Patents by Inventor Jinyang WANG

Jinyang WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240113265
    Abstract: A display panel and a splicing panel are provided. A driving substrate includes a second surface, and the second surface is a side surface of a driving substrate. A second encapsulation structure includes at least one coating layer and at least one adhesive layer. One of the coating layer and the adhesive layer directly covers the second surface of the driving substrate. In a vertical direction of the second surface of the driving substrate, the coating layer and the adhesive layer are alternately arranged, and both the coating layer and the adhesive layer are organic layers. The coating layer and the adhesive layer using organic materials can, flatten a roughness of the second surface, so as to improve an integrity of the coating layer and the adhesive layer, thereby improving an encapsulation performance.
    Type: Application
    Filed: November 23, 2022
    Publication date: April 4, 2024
    Applicant: TCL China Star Optoelectronics Technology Co., Ltd.
    Inventors: Chunge YUAN, Kaijun WANG, Linshuang LI, Jinyang WANG, Lixuan CHEN
  • Publication number: 20230088720
    Abstract: A message processing method can help protect confidential information, or other information that one desires not to disclose, from being disclosed, spread, or leaked, and improve the security of such protected information. A chat interface comprising at least one chat message is displayed. A target operation instruction is received that indicates a target operation that is to be executed on a target chat message. The target operation is executed in response to the target operation instruction. Protection processing on the protected content is performed when the target chat message includes a protected content, thereby protecting the information from being further disclosed and improving security of the information.
    Type: Application
    Filed: November 21, 2022
    Publication date: March 23, 2023
    Applicant: Tencent Technology (Shenzhen) Company Limited
    Inventors: Liyun WANG, Rui HAN, Renjun ZHENG, Tingting LI, Jinyang WANG