Patents by Inventor Jin-woo Cho

Jin-woo Cho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250019135
    Abstract: A sealing structure may include a lid including a first lid face, a second lid face opposite to the first lid face, and a fragile area between the first lid face and the second lid face, a cover including a first cover face facing the second lid face and covering the fragile area and a second cover face opposite to the first cover face, wherein a first distance between the second lid face and the first cover face is substantially equal to or less than a second distance between the first cover face and the second cover face, and a connector configured to connect the lid and the cover.
    Type: Application
    Filed: September 30, 2024
    Publication date: January 16, 2025
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Wooram HONG, Hyun Do CHOI, Dal HEO, Youngchun KWON, Hyukju KWON, Gahee KIM, Bosung KIM, Jeonghun KIM, Jin Woo KM, Min Sik PARK, Youngjin PARK, Hyungtae SEO, Won Seok OH, Dongseon LEE, Sangyoon LEE, Jaejun CHANG, Jun Won JANG, Hyunjeong JEON, Joon-Kee CHO, Byung-Kwon CHOI, Won Je CHOI, Younsuk CHOI, Taesin HA
  • Publication number: 20250022784
    Abstract: A method of manufacturing a semiconductor device having a semiconductor die within an extended substrate and a bottom substrate may include bonding a bottom surface of a semiconductor die to a top surface of a bottom substrate, forming an adhering member to a top surface of the semiconductor die, bonding an extended substrate to the semiconductor die and to the top surface of the bottom substrate utilizing the adhering member and a conductive bump on a bottom surface of the extended substrate and a conductive bump on the bottom substrate. The semiconductor die and the conductive bumps may be encapsulated utilizing a mold member. The conductive bump on the bottom surface of the extended substrate may be electrically connected to a terminal on the top surface of the extended substrate. The adhering member may include a laminate film, a non-conductive film adhesive, or a thermal hardening liquid adhesive.
    Type: Application
    Filed: September 27, 2024
    Publication date: January 16, 2025
    Inventors: Jae Yun Kim, Gi Tae Lim, Woon Kab Jung, Ju Hoon Yoon, Dong Joo Park, Byong Woo Cho, Gyu Wan Han, Ji Young Chung, Jin Seong Kim, Do Hyun Na
  • Patent number: 11927881
    Abstract: A pellicle for extreme ultraviolet (EUV) lithography is based on yttrium carbide and used in a EUV lithography process. The pellicle for EUV lithography includes a pellicle layer that has a core layer containing yttrium carbide. The yttrium carbide is YCx in which the atomic percentage of carbon is within a range of 25% to 45%.
    Type: Grant
    Filed: November 29, 2021
    Date of Patent: March 12, 2024
    Assignee: Korea Electronics Technology Institute
    Inventors: Hyeong Keun Kim, Seul Gi Kim, Hyun Mi Kim, Jin Woo Cho, Ki Hun Seong
  • Patent number: 11789359
    Abstract: This application relates to a method for manufacturing a pellicle for extreme ultraviolet lithography. In one aspect, the method includes forming a support layer of a silicon nitride material on a silicon substrate, and forming a core layer of a graphene material on the support layer. The method may also include forming a graphene defect healing layer on the core layer by selectively forming a material of MeOxNy (Me is one of Si, Al, Ti, Zr, and Hf, x+y=2) at a grain boundary of the core layer in an atomic layer deposition process using heat in order to heal defects generated in graphene forming the core layer without additional damage to the graphene. The method may further include a capping layer on the graphene defect healing layer, wherein a central portion of the silicon substrate under the support layer is removed to form an opening partially exposing the support layer.
    Type: Grant
    Filed: December 1, 2021
    Date of Patent: October 17, 2023
    Assignee: KOREA ELECTRONICS TECHNOLOGY INSTITUTE
    Inventors: Hyeong Keun Kim, Hyun Mi Kim, Jin Woo Cho, Seul Gi Kim, Jun Hyeok Jeon
  • Publication number: 20230125229
    Abstract: A pellicle for extreme ultraviolet (EUV) lithography is based on yttrium carbide and used in a EUV lithography process. The pellicle for EUV lithography includes a pellicle layer that has a core layer containing yttrium carbide. The yttrium carbide is YCX (0.25<x<0.45).
