discharged interior air to flow along the inclined surface toward the discharge path.Type: ApplicationFiled: December 7, 2023Publication date: March 6, 2025Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATIONInventors: Jin Han Kim, Seung Won An, Hae Ryong Park, Gyeong Won Jeong, Sun Dong Kim, Jae Won Heo
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Publication number: 20250061538Abstract: A feature map encoding method according to the present disclosure may include generating a feature map from a multi-level feature group; and performing PCA (Picture Component Analysis) transform for the feature map. Here, generating the feature map comprises reshaping the multi-level feature group; and generating the feature map by merging a plurality of base units generated by the reshape.Type: ApplicationFiled: August 14, 2024Publication date: February 20, 2025Inventors: Youn Hee KIM, JooYoung LEE, Se Yoon JEONG, Jin Soo CHOI, Jung Won KANG
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Publication number: 20250057429Abstract: A catheter rotary apparatus for OCT includes a rotary junction module and a catheter. The rotary junction module includes a body part including a through part to enable an optical fiber on a sample stage side of OCT system to pass at one end and an optical fiber on a catheter side to pass at the other end, a fiber optic rotary joint provided at one end on the sample stage side of OCT system of the body part and configured to connect the optical fiber on the sample stage side of OCT system and the optical fiber on the catheter side and a catheter. The catheter includes a female type optical connector connected to the male type optical connector, and a cap part clamped to the body part. The cap part includes an outer cap coupled to a through part formed in the body part, an inner cap inserted into the outer cap, and a fixed cap coupled to the female type optical connector and rotated when the female type optical connector is rotated.Type: ApplicationFiled: March 27, 2024Publication date: February 20, 2025Inventors: Jin Yong HA, Sang Won WOO, Soon Won JEONG
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Publication number: 20250054118Abstract: A feature map decoding method according to the present disclosure may include decoding a metadata and the feature map; performing inverse conversion on a decoded feature map; and restoring features from inverse converted features. Here, a feature distortion compensation is performed on at least one of the decoded feature map, the inverse converted features or restored features.Type: ApplicationFiled: August 8, 2024Publication date: February 13, 2025Applicant: Electronics and Telecommunications Research InstituteInventors: Youn Hee KIM, JooYoung LEE, Se Yoon JEONG, Jin Soo CHOI, Jun Won KANG
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Patent number: 12211983Abstract: A battery module includes a sub module including a cell stack having a plurality of battery cells and a pair of bus bar frames respectively coupled to one side and the other side of the cell stack; a module housing configured to accommodate the sub module and configured to have an air inlet and an air outlet formed to circulate air; a sprinkler provided through the module housing at one side of the cell stack in a stacking direction; and an outlet closing device configured to move by a buoyancy generated by a cooling water introduced into the module housing through the sprinkler so that the air outlet is closed.Type: GrantFiled: March 4, 2021Date of Patent: January 28, 2025Assignee: LG ENERGY SOLUTION, LTD.Inventors: Seung-Hyun Kim, Ji-Won Jeong, Kyung-Hyun Bae, Jin-Kyu Shin, Jin-Kyu Lee
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Publication number: 20250017678Abstract: According to an aspect of the present disclosure, a cart for optical coherence tomography includes a rotary catheter unit; a main body including a receiving member configured to receive the rotary catheter unit; a mobile unit coupled to a lower part of the main body and configured to move the main body on the ground; and a display unit connected to an upper part of the main body and configured to output information generated by the rotary catheter unit. Wherein the display unit is located inside at least two side surfaces of the main body.Type: ApplicationFiled: January 22, 2024Publication date: January 16, 2025Inventors: Joo Soo KIM, Dong Kwon JANG, Soon Won JEONG, Sang Won WOO, Jin Su KIM, Tae Sung KIM
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Publication number: 20250022178Abstract: The present disclosure relates to an image encoding/decoding method for a machine and a device therefor. An image encoding method according to the present disclosure includes extracting an encoding method feature from an encoding input signal; determining an encoding method that is optimal for the encoding input signal based on the encoding method feature; transforming the encoding input signal based on the encoding method; and encoding an encoding target signal generated by transforming encoding method information and the encoding input signal.Type: ApplicationFiled: July 11, 2024Publication date: January 16, 2025Applicants: Electronics and Telecommunications Research Institute, UNIVERSITY-INDUSTRY COOPERATION GROUP OF KYUNG HEE UNIVERSITYInventors: Joo Young LEE, Se Yoon Jeong, Youn Hee Kim, Jin Soo Choi, Jung Won Kang, Hye Won Jeong, Hui Yong Kim, Jang Hyun Yu, Seung Hwan Jang, Hyun Dong Cho
