Abstract: An apparatus for waveguides and a method of fabricating a waveguide combiner having at least one grating with trenches gap-filled with variable refractive index materials. At least two trenches of at least one grating includes a first gap-fill material having a first volume and a first refractive index, and a second gap-fill material having a second volume and a second refractive index different than the first refractive index. Control of the deposition of first volume and the deposition of second volume in an inkjet deposition process provide for the formation of the grating with two trenches that have different refractive indices and different gap-fill depths. The first gap-fill material and the second gap-fill material merge to form the gap-filler. Therefore, by controlling the varied refractive indices and different gap-fill depths the waveguide combiner is optimized by efficiency or a color uniformity.

Abstract: Embodiments described herein provide for devices and methods of measuring a pitch P of optical device structures and an orientation angle ? of the optical device structures. One embodiment of the system includes an optical arm coupled to an arm actuator. The optical arm includes a light source. The light source emits a light path operable to be diffracted to the stage. The optical arm further includes a first beam splitter and a second beam splitter positioned in the light path. The first beam splitter directs the light path through a first lens and the second beam splitter directs the light path through a first dove prism and a second lens. The optical arm further includes a first detector operable to detect the light path from the first lens and second detector operable to detect the light path from the second lens.

Abstract: The present disclosure relates to metrology measurement systems, and related methods. In one or more embodiments a system, includes a substrate support, and an optical arm. The optical arm includes a light source operable to project a first beam on a first light path. The optical arm also includes a first lens, a first beam splitter, a second lens, a first detector, and an aperture. The first lens is disposed on the first light path and between the substrate support and the light source. The first beam splitter is disposed on the first light path. The first beam splitter is positioned between the substrate support and the light source. The first detector is disposed on the second light path. The second lens focuses the second beam to a second beam diameter. The aperture is disposed between the second lens and the first detector.

Abstract: Methods for modifying the interface of optical substrates. To achieve desirable optical properties, surface defects need to be removed from the interface layer. In one example, a substrate is exposed to an ion beam then a high temperature bake or laser annealing to correct the interface layer. In another example, a high energy ion beam can be used to remove the interface layer then a new interface layer can be added during a high temperature bake or laser annealing with a protective layer added last. If not removed surface defects in the interface layer may absorb a percentage of light in a single interaction. In a waveguide, light may bounce ten to hundreds of times inside a substrate causing significant light loss. Therefore, removing the surface defects significantly increases waveguide efficiency.

Abstract: A method of optical device metrology is provided. The method includes introducing a first type of light into a first optical device during a first time period, the first optical device including an optical substrate and an optical film disposed on the optical substrate, the first optical device further including a first surface, a second surface, and one or more sides connecting the first surface with the second surface; and measuring, during the first time period, a quantity of the first type of light transmitted from a plurality of locations on the first surface or the second surface during the first time period, wherein the measuring is performed by a detector coupled to one or more fiber heads positioned to collect the light transmitted from the plurality of locations.

Abstract: Embodiments described herein provide for optical devices with methods of forming optical device substrates having at least one area of increased refractive index or scratch resistance. One method includes disposing an etch material on a discrete area of an optical device substrate or an optical device layer, disposing a diffusion material in the discrete area, and removing excess diffusion material to form an optical material in the optical device substrate or the optical device layer having a refractive index greater than or equal to 2.0 or a hardness greater than or equal to 5.5 Mohs.

Abstract: Embodiments of the present disclosure herein include a method of removing a contamination material from an optical device. The method may include disposing an optical device in a process chamber, the optical device having optical device structures formed in a substrate, the contamination material is disposed at least on sidewalls of the optical device structures and within trenches between the optical device structures, and exposing the optical device to a plasma generated in the process chamber, the plasma generated from oxygen gas (O2), chlorine gas (Cl2), Argon (Ar), or a combination thereof, the exposing the optical device to the plasma removes the contamination material.

Abstract: Embodiments described herein relate to encapsulated nanostructured optical devices and methods of encapsulating gratings of such devices by asymmetric selective physical vapor deposition (PVD). In some embodiments, a method for encapsulating optical device gratings includes a first PVD process and a second PVD process that may be carried out simultaneously or sequentially. The first PVD process may provide a first stream of material at a first angle non-perpendicular to a substrate of the grating. The second PVD process may provide a second stream of material at a second angle non-perpendicular to the substrate of the grating. The combination of the first PVD process and the second PVD process forms an encapsulation layer over the grating and one or more air gaps between adjacent fins of the grating.

Abstract: Embodiments described herein provide for devices and methods of measuring a pitch P of optical device structures and an orientation angle ? of the optical device structures. One embodiment of the system includes an optical arm coupled to an arm actuator. The optical arm includes a light source. The light source emits a light path operable to be diffracted to the stage. The optical arm further includes a first beam splitter and a second beam splitter positioned in the light path. The first beam splitter directs the light path through a first lens and the second beam splitter directs the light path through a first dove prism and a second lens. The optical arm further includes a first detector operable to detect the light path from the first lens and second detector operable to detect the light path from the second lens.