    Type: Application
    Filed: November 29, 2021
    Publication date: April 27, 2023
    Inventors: Hyeong Keun KIM, Seul Gi KIM, Hyun Mi KIM, Jin Woo CHO, Ki Hun SEONG
  • Publication number: 20220334464
    Abstract: This application relates to a pellicle for extreme ultraviolet lithography used in a lithography process using extreme ultraviolet rays. In one aspect, the pellicle includes a pellicle layer formed of an M-? material in which M is combined with ?. Here, M is one of Si, Zr, Mo, Ru, Y, W, Ti, Ir, or Nb, and a is at least two of B, N, C, O, or F.
    Type: Application
    Filed: March 18, 2022
    Publication date: October 20, 2022
    Inventors: Hyeong Keun KIM, Seul Gi KIM, Hyun Mi KIM, Jin Woo CHO, Ki Hun SEONG
  • Publication number: 20220326603
    Abstract: A pellicle for extreme ultraviolet lithography containing molybdenum carbide is disclosed. The pellicle includes a substrate having an opening formed in a central portion, and a pellicle layer formed on the substrate to cover the opening and including a molybdenum carbide containing layer that contains molybdenum carbide expressed as MoC1-x (0<x<1). The pellicle layer includes a core layer formed on the substrate to cover the opening, and the core layer may be the molybdenum carbide containing layer.
    Type: Application
    Filed: March 18, 2022
    Publication date: October 13, 2022
    Inventors: Hyeong Keun KIM, Seul Gi KIM, Hyun Mi KIM, Jin Woo CHO, Yong Kyung KIM
  • Publication number: 20220326601
    Abstract: This application relates to a pellicle for extreme ultraviolet lithography based on yttrium (Y) and used in a lithography process using extreme ultraviolet rays. In one aspect, the pellicle includes a pellicle layer including a core layer formed of an yttrium-based material expressed as Y-M (M is one of B, Si, O, or F).
    Type: Application
    Filed: March 18, 2022
    Publication date: October 13, 2022
    Inventors: Hyeong Keun KIM, Seul Gi KIM, Hyun Mi KIM, Jin Woo CHO, Ki Hun SEONG
  • Publication number: 20220326602
    Abstract: This application relates to a pellicle for extreme ultraviolet lithography and a manufacturing method thereof using the low-temperature direct growth method of multilayer graphene. In one aspect, the method includes forming an etch stopper on a substrate, forming a seed layer on the etch stopper, the seed layer including at least one of amorphous boron, BN, BCN, B4C, or Me-X (Me is at least one of Si, Ti, Mo, or Zr, and X is at least one of B, C, or N). The method may also include forming a metal catalyst layer on the seed layer; forming an amorphous carbon layer on the metal catalyst layer, and directly growing multilayer graphene on the seed layer through interlayer exchange between the metal catalyst layer and the amorphous carbon layer by performing a low-temperature heat treatment at 450° C. to 600° C.
    Type: Application
    Filed: March 18, 2022
    Publication date: October 13, 2022
    Inventors: Hyeong Keun KIM, Seul Gi KIM, Hyun Mi KIM, Jin Woo CHO, Hye Young KIM
  • Publication number: 20220326600
    Abstract: This application relates to a pellicle for extreme ultraviolet lithography containing amorphous carbon and a manufacturing method thereof. In one aspect, the pellicle includes a substrate having an opening formed in a central portion, a support layer formed on the substrate to cover the opening, and a pellicle layer formed on the support layer and containing amorphous carbon. The pellicle layer may include a core layer formed on the support layer, and a capping layer formed on the core layer and may further include a buffer layer. At least one of the core layer, the capping layer, or the buffer layer may be an amorphous carbon layer.