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Publication number: 20240128123Abstract: A method for forming a semiconductor die, includes forming an interlayer dielectric layer on a substrate having a semiconductor die region, a seal-ring region, and a scribe line region, forming a metal pad and a test pad on the interlayer dielectric layer, forming a passivation dielectric layer on the interlayer dielectric layer, the metal pad, and the test pad, first etching the passivation dielectric layer and the interlayer dielectric layer existing between the seal-ring region and the scribe line region to a predetermined depth using a plasma etching process, second etching the passivation dielectric layer to expose the metal pad and the test pad, forming a bump on the metal pad, and dicing the substrate while removing the scribe line region by mechanical sawing.Type: ApplicationFiled: December 18, 2023Publication date: April 18, 2024Applicant: MagnaChip Semiconductor, Ltd.Inventors: Jin Won JEONG, Jang Hee LEE, Young Hun JUN, Jong Woon LEE, Jae Sik CHOI
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Patent number: 11901322Abstract: A semiconductor chip packaging method includes forming a bump on a wafer, forming a coating film covering the bump, laser grooving the wafer, plasma etching the wafer on which the laser grooving is performed, exposing the bump by removing the coating film covering the bump, fabricating a semiconductor die by performing mechanical sawing of the wafer, and packaging the semiconductor die.Type: GrantFiled: May 18, 2022Date of Patent: February 13, 2024Assignee: MagnaChip Semiconductor, Ltd.Inventors: Jin Won Jeong, Jae Sik Choi, Byeung Soo Song
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Patent number: 11887892Abstract: A method for forming a semiconductor die, includes forming an interlayer dielectric layer on a substrate having a semiconductor die region, a seal-ring region, and a scribe line region, forming a metal pad and a test pad on the interlayer dielectric layer, forming a passivation dielectric layer on the interlayer dielectric layer, the metal pad, and the test pad, first etching the passivation dielectric layer and the interlayer dielectric layer existing between the seal-ring region and the scribe line region to a predetermined depth using a plasma etching process, second etching the passivation dielectric layer to expose the metal pad and the test pad, forming a bump on the metal pad, and dicing the substrate while removing the scribe line region by mechanical sawing.Type: GrantFiled: April 15, 2021Date of Patent: January 30, 2024Assignee: MagnaChip Semiconductor, Ltd.Inventors: Jin Won Jeong, Jang Hee Lee, Young Hun Jun, Jong Woon Lee, Jae Sik Choi
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Patent number: 11605052Abstract: The present disclosure provides systems and methods for monitoring inventory transfer in real-time, comprising a memory storing instructions and a processor configured to execute the instructions to receive a tote identifier associated with a tote configured to store one or more products and receive a container identifier associated with a container configured to store the tote. The processor is configured to receive, from a user device in the first fulfillment center, a code associated with a vehicle for transferring the container from a first to a second fulfillment center, receive, from a user device in the second fulfillment center, the code associated with the vehicle, receive, from the user device in the second fulfillment center, at least one of the container identifier or the tote identifier, and validate the transfer of the first product, based on the code and at least one of the container identifier or the tote identifier.Type: GrantFiled: July 23, 2021Date of Patent: March 14, 2023Assignee: Coupang Corp.Inventors: Ji Won Hwang, Seon Sook Hong, Jong Won Lee, Jin Won Jeong, Sang Min Jeon
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Publication number: 20220278064Abstract: A semiconductor chip packaging method includes forming a bump on a wafer, forming a coating film covering the bump, laser grooving the wafer, plasma etching the wafer on which the laser grooving is performed, exposing the bump by removing the coating film covering the bump, fabricating a semiconductor die by performing mechanical sawing of the wafer, and packaging the semiconductor die.Type: ApplicationFiled: May 18, 2022Publication date: September 1, 2022Applicant: MagnaChip Semiconductor, Ltd.Inventors: Jin Won JEONG, Jae Sik CHOI, Byeung Soo SONG
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Patent number: 11380640Abstract: A semiconductor chip packaging method includes forming a bump on a wafer, forming a coating film covering the bump, laser grooving the wafer, plasma etching the wafer on which the laser grooving is performed, exposing the bump by removing the coating film covering the bump, fabricating a semiconductor die by performing mechanical sawing of the wafer, and packaging the semiconductor die.Type: GrantFiled: July 21, 2020Date of Patent: July 5, 2022Assignee: MagnaChip Semiconductor, Ltd.Inventors: Jin Won Jeong, Jae Sik Choi, Byeung Soo Song