Abstract: A method of optical device metrology is provided. The method includes introducing a first type of light into a first optical device during a first time period, the first optical device including an optical substrate and an optical film disposed on the optical substrate, the first optical device further including a first surface, a second surface, and one or more sides connecting the first surface with the second surface; and measuring, during the first time period, a quantity of the first type of light transmitted from a plurality of locations on the first surface or the second surface during the first time period, wherein the measuring is performed by a detector coupled to one or more fiber heads positioned to collect the light transmitted from the plurality of locations.

Abstract: Embodiments described herein provide for optical devices with methods of forming optical device substrates having at least one area of increased refractive index or scratch resistance. One method includes disposing an etch material on a discrete area of an optical device substrate or an optical device layer, disposing a diffusion material in the discrete area, and removing excess diffusion material to form an optical material in the optical device substrate or the optical device layer having a refractive index greater than or equal to 2.0 or a hardness greater than or equal to 5.5 Mohs.

Abstract: Embodiments described herein relate to encapsulated nanostructured optical devices and methods of encapsulating gratings of such devices by asymmetric selective physical vapor deposition (PVD). In some embodiments, a method for encapsulating optical device gratings includes a first PVD process and a second PVD process that may be carried out simultaneously or sequentially. The first PVD process may provide a first stream of material at a first angle non-perpendicular to a substrate of the grating. The second PVD process may provide a second stream of material at a second angle non-perpendicular to the substrate of the grating. The combination of the first PVD process and the second PVD process forms an encapsulation layer over the grating and one or more air gaps between adjacent fins of the grating.

Abstract: The present disclosure generally relates to methods of forming optical devices comprising nanostructures disposed on transparent substrates. A first process of forming the nanostructures comprises depositing a first layer of a first material on a glass substrate, forming one or more trenches in the first layer, and depositing a second layer of a second material in the one or more holes to trenches a first alternating layer of alternating first portions of the first material and second portions of the second material. The first process is repeated one or more times to form additional alternating layers over the first alternating layer. Each first portion of each alternating layer is disposed in contact with and offset a distance from an adjacent first portion in adjacent alternating layers. A second process comprises removing either the first or the second portions from each alternating layer to form the plurality of nanostructures.

Abstract: Embodiments of the present disclosure generally relate to methods of modifying and engineering the effective thickness of an optical device substrate. The methods provide for depositing a material that is index-matched to the substrate to alter a thickness distribution of the optical device. By adjusting the thickness distribution, the optical path of light is modulated to direct the light to the output coupling grating.

Abstract: Example movement track generation methods and apparatus are described. In one example method, a server receives a first message sent by a first home device, and the first message indicates that the first device enters or leaves a wireless local area network (WLAN) coverage of the first home device. The server receives a second message sent by a second home device, and the second message indicates that the first device enters or leaves a WLAN coverage of the second home device. The server generates a movement track of the first device based on the first message and the second message, and the movement track of the first device includes location coordinates of the first home device and location coordinates of the second home device.

Abstract: A method of processing an optical device is provided, including: positioning an optical device on a substrate support in an interior volume of a process chamber, the optical device including an optical device substrate and a plurality of optical device structures formed over the optical device substrate, each optical device structure including a bulk region formed of silicon carbide and one or more surface regions formed of silicon oxycarbide. The method further includes providing one or more process gases to the interior volume of the process chamber, and generating a plasma of the one or more process gases in the interior volume for a first time period when the optical device is on the substrate support, and stopping the plasma after the first time period. A carbon content of the one or more surface regions of each optical device structure is reduced by at least 50% by the plasma.

Abstract: A method of optical device metrology is provided. The method includes providing a first type of light into a first optical device during a first time period; measuring a quantity of the first type of light transmitted from a first location on the top surface or the bottom surface during the first time period; coating at least a portion of an edge of the one or more edges with a first coating of optically absorbent material during a second time period that occurs after the first time period; providing the first type of light into the first optical device during a third time period that occurs after the second time period; and measuring a quantity of the first type of light transmitted from the first location on the top surface or the bottom surface during the third time period.

Abstract: Embodiments described herein provide for a measurement system having an aperture filtering component and methods of utilizing the measurement system. The measurement system described herein includes a measurement arm and a stage. The measurement arm projects a light beam to a top surface of an optical device structure. Multi-reflection beams resulting from reflections and diffraction off other surfaces of a non-opaque substrate leads to interference. The measurement arm includes an aperture (e.g., an aperture filtering component) that filters the multi-reflection beams from being relayed to the detector. As such, only images of the light beam are relayed to the detector.

Abstract: The present disclosure generally relates to methods of forming optical devices comprising nanostructures disposed on transparent substrates. A first process of forming the nanostructures comprises depositing a first layer of a first material on a glass substrate, forming one or more trenches in the first layer, and depositing a second layer of a second material in the one or more holes to trenches a first alternating layer of alternating first portions of the first material and second portions of the second material. The first process is repeated one or more times to form additional alternating layers over the first alternating layer. Each first portion of each alternating layer is disposed in contact with and offset a distance from an adjacent first portion in adjacent alternating layers. A second process comprises removing either the first or the second portions from each alternating layer to form the plurality of nanostructures.

Abstract: Embodiments of the present disclosure relate to optical devices for augmented, virtual, and/or mixed reality applications. In one or more embodiments, an optical device metrology system is configured to measure a plurality of see-through metrics for optical devices.