    Type: Application
    Filed: March 18, 2022
    Publication date: October 13, 2022
    Inventors: Hyeong Keun KIM, Seul Gi KIM, Hyun Mi KIM, Jin Woo CHO, Hye Young KIM
  • Patent number: 11392049
    Abstract: A pellicle for extreme ultraviolet lithography has an extreme ultraviolet transmittance of 90% or more and also has thermal stability, mechanical stability, and chemical durability. The pellicle includes a support layer and a pellicle layer. The support layer has an opening formed in a central portion thereof. The pellicle layer is formed on the support layer to cover the opening and includes ZrBx (2<x<16).
    Type: Grant
    Filed: November 9, 2021
    Date of Patent: July 19, 2022
    Assignee: Korea Electronics Technology Institute
    Inventors: Hyeong Keun Kim, Hyun Mi Kim, Jin Woo Cho, Seul Gi Kim, Ki Hun Seong
  • Patent number: 11378626
    Abstract: A system for managing a battery of a vehicle includes a first controller configured to control a power-on (IG ON) state and a power-off (IG OFF) state of a plurality of controllers in the vehicle and to be periodically woken up in the power-off (IG OFF) state to wake up at least some of the plurality of controllers, and a second controller configured to turn off a main relay connecting a first battery in the vehicle and a vehicle system when the power-off (IG OFF) state begins, to monitor a state of the first battery storing energy for generating power of the vehicle by maintaining power during a preset first reference time, to be woken up at a wake-up period of the first controller when the first reference time elapses, and to monitor the state of the first battery.
    Type: Grant
    Filed: December 3, 2020
    Date of Patent: July 5, 2022
    Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventors: Ki Seung Baek, Ik Jun Choi, Do Sung Hwang, Kyung Taek Jung, Chang Yu Kim, Dea Ki Cheong, Tae Hyuck Kim, Han Seung Myoung, Ho Joong Lee, Hye Seung Kim, Byoung Jik Ahn, Kyu Beom Ko, Hyo Sik Moon, Jong Seo Yoon, Sung Il Lee, Hong Min Oh, Jin Woo Cho
  • Publication number: 20220171278
    Abstract: This application relates to a method for manufacturing a pellicle for extreme ultraviolet lithography. In one aspect, the method includes forming a support layer of a silicon nitride material on a silicon substrate, and forming a core layer of a graphene material on the support layer. The method may also include forming a graphene defect healing layer on the core layer by selectively forming a material of MeOxNy (Me is one of Si, Al, Ti, Zr, and Hf, x+y=2) at a grain boundary of the core layer in an atomic layer deposition process using heat in order to heal defects generated in graphene forming the core layer without additional damage to the graphene. The method may further include a capping layer on the graphene defect healing layer, wherein a central portion of the silicon substrate under the support layer is removed to form an opening partially exposing the support layer.
    Type: Application
    Filed: December 1, 2021
    Publication date: June 2, 2022
    Inventors: Hyeong Keun KIM, Hyun Mi KIM, Jin Woo CHO, Seul Gi KIM, Jun Hyeok JEON
  • Publication number: 20220146949
    Abstract: A pellicle for extreme ultraviolet lithography has an extreme ultraviolet transmittance of 90% or more and also has thermal stability, mechanical stability, and chemical durability. The pellicle includes a support layer and a pellicle layer. The support layer has an opening formed in a central portion thereof. The pellicle layer is formed on the support layer to cover the opening and includes ZrBx (2<x<16).
    Type: Application
    Filed: November 9, 2021
    Publication date: May 12, 2022
    Inventors: Hyeong Keun KIM, Hyun Mi KIM, Jin Woo CHO, Seul Gi KIM, Ki Hun SEONG
  • Patent number: 11316059
    Abstract: The present inventive concept relates to a thermal radiation body for cooling a heating element, which includes a pattern unit including a pore part provided as an empty space or filled with a gas phase and a cover part covering the pore part and dissipates heat of the heating element through heat radiation.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: April 26, 2022
    Inventors: Duk Kyu Bae, Sung Hee Kim, Ka Youn Kim, Sun Kyung Kim, Jin Woo Cho
  • Patent number: 11231024
    Abstract: A compressor is disclosed. The compressor includes an upper shell and a lower shell forming an appearance of the compressor. The compressor also includes a coupling portion provided between the upper shell and the lower shell and configured to protrude from a side surface of the upper shell or the lower shell to outside the upper shell or the lower shell. The coupling portion includes at least one coupling protrusion configured to protrude from a side surface of a flange portion to the outside, to increase a rigidity of the flange portion and the coupling portion.
