Patents by Inventor Jinyan Zhao

Jinyan Zhao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210346990
    Abstract: A workpiece processing method includes a protective film forming step of coating an upper surface of a wafer with a protective film including a water-soluble resin, a laser processing step of applying a laser beam of such a wavelength as to be absorbed in the wafer to the upper surface to subject the wafer to ablation, and a cleaning step of removing the protective film from the upper surface of the wafer together with debris generated in the laser processing step. The cleaning step includes a first cleaning sub-step of spinning a spinner table holding the wafer and supplying a cleaning fluid to the upper surface of the wafer and a second cleaning sub-step of supplying a mixed fluid of gas and the cleaning fluid to the upper surface of the wafer held by the spinning spinner table, to clean the wafer.
    Type: Application
    Filed: April 19, 2021
    Publication date: November 11, 2021
    Inventors: Jinyan ZHAO, Shigenori HARADA, Takashi OKAMURA
  • Patent number: 11158541
    Abstract: A method of processing a wafer with a metal film to divide the wafer into individual device chips along a grid of projected dicing lines where the mechanical strength of the wafer is reduced. The method includes the steps of sticking a holding tape to a face side of the wafer, holding the wafer while a reverse side of the wafer with the metal film thereon is being exposed, and drawing the wafer under suction along the projected dicing lines to fracture the wafer along the projected dicing lines while the reverse side of the wafer is being cooled in its entirety.
    Type: Grant
    Filed: April 18, 2019
    Date of Patent: October 26, 2021
    Assignee: DISCO CORPORATION
    Inventor: Jinyan Zhao
  • Publication number: 20210066111
    Abstract: A processing method for a wafer includes the steps of forming a frame unit having a ring-shaped frame, providing a resin sheet, fixing the resin sheet, which covers the wafer at its front side, at its outer peripheral edge, on the ring-shaped frame, forming through-holes in the resin sheet, holding the frame unit on a side of the resin sheet under suction on a holding surface to fix the ring-shaped frame, applying a laser beam to the wafer to form modified layers inside the wafer, and separating the resin sheet. In the holding step, the adhesive tape is suctioned under a negative pressure acting from the holding surface via through-holes while the front side of the wafer is prevented by the resin sheet from being suctioned on the holding surface.
    Type: Application
    Filed: August 27, 2020
    Publication date: March 4, 2021
    Inventor: Jinyan ZHAO
  • Publication number: 20210028063
    Abstract: An expanding method includes a frame securing step of securing an annular frame of a workpiece unit with frame securing means, an expanding step of, after the frame securing step, pressing a portion of an expandable sheet that lies between an outer circumferential edge of the workpiece and an inner circumferential edge of the annular frame, with an expanding drum to expand the expandable sheet, and a heating step of, after the expanding step, heating and shrinking a slackening portion of the expandable sheet which has been formed by expansion of the expandable sheet. The heating step includes a fully circumferential heating step of heating a full outer circumferential portion of the workpiece and an additional heating step of additionally heating a local area of the full outer circumferential portion of the workpiece.
    Type: Application
    Filed: July 8, 2020
    Publication date: January 28, 2021
    Inventors: Jinyan ZHAO, Takayuki MASADA
  • Publication number: 20210013102
    Abstract: A workpiece processing method includes holding a workpiece unit on a holding table and forming a division start point. The workpiece unit has a workpiece having a front side and a back side, and an additional member formed on the back side of the workpiece. The additional member is different in material from the workpiece. The workpiece unit is held on the holding table with the additional member opposed to the holding table. The division start point is formed by applying a laser beam to the front side of the workpiece with the focal point of the laser beam set inside the workpiece. The laser beam forms a modified layer inside the workpiece and simultaneously forming a division start point inside the additional member due to the leakage of the laser beam from the focal point toward the back side of the workpiece.
    Type: Application
    Filed: July 1, 2020
    Publication date: January 14, 2021
    Inventors: Jinyan ZHAO, Yoshiaki YODO
  • Patent number: 10879122
    Abstract: A wafer processing method includes: a wafer providing step of providing a wafer by placing a thermoplastic polymer sheet on an upper surface of a substrate on which the wafer is supported and positioning a back surface of the wafer on an upper surface of the polymer sheet; a sheet thermocompression bonding step of evacuating an enclosing environment in which the wafer is provided through the polymer sheet on the substrate, heating the polymer sheet, and pressing the wafer toward the polymer sheet to pressure-bond the wafer through the polymer sheet to the substrate; and a dividing step of positioning a cutting blade on the front surface of the wafer and cutting the wafer along the division lines to divide the wafer into individual device chips.
    Type: Grant
    Filed: July 17, 2019
    Date of Patent: December 29, 2020
    Assignee: DISCO CORPORATION
    Inventors: Shigenori Harada, Takashi Okamura, Jinyan Zhao
  • Publication number: 20200399090
    Abstract: A tape attaching method for attaching a tape to a workpiece includes a placing step of placing the workpiece with respect to the tape, which has a base material and an adhesive layer on the base material, in such a manner that the adhesive layer is in contact with an attached face of the workpiece, and a close contact step of causing, after the placing step is performed, a ball to roll in contact with the base material of the tape, thereby to bring the tape in close contact with the workpiece.
    Type: Application
    Filed: June 11, 2020
    Publication date: December 24, 2020
    Inventors: Jinyan ZHAO, Shigenori HARADA
  • Publication number: 20200343095
    Abstract: A stacked wafer processing method for processing one wafer of a stacked wafer having at least two layers laminated, includes a sheet laying step of laying a thermocompression bonding sheet on an upper face of the one wafer, a thermocompression bonding step of thermocompression-bonding the thermocompression bonding sheet to an outer peripheral portion of the one wafer where a chamfered portion is formed, a modified layer forming step of irradiating the stacked wafer with a laser beam having a transmission wavelength to the thermocompression bonding sheet and the one wafer from the thermocompression bonding sheet side with a focal point of the laser beam positioned inside the outer peripheral portion of the one wafer, thereby continuously forming a modified layer inside the one wafer, and a chamfered portion removing step of expanding the thermocompression bonding sheet to break the chamfered portion, thereby removing the chamfered portion from the one wafer.
    Type: Application
    Filed: April 23, 2020
    Publication date: October 29, 2020
    Inventors: Shigenori HARADA, Yoshiaki YODO, Koji WATANABE, Jinyan ZHAO
  • Patent number: 10804154
    Abstract: A wafer processing method includes a grouping step of dividing a wafer along division lines demarcating a plurality of devices as one block on the wafer to form a plurality of group pieces, a reattaching step of attaching one of the group pieces to an expansion tape, a modified layer forming step of emitting a laser beam having a wavelength transmittable through the wafer along the division lines for each group piece to form modified layers, a dividing step of expanding the expansion tape, and dividing each of the group pieces in which the modified layers are formed into individual devices.
    Type: Grant
    Filed: March 1, 2019
    Date of Patent: October 13, 2020
    Assignee: DISCO CORPORATION
    Inventor: Jinyan Zhao
  • Publication number: 20200035559
    Abstract: A wafer processing method includes: a wafer providing step of providing a wafer by placing a thermoplastic polymer sheet on an upper surface of a substrate on which the wafer is supported and positioning a back surface of the wafer on an upper surface of the polymer sheet; a sheet thermocompression bonding step of evacuating an enclosing environment in which the wafer is provided through the polymer sheet on the substrate, heating the polymer sheet, and pressing the wafer toward the polymer sheet to pressure-bond the wafer through the polymer sheet to the substrate; and a dividing step of positioning a cutting blade on the front surface of the wafer and cutting the wafer along the division lines to divide the wafer into individual device chips.
    Type: Application
    Filed: July 17, 2019
    Publication date: January 30, 2020
    Inventors: Shigenori HARADA, Takashi OKAMURA, Jinyan ZHAO
  • Publication number: 20190393089
    Abstract: A wafer processing method includes a sheet bonding step of placing a polyolefin or polyester sheet on a front side of a wafer having a device area where devices are formed so as to be separated by division lines, the sheet having a size capable of covering the device area, and next performing thermocompression bonding to bond the sheet to the front side of the wafer, thereby protecting the front side of the wafer with the sheet. The method further includes a test element group (TEG) cutting step of applying a first laser beam through the sheet to the wafer along each division line thereby cutting a TEG formed on each division line, and a modified layer forming step of applying a second laser beam to a back side of the wafer along each division line, the second laser beam having a transmission wavelength to the wafer, thereby forming a modified layer inside the wafer along each division line.
    Type: Application
    Filed: June 19, 2019
    Publication date: December 26, 2019
    Inventor: Jinyan ZHAO
  • Patent number: 10515840
    Abstract: An expanding method for expanding an expandable sheet is provided. A wafer is attached to a central portion of the expandable sheet and an annular frame is attached to a peripheral portion of the expandable sheet. The expanding method includes an annular frame holding step of holding the annular frame by using a holding unit, an expanding step of pushing the expandable sheet by using a pushing unit, thereby expanding the expandable sheet, a suction holding step of holding the wafer through the expandable sheet on a holding table under suction, and a push force removing step of removing a push force applied from the pushing unit to the expandable sheet. A minute projection for preventing the shrinkage of the expandable sheet is formed on the holding table along the outer circumference thereof.
    Type: Grant
    Filed: May 31, 2018
    Date of Patent: December 24, 2019
    Assignee: DISCO CORPORATION
    Inventors: Jinyan Zhao, Yoshiaki Yodo
  • Patent number: 10468255
    Abstract: A processing method for performing laser processing on a wafer includes: a reflected light detecting step of irradiating the wafer with light for state detection along a plurality of planned dividing lines, and detecting reflected light of the light from an upper surface of the wafer; a region setting step of setting a first region and a second region to the planned dividing lines based on the reflected light; a first laser processing step of performing laser processing on the first region under a first laser processing condition; and a second laser processing step of performing laser processing on the second region under a second laser processing condition.
    Type: Grant
    Filed: September 17, 2018
    Date of Patent: November 5, 2019
    Assignee: DISCO CORPORATION
    Inventor: Jinyan Zhao
  • Publication number: 20190326174
    Abstract: A method of processing a wafer with a metal film to divide the wafer into individual device chips along a grid of projected dicing lines where the mechanical strength of the wafer is reduced. The method includes the steps of sticking a holding tape to a face side of the wafer, holding the wafer while a reverse side of the wafer with the metal film thereon is being exposed, and drawing the wafer under suction along the projected dicing lines to fracture the wafer along the projected dicing lines while the reverse side of the wafer is being cooled in its entirety.
    Type: Application
    Filed: April 18, 2019
    Publication date: October 24, 2019
    Inventor: Jinyan ZHAO
  • Publication number: 20190279903
    Abstract: A wafer processing method includes a grouping step of dividing a wafer along division lines demarcating a plurality of devices as one block on the wafer to form a plurality of group pieces, a reattaching step of attaching one of the group pieces to an expansion tape, a modified layer forming step of emitting a laser beam having a wavelength transmittable through the wafer along the division lines for each group piece to form modified layers, a dividing step of expanding the expansion tape, and dividing each of the group pieces in which the modified layers are formed into individual devices.
    Type: Application
    Filed: March 1, 2019
    Publication date: September 12, 2019
    Inventor: Jinyan ZHAO
  • Publication number: 20190096676
    Abstract: A processing method for performing laser processing on a wafer includes: a reflected light detecting step of irradiating the wafer with light for state detection along a plurality of planned dividing lines, and detecting reflected light of the light from an upper surface of the wafer; a region setting step of setting a first region and a second region to the planned dividing lines based on the reflected light; a first laser processing step of performing laser processing on the first region under a first laser processing condition; and a second laser processing step of performing laser processing on the second region under a second laser processing condition.
    Type: Application
    Filed: September 17, 2018
    Publication date: March 28, 2019
    Inventor: Jinyan Zhao
  • Publication number: 20180350651
    Abstract: An expanding method for expanding an expandable sheet is provided. A wafer is attached to a central portion of the expandable sheet and an annular frame is attached to a peripheral portion of the expandable sheet. The expanding method includes an annular frame holding step of holding the annular frame by using a holding unit, an expanding step of pushing the expandable sheet by using a pushing unit, thereby expanding the expandable sheet, a suction holding step of holding the wafer through the expandable sheet on a holding table under suction, and a push force removing step of removing a push force applied from the pushing unit to the expandable sheet. A minute projection for preventing the shrinkage of the expandable sheet is formed on the holding table along the outer circumference thereof.
    Type: Application
    Filed: May 31, 2018
    Publication date: December 6, 2018
    Inventors: Jinyan Zhao, Yoshiaki Yodo
  • Publication number: 20180158675
    Abstract: A method of cleaning an object that includes a plurality of chips divided individually, starting from modified layers, and integral with a holding member, includes the steps of placing the object in a cleaning tank filled with a cleaning liquid which contains a surface active agent, and cleaning away modified layer debris on side faces of the chips with ultrasonic waves generated by ultrasonic oscillating means.
    Type: Application
    Filed: February 6, 2018
    Publication date: June 7, 2018
    Inventor: Jinyan Zhao
  • Publication number: 20170154768
    Abstract: A method of cleaning an object that includes a plurality of chips divided individually, starting from modified layers, and integral with a holding member, includes the steps of placing the object in a cleaning tank filled with a cleaning liquid which contains a surface active agent, and cleaning away modified layer debris on side faces of the chips with ultrasonic waves generated by ultrasonic oscillating means.
    Type: Application
    Filed: November 21, 2016
    Publication date: June 1, 2017
    Inventor: Jinyan Zhao
  • Patent number: 8753923
    Abstract: A wafer processing method of dividing a wafer along streets. The wafer processing method includes a protective tape attaching step of attaching a protective tape to the front side of the wafer, a modified layer forming step of holding the wafer through the protective tape on a chuck table of a laser processing apparatus under suction and next applying a laser beam having a transmission wavelength to the wafer from the back side of the wafer along the streets, thereby forming a modified layer inside the wafer along each street, and a wafer dividing step of canceling suction holding of the wafer by the chuck table and next applying an air pressure to the wafer now placed on the holding surface in the condition where horizontal movement of the wafer is limited, thereby dividing the wafer along each street where the modified layer is formed, thus obtaining individual devices.
    Type: Grant
    Filed: March 7, 2013
    Date of Patent: June 17, 2014
    Assignee: Disco Corporation
    Inventors: Satoshi Kobayashi, Jinyan Zhao