    Type: Grant
    Filed: January 15, 2018
    Date of Patent: January 25, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jin Woo Cho, Jin Sol Je, Ji Hoon Han
  • Publication number: 20220011369
    Abstract: A system for managing a battery of a vehicle includes a first controller configured to control a power-on (IG ON) state and a power-off (IG OFF) state of a plurality of controllers in the vehicle and to be periodically woken up in the power-off (IG OFF) state to wake up at least some of the plurality of controllers, and a second controller configured to turn off a main relay connecting a first battery in the vehicle and a vehicle system when the power-off (IG OFF) state begins, to monitor a state of the first battery storing energy for generating power of the vehicle by maintaining power during a preset first reference time, to be woken up at a wake-up period of the first controller when the first reference time elapses, and to monitor the state of the first battery.
    Type: Application
    Filed: December 3, 2020
    Publication date: January 13, 2022
    Inventors: Ki Seung Baek, Ik Jun Choi, Do Sung Hwang, Kyung Taek Jung, Chang Yu Kim, Dea Ki Cheong, Tae Hyuck Kim, Han Seung Myoung, Ho Joong Lee, Hye Seung Kim, Byoung Jik Ahn, Kyu Beom Ko, Hyo Sik Moon, Jong Seo Yoon, Sung Il Lee, Hong Min Oh, Jin Woo Cho
  • Publication number: 20210095613
    Abstract: A cylinder block includes an extension portion that is shaped to extend toward the cylinder liner and is formed on an end portion of the cylinder block so as to form a surface contact with a head gasket. In particular, the cylinder liner includes an end portion forming an accommodation groove portion that is shaped to correspond to the extension portion, and a part of the end portion of the cylinder liner is supported on a circumferential surface of the extension portion and is linked to the accommodation groove portion. In addition, the part of the end portion of the cylinder liner forms a surface contact with the head gasket.
    Type: Application
    Filed: January 16, 2020
    Publication date: April 1, 2021
    Applicants: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventors: Young Gi KIM, Jong Beom SEO, Byung Hyun LEE, Myoung Ho LEE, Joong Hyun HWANG, Jin Woo CHO, Dae Woong LEE, Chang Min LEE
  • Patent number: 10903704
    Abstract: A fan motor for an air conditioner includes a rotor shaft, a plurality of rotor cores arranged in a circumferential direction about a center of the rotor shaft, a bridge configured to couple the rotor cores, permanent magnets coupled to the plurality of rotor cores, and an insert-injected rotor body provided in a space formed through the rotor shaft, the rotor cores, the bridge, and the permanent magnets. A cable holder for the fan motor includes an upper cable holder in which a plurality of protrusion walls are formed downwardly, a lower cable holder in which a plurality of guide walls coupled between the plurality of protrusion walls are formed upwardly, and a soldering land which is formed in a lower portion of the lower cable holder and upon which a wire can be soldered.
    Type: Grant
    Filed: March 28, 2017
    Date of Patent: January 26, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jin-woo Cho, Nam-su Kim, Uk-ho Seo, Jong-jun Seo, Ji-hoon Han, Min-woo Hong, Woong Hwang
  • Publication number: 20200259032
    Abstract: The present inventive concept relates to a thermal radiation body for cooling a heating element, which includes a pattern unit including a pore part provided as an empty space or filled with a gas phase and a cover part covering the pore part and dissipates heat of the heating element through heat radiation.
    Type: Application
    Filed: June 28, 2019
    Publication date: August 13, 2020
    Inventors: Duk Kyu BAE, Sung Hee KIM, Ka Youn KIM, Sun Kyung KIM, Jin Woo